公开(公告)号：US11721385B2

公开(公告)日：2023-08-08

申请号：US17400886

申请日：2021-08-12

Applicant: Micron Technology, Inc.

Inventor： Anthony D. Veches ,  Brian P. Callaway

IPC: G11C11/40 ,  G11C11/4074 ,  H01L25/065 ,  H01L23/00

CPC classification number: G11C11/4074 ,  H01L24/08 ,  H01L25/0657 ,  H01L2224/08145 ,  H01L2924/1436

Abstract: Methods, systems, and devices for dynamic power distribution for stacked memory are described. A stacked memory device may include switching components that support dynamic coupling between a shared power source of the memory device and circuitry associated with operating memory arrays of respective memory dies. In some examples, such techniques include coupling a power source with array circuitry based on an access activity or a degree of access activity for the array circuitry. In some examples, such techniques include isolating a power source from array circuitry based on a lack of access activity or a degree of access activity for the array circuitry. The dynamic coupling or isolation may be supported by various signaling of the memory device, such as signaling between memory dies, signaling between a memory die and a central controller, or signaling between the memory device and a host device.

公开(公告)号：US20220319569A1

公开(公告)日：2022-10-06

申请号：US17221498

申请日：2021-04-02

Applicant: Micron Technology, Inc.

Inventor： Anthony D. Veches ,  Brian P. Callaway

IPC: G11C11/4074 ,  G06F13/16 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/525 ,  G11C11/22

Abstract: Methods, systems, and devices for power distribution for stacked memory are described. A memory die may be configured with one or more conductive paths for providing power to another memory die, where each conductive path may pass through the memory die but may be electrically isolated from circuitry for operating the memory die. Each conductive path may provide an electronic coupling between at least one of a first set of contacts of the memory die (e.g., couplable with a power source) and at least one of a second set of contacts of the memory die (e.g., couplable with another memory die). To support operations of the memory die, a contact of the first set may be coupled with circuitry for operating a memory array of the memory die, and to support operations of another memory die, another contact of the first set may be electrically isolated from the circuitry.

公开(公告)号：US20150055420A1

公开(公告)日：2015-02-26

申请号：US14010120

申请日：2013-08-26

Applicant: Micron Technology, Inc.

Inventor： Debra M. Bell ,  Jeff A. McClain ,  Brian P. Callaway

IPC: G11C11/406 ,  G11C7/10

CPC classification number: G11C11/406 ,  G11C7/1012

Abstract: Apparatuses and methods for selective row refreshes are disclosed herein. An example apparatus may include a refresh control circuit. The refresh control circuit may be configured to receive a target address associated with a target plurality of memory cells from an address bus. The refresh control circuit may further be configured to provide a proximate address to the address bus responsive, at least in part, to determining that a number of refresh operations have occurred. In some examples, a plurality of memory cells associated with the proximate address may be a plurality of memory cells adjacent the target plurality of memory cells.

公开(公告)号：US11361808B2

公开(公告)日：2022-06-14

申请号：US16160801

申请日：2018-10-15

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Debra M. Bell ,  Jeff A. McClain ,  Brian P. Callaway

IPC: G11C11/406 ,  G11C7/10

Abstract: Apparatuses and methods for selective row refreshes are disclosed herein. An example apparatus may include a refresh control circuit. The refresh control circuit may be configured to receive a target address associated with a target plurality of memory cells from an address bus. The refresh control circuit may further be configured to provide a proximate address to the address bus responsive, at least in part, to determining that a number of refresh operations have occurred. In some examples, a plurality of memory cells associated with the proximate address may be a plurality of memory cells adjacent the target plurality of memory cells.

公开(公告)号：US10930335B2

公开(公告)日：2021-02-23

申请号：US16231327

申请日：2018-12-21

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Debra M. Bell ,  Jeff A. McClain ,  Brian P. Callaway

IPC: G11C11/406 ,  G11C7/10

Abstract: Apparatuses and methods for selective row refreshes are disclosed herein. An example apparatus may include a refresh control circuit. The refresh control circuit may be configured to receive a target address associated with a target plurality of memory cells from an address bus. The refresh control circuit may further be configured to provide a proximate address to the address bus responsive, at least in part, to determining that a number of refresh operations have occurred. In some examples, a plurality of memory cells associated with the proximate address may be a plurality of memory cells adjacent the target plurality of memory cells.

