-
公开(公告)号：US20170142856A1
公开(公告)日：2017-05-18
申请号：US14943385
申请日：2015-11-17
申请人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA
发明人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA
IPC分类号： H05K7/14
CPC分类号： H05K7/1404 , H05K7/1425
摘要： A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.
-
公开(公告)号：US20190082551A1
公开(公告)日：2019-03-14
申请号：US16178259
申请日：2018-11-01
申请人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA
发明人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA
IPC分类号： H05K7/14
CPC分类号： H05K7/1404 , H05K7/1425 , H05K7/20
摘要： A method of maintaining a circuit card in a card rack and a circuit card rack system are disclosed. A card rack including a laterally oriented clamping slot is provided. The clamping slot is at least partially formed from a temperature-contractible material. A circuit card having a clamped side region is provided. At least a portion of the clamped side region is inserted into the clamping slot. A predetermined temperature differential is applied to the clamping slot to reduce a longitudinal dimension of at least a portion of the clamping slot. A compressive force is exerted on the portion of the clamped side region which is located longitudinally within the clamping slot, via thermal expansion of the clamping slot.
-
公开(公告)号：US20170142820A1
公开(公告)日：2017-05-18
申请号：US14943337
申请日：2015-11-17
申请人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
发明人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , H. CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
CPC分类号： H05K1/0204 , H01L23/445 , H05K1/00 , H05K5/0213 , H05K13/00
摘要： An apparatus for, and method of, providing a desired temperature-differential circuit card environment includes a plurality of card units. Each card unit comprises a first thermal plate having front and back first plate sides oriented in a lateral-longitudinal plane, the first thermal plate operating at a first plate temperature. A second thermal plate has front and back second plate sides oriented in the lateral-longitudinal plane, the second thermal plate operating at a second plate temperature. A coupler is oriented in the lateral-longitudinal plane and is connected to front and/or back first plate sides and to the front and/or back second plate sides to form a card unit. The card units are arranged in a transversely oriented stack with the front first and second plate sides of a second card unit being directly transversely adjacent the back first and second plate sides of the first card unit.
-
公开(公告)号：US20190279916A1
公开(公告)日：2019-09-12
申请号：US15916019
申请日：2018-03-08
申请人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , HARLAN CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
发明人： MARTIN BROKNER CHRISTIANSEN , LEONARD GEORGE CHOROSINSKI , HARLAN CRAIG HEFFNER , STANLEY KATSUYOSHI WAKAMIYA , KEITH R. KIRKWOOD
摘要： An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.
-
-
-
搜索结果
4 条记录 (耗时 0.019 秒)
