公开(公告)号：US20140141566A1

公开(公告)日：2014-05-22

申请号：US14163499

申请日：2014-01-24

Applicant: MOSAID TECHNOLOGIES INCORPORATED

Inventor： Roland SCHUETZ

IPC: H01L25/00 ,  H01L23/00

CPC classification number: H01L25/50 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/92127 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.

Abstract translation: 半导体器件具有基板，该基板具有设置在其接合表面上的第一多个基板接合焊盘。 多个半导体管芯设置在基板上。 多个骰子中的每个管芯具有沿其至少一个第一边缘布置的第一多个管芯接合焊盘。 多个接合柱从衬底接合焊盘基本垂直地延伸。 每个接合柱将第一多个基板接合焊盘中的一个电连接到第一多个管芯接合焊盘中的对应的一个。 还描述了组装半导体器件的方法。