摘要:
A method of aligning a lens assembly to a focal plane array is provided. The method may comprise the steps of providing an upper cold shield which holds the lens assembly, providing a lower cold shield for holding the focal plane array, mounting the upper cold shield onto the lower cold shield, lowering the temperature of the upper and lower cold shield to a cryogenic level, translating the upper cold shield with respect to the lower cold shield until the lens assembly is aligned to the focal plane array while the upper and lower cold shields are at the cryogenic temperature levels, and fixing the upper cold shield to the lower cold shield while the upper and lower cold shields are maintained at cryogenic levels.
摘要:
There is disclosed cooling apparatus for cooling a sample or sensor to the neighborhood of the boiling temperature of a liquefied gas by transporting the gas. The cooling apparatus can be run stably such that piping or needle valve acting as a medium for transporting the liquefied gas is not clogged up. The apparatus is so constructed that a gas collection port is installed in a transfer tube and that gas produced by evaporation of the liquefied gas is collected and used as a coolant for a cooling head.
摘要:
A microelectronic system includes a substrate that is preferably silicon and a microelectronic device supported on the substrate. The microelectronic device may be a light sensor that include a readout integrated circuit formed in the silicon substrate, and a light detector supported on and electrically interconnected with the readout integrated circuit. A cryocooler formed in and integral with the substrate includes a gas inflow channel formed in the substrate, an expansion nozzle formed in the substrate and receiving a gas flow from the gas inflow channel, and a gas outflow channel that receives the gas flow from the outlet of the expansion nozzle. The gas inflow channel and the gas outflow channel may be countercurrent spirals.
摘要:
A microelectronic system includes a substrate that is preferably silicon and a microelectronic device supported on the substrate. The microelectronic device may be a light sensor that include a readout integrated circuit formed in the silicon substrate, and a light detector supported on and electrically interconnected with the readout integrated circuit. A cryocooler formed in and integral with the substrate includes a gas inflow channel formed in the substrate, an expansion nozzle formed in the substrate and receiving a gas flow from the gas inflow channel, and a gas outflow channel that receives the gas flow from the outlet of the expansion nozzle. The gas inflow channel and the gas outflow channel may be countercurrent spirals.
摘要:
A number of electronic modules 82, 82′, 83, 83′ are mounted on a cold finger 100 disposed within a sealed housing 104, 110, the interior 210 of which is evacuated. To minimize heat transfer by conduction, gaps are provided in the dielectric substrates carrying the input and output transmission lines providing signal paths between the modules and electrical connectors on the exterior sidewalls 106, 108 of the housing. The gaps are bridged by thin conductive wires, thereby providing low electrical, but high thermal, impedance at the gaps. A number of module assemblies may be stacked on a single cold finger. To allow modules to be adjusted under actual operating conditions, a cover having a number of spring-loaded screwdrivers extending through vacuum tight seals and aligned with adjustable components of the modules, may be temporarily substituted for the enclosure lid 110. The springs urge the screwdrivers out of engagement when no adjustment is being made to minimize heat transfer.
摘要:
Methods and apparatus for cooling systems for cryogenic power conversion electronics are provided. The invention includes systems having electronic power conversion apparatus comprising at least one cryogenically operated semiconductor switch and at least one cryogenically operated capacitor and cooling means for cryogenically cooling the at least one cryogenically operated semiconductor switch and the at least one cryogenically operated capacitor to a temperature between 90K to 236K. The systems can also include input/output means for supplying power to said power conversion apparatus and receiving power from said power conversion apparatus. In alternative embodiments, liquid cryogens can be used in heat exchange systems in conjunction with refrigeration cold heads or heat pipes. In these embodiments, the cryogen can be recondensed if boiled.
摘要:
A method for deflecting a fluid supply using a skirt. The skirt comprising a remote and a close portion (with respect to distance from a fluid impinged surface). The skirt is located in close proximity to a surface to be impinged by the fluid. The deflection method is especially suited for use in conjunction with a Joule-Thomson cryostat and can also be used in conjunction with more than one cryostat for cooling of electronic devices. The remote portion of the skirt is disposed around the nozzle or nozzles of the fluid supply so that each fluid supply (or nozzle) extends through a hole in the remote portion of the skirt. The interior surface of the close portion of the skirt extends closer to the fluid impinged surface than each nozzle. The method efficiently wets the impinged surface with a fluid providing a measure of control over the outward velocity of the fluid as it progresses along the fluid impinged surface.
摘要:
A device and method for cryogenic cooling of electronic components. A mixture of a first non-condensible gas and a second condensible gas is provided within an insulative housing. The non-condensible gas mixture has a partial pressure equal to the desired saturation pressure of the condensible gas. The insulative housing also includes an immersion chamber for housing electronic components. The immersion chamber preferably comprises two retainer parts and provides an module retainer top and a lower coldplate retainer bottom. The module retainer top allows gas to pass through the module retainer portion freely. The condensible gas is then turned into liquid form by a provided condensing means. The condensed liquid thus forms and collects inside the immersion chamber against the coldplate retainer bottom to cool the electronic components placed within. The non-condensible gas permits the condensed liquid to be subcooled.
摘要:
A microminiature Stirling cycle engine or cooler is formed utilizing semiconductor, planar processing techniques. Such a Stirling cycle thermomechanical transducer has silicon end plates and an intermediate regenerator. The end plates are formed with diaphragms and backspaces, one end plate forming the expansion end and the opposite end plate forming the compression end, with the regenerator bonded in between. A control circuit apparatus is linked to the diaphragms for controlling the amplitude, phase and frequency of their deflections. The control circuit apparatus is adapted to operate the transducer above 500 Hz and the passages and the workspace, including those within the regenerator, expansion space and compression space, are sufficiently narrow to provide a characteristic Wolmersley number, which is characteristic of the irreversibilities generated by the oscillating flow of the working fluid in the workspace, below substantially 5 at the operating frequency above 500 Hz. Additionally, the amplitude of the vibrations of the diaphragm vibrations are sufficiently small to provide the working fluid a maximum Mach number below substantially 0.1 at an operating frequency above 500 Hz.
摘要:
A system provides for convective transferring of material between a workpiece and a flowing fluid which chemically reacts with the workpiece. A gap is formed between the workpiece and a facesheet. The fluid is fed to supply nozzles, travels a short distance within the gap adjacent to the facesheet and exits via return nozzles. The flow cross section and flow density facilitate convective transfer at a moderate flow rate and low fluid pressure. The system is also applicable for chemical transfer such as plating or etching printed circuit boards.