公开(公告)号：US20190130961A1

公开(公告)日：2019-05-02

申请号：US16231327

申请日：2018-12-21

Applicant: MICRON TECHNOLOGY, INC.

Inventor： Debra M. Bell ,  Jeff A. McClain ,  Brian P. Callaway

IPC: G11C11/406 ,  G11C7/10

Abstract: Apparatuses and methods for selective row refreshes are disclosed herein. An example apparatus may include a refresh control circuit. The refresh control circuit may he configured to receive a target address associated with a target plurality of memory cells from an address bus. The refresh control circuit may further be configured to provide a proximate address to the address bus responsive, at least in part, to determining that a number of refresh operations have occurred. In some examples, a plurality of memory cells associated with the proximate address may be a plurality of memory cells adjacent the target plurality of memory cells.

公开(公告)号：US11532349B2

公开(公告)日：2022-12-20

申请号：US17221498

申请日：2021-04-02

Applicant: Micron Technology, Inc.

Inventor： Anthony D. Veches ,  Brian P. Callaway

IPC: G11C11/40 ,  G11C11/4074 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/525 ,  G11C11/22 ,  G06F13/16

Abstract: Methods, systems, and devices for power distribution for stacked memory are described. A memory die may be configured with one or more conductive paths for providing power to another memory die, where each conductive path may pass through the memory die but may be electrically isolated from circuitry for operating the memory die. Each conductive path may provide an electronic coupling between at least one of a first set of contacts of the memory die (e.g., couplable with a power source) and at least one of a second set of contacts of the memory die (e.g., couplable with another memory die). To support operations of the memory die, a contact of the first set may be coupled with circuitry for operating a memory array of the memory die, and to support operations of another memory die, another contact of the first set may be electrically isolated from the circuitry.

公开(公告)号：US20200227113A1

公开(公告)日：2020-07-16

申请号：US16247277

申请日：2019-01-14

Applicant: Micron Technology, Inc.

Inventor： James S. Rehmeyer ,  Debra M. Bell ,  George B. Raad ,  Brian P. Callaway ,  Joshua E. Alzheimer

IPC: G11C11/406 ,  G11C11/403 ,  G11C11/408

Abstract: A memory device may include a phase driver circuit that may output a first voltage for refreshing a plurality of memory cells. The memory device may also include a plurality of word line driver circuits that may receive the first voltage via the phase driver circuit, such that each word line driver circuit of the plurality of word line driver circuits may provide the first voltage to a respective word line associated with a respective portion of the plurality of memory cells. In addition, each word line driver circuit may refresh the respective portion of the plurality of memory cells based on a respective word line enable signal provided to a first switch of the respective word line driver circuit.

公开(公告)号：US20190051344A1

公开(公告)日：2019-02-14

申请号：US16160801

申请日：2018-10-15

Applicant: MICRON TECHNOLOGY, INC.

Inventor： DEBRA M. BELL ,  Jeff A. McClain ,  Brian P. Callaway

IPC: G11C11/406 ,  G11C7/10

Abstract: Apparatuses and methods for selective row refreshes are disclosed herein. An example apparatus may include a refresh control circuit. The refresh control circuit may be configured to receive a target address associated with a target plurality of memory cells from an address bus. The refresh control circuit may further be configured to provide a proximate address to the address bus responsive, at least in part, to determining that a number of refresh operations have occurred. In some examples, a plurality of memory cells associated with the proximate address may be a plurality of memory cells adjacent the target plurality of memory cells.

公开(公告)号：US10134461B2

公开(公告)日：2018-11-20

申请号：US14707893

申请日：2015-05-08

Applicant: Micron Technology, Inc.

Inventor： Debra M. Bell ,  Jeff A. McClain ,  Brian P. Callaway

IPC: G11C11/406 ,  G11C7/10

Abstract: Apparatuses and methods for selective row refreshes are disclosed herein. An example apparatus may include a refresh control circuit. The refresh control circuit may be configured to receive a target address associated with a target plurality of memory cells from an address bus. The refresh control circuit may further be configured to provide a proximate address to the address bus responsive, at least in part, to determining that a number of refresh operations have occurred. In some examples, a plurality of memory cells associated with the proximate address may be a plurality of memory cells adjacent the target plurality of memory cells.