UNIVERSAL HOUSING FOR PLUGGABLE NETWORK INTERFACE DEVICES

    公开(公告)号:US20250096509A1

    公开(公告)日:2025-03-20

    申请号:US18370748

    申请日:2023-09-20

    Abstract: A pluggable network interface device includes a printed circuit board (“PCB”) and a housing configured to receive a heat transfer plate selected from a set of swappable heat transfer plates. An upper surface of the housing includes a set of modular plate receiving features. When in an assembled state, the upper surface of the housing is attached via the set of modular plate receiving features to one heat transfer plate of a set of heat transfer plates. The overall height of the pluggable network interface module in the assembled state is greater than a first assembly height dimension measured from a base surface of the housing to the upper surface of the housing. The set of modular plate receiving features are configured to engage with any heat transfer plate in the set of swappable heat transfer plates that are associated with different module types.

    Mechanical thermal interface for improved heat dissipation in network transceivers

    公开(公告)号:US20240126028A1

    公开(公告)日:2024-04-18

    申请号:US17967914

    申请日:2022-10-18

    CPC classification number: G02B6/4269 G02B6/4236 H04B10/40

    Abstract: A transceiver includes, (a) a communication circuit, which is configured to exchange signals between a cable and a communication unit when the transceiver is connected to the communication unit, and (b) a housing, including: (i) a first shell including a substrate having the communication circuit disposed thereon, (ii) a second shell, which is configured to connect with the first shell for encapsulating the communication circuit, the second shell has an opening facing the communication circuit, and (iii) a base plate, which is fitted in the opening and including a first surface having one or more cooling fins formed thereon, and a second surface, opposite the first surface that is facing the communication circuit, the base plate is configured to transfer heat between the communication circuit and the cooling fins.

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