公开(公告)号：US20240304534A1

公开(公告)日：2024-09-12

申请号：US18594573

申请日：2024-03-04

Applicant: MEDIATEK INC.

Inventor： Shu-Wei HSIAO ,  Chung-Fa LEE

IPC: H01L23/498 ,  H01L23/00 ,  H05K1/11 ,  H05K3/46

CPC classification number: H01L23/49822 ,  H01L24/32 ,  H05K1/112 ,  H05K3/4644 ,  H01L2224/32225 ,  H01L2924/1207 ,  H05K2201/095

Abstract: A substrate structure and a package assembly with the substrate structure are provided. The substrate structure includes a first trace, a second trace, a first through-hole via (THV), a second THV formed in a build-up layer and a bridge trace. The first trace includes a first pad portion and a second pad portion separated from the first pad portion and arranged near a corner of the first pad portion. The first THV passes through the first pad portion and the second THV passes through the second pad portion. The first bridge trace formed in the substrate structure and thermally connected to the second THV and the first THV.

公开(公告)号：US20140238729A1

公开(公告)日：2014-08-28

申请号：US13777369

申请日：2013-02-26

Applicant: MEDIATEK INC.

Inventor： Shu-Wei HSIAO ,  Hsiao-Ting HUANG

IPC: H05K1/02

CPC classification number: H05K1/0209 ,  H05K1/0206 ,  H05K2201/09609 ,  H05K2201/09781 ,  H05K2201/0979 ,  H05K2201/10727 ,  H05K2201/10969

Abstract: A printed circuit board (PCB) structure with a heat dissipation function is provided, including: a package substrate; a landing pad formed over a portion of the package substrate from a first surface thereof, wherein the landing pad has a rectangular configuration and has a plurality of corners; a plurality of ground traces formed over various portions of the package substrate, physically connecting to the bond pad from at least two of the corners thereof, respectively; a first through hole formed through the landing pad and the package substrate from substantially a center portion of the bonding pad; and a plurality of second through holes formed through the landing pad and the package substrate from substantially one of the corners of the bonding pad, wherein the second through holes are adjacent to the ground traces, respectively.

Abstract translation: 提供具有散热功能的印刷电路板（PCB）结构，包括：封装基板; 从所述封装基板的第一表面形成在所述封装基板的一部分上的着陆焊盘，其中所述着陆焊盘具有矩形构造并且具有多个拐角; 形成在所述封装衬底的各个部分上的多个接地迹线，分别从其至少两个角部物理连接到所述接合焊盘; 从接合焊盘的大致中心部分穿过着陆焊盘和封装衬底形成的第一通孔; 以及多个第二通孔，其通过所述着陆焊盘和所述封装基板从所述接合焊盘的大致角部形成，其中所述第二通孔分别与所述接地迹线相邻。