公开(公告)号：US20230125975A1

公开(公告)日：2023-04-27

申请号：US17509233

申请日：2021-10-25

Applicant: Mellanox Technologies Ltd.

Inventor： Alon Rokach ,  Ayal Shabtay ,  David Fischer ,  Nimer Hazin ,  Jamal Mousa

IPC: H05K7/20 ,  H05K1/02 ,  H05K13/04

Abstract: A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

公开(公告)号：US20240126028A1

公开(公告)日：2024-04-18

申请号：US17967914

申请日：2022-10-18

Applicant: MELLANOX TECHNOLOGIES, LTD.

Inventor： Jamal Mousa ,  Aziz Mazbar ,  Nimer Hazin ,  Alon Rokach ,  Ayal Shabtay ,  Yuval Ullman

IPC: G02B6/42 ,  H04B10/40

CPC classification number: G02B6/4269 ,  G02B6/4236 ,  H04B10/40

Abstract: A transceiver includes, (a) a communication circuit, which is configured to exchange signals between a cable and a communication unit when the transceiver is connected to the communication unit, and (b) a housing, including: (i) a first shell including a substrate having the communication circuit disposed thereon, (ii) a second shell, which is configured to connect with the first shell for encapsulating the communication circuit, the second shell has an opening facing the communication circuit, and (iii) a base plate, which is fitted in the opening and including a first surface having one or more cooling fins formed thereon, and a second surface, opposite the first surface that is facing the communication circuit, the base plate is configured to transfer heat between the communication circuit and the cooling fins.

公开(公告)号：US11809001B2

公开(公告)日：2023-11-07

申请号：US17715136

申请日：2022-04-07

Applicant: Mellanox Technologies Ltd.

Inventor： Alon Rokach ,  Nimer Hazin ,  Amit Oren ,  Michael Greenman

IPC: H04B10/00 ,  G02B6/42 ,  H01R13/717

CPC classification number: G02B6/426 ,  G02B6/428 ,  G02B6/4251 ,  H01R13/7172

Abstract: A device may include a frame, an optical connector coupled to an external surface of the frame, and an optical fiber comprising a bent section positioned external to an interior of the frame and connected to the optical connector.

公开(公告)号：US11609390B2

公开(公告)日：2023-03-21

申请号：US17162471

申请日：2021-01-29

Applicant: Mellanox Technologies, Ltd.

Inventor： Nimer Khazen ,  Alon Rokach

IPC: G02B6/40 ,  G02B6/38

Abstract: Optical splitting adaptors and associated methods of manufacturing are provided. An example optical splitting adaptor includes a first connector housing that interfaces with a first optical transceiver having a first data rate, and the first connector housing accommodates a first type multi-fiber ferrule of a first number of fibers. The example optical splitting adaptor also includes a second connector housing that defines dual receptacles for interfacing with a second optical transceiver and a third optical transceiver, and the dual receptacles receive respective multi-fiber ferrules. The example optical splitting adaptor further includes a plurality of fibers operably connecting the first connector housing and the second connector housing such that, in operation, the plurality of fibers perform optical splitting between the first type multi-fiber ferrule of the first connector housing and the multi-fiber ferrules received by the dual receptacles of the second connector housing.

公开(公告)号：US11910573B2

公开(公告)日：2024-02-20

申请号：US17509233

申请日：2021-10-25

Applicant: Mellanox Technologies Ltd.

Inventor： Alon Rokach ,  Ayal Shabtay ,  David Fischer ,  Nimer Hazin ,  Jamal Mousa

IPC: H05K7/20 ,  H05K13/04 ,  H05K1/02

CPC classification number: H05K7/205 ,  H05K1/0203 ,  H05K13/04

Abstract: A mechanical device for cooling an electronic component may include a surface including an aperture, and a first support protruding from the surface and a second support protruding from the surface. In some embodiments, the device may include disposed within the aperture a thermal interface material (TIM).

公开(公告)号：US20230137375A1

公开(公告)日：2023-05-04

申请号：US17517007

申请日：2021-11-02

Applicant: Mellanox Technologies Ltd.

Inventor： Ayal SHABTAY ,  Alon Rokach ,  Bar Noyman ,  Jamal Mousa ,  Nimer Hazin ,  Rom Becker

IPC: H05K7/20 ,  H01R13/66

Abstract: A network interface device may include: a frame having: a first frame end, a second frame end, a top frame surface, a bottom frame surface, a first lateral frame surface and a second lateral frame surface, wherein the top frame surface includes a longitudinal frame indent extending along a portion of the top frame surface and between the first lateral frame surface and the second lateral frame surface; and heat dissipating members protruding from the longitudinal frame indent of the top frame surface.