公开(公告)号：US09612615B2

公开(公告)日：2017-04-04

申请号：US13874983

申请日：2013-05-01

申请人： Megica Corporation

发明人： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Hsin-Jung Lo ,  Ping-Jung Yang ,  Te-Sheng Liu

IPC分类号： H01L21/00 ,  G06F1/16 ,  H01L21/56 ,  H01L23/48 ,  H01L23/522 ,  H01L23/00 ,  H01L25/065 ,  H01L25/18 ,  H01L23/60 ,  H01L25/00 ,  G11C5/14 ,  H01L23/31 ,  H01L25/16 ,  H01L23/66

CPC分类号： G06F1/16 ,  G11C5/147 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/60 ,  H01L23/66 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6611 ,  H01L2223/6666 ,  H01L2224/02166 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02321 ,  H01L2224/0233 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0237 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05176 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05541 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/11 ,  H01L2224/11009 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/1191 ,  H01L2224/13 ,  H01L2224/13006 ,  H01L2224/1302 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13609 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2224/48764 ,  H01L2224/48769 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/4918 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/81895 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/92127 ,  H01L2224/92147 ,  H01L2224/92225 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48869 ,  H01L2224/48744 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/0361 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L24/78 ,  H01L2224/85 ,  H01L21/56 ,  H01L21/78 ,  H01L2924/0635 ,  H01L2924/07025 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/0231

摘要： Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.

公开(公告)号：US09466557B2

公开(公告)日：2016-10-11

申请号：US14984082

申请日：2015-12-30

申请人： STMICROELECTRONICS (SHENZHEN) R&D CO., LTD.

发明人： Jing-En Luan

IPC分类号： H01L23/495 ,  H01L23/00 ,  H01L23/48 ,  H01L23/433 ,  H01L23/367 ,  H01L23/498 ,  H01L23/28 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L23/49531 ,  H01L21/56 ,  H01L21/561 ,  H01L21/76885 ,  H01L23/28 ,  H01L23/3107 ,  H01L23/3114 ,  H01L23/3675 ,  H01L23/4334 ,  H01L23/481 ,  H01L23/482 ,  H01L23/49503 ,  H01L23/49513 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49555 ,  H01L23/49568 ,  H01L23/49575 ,  H01L23/49805 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/09 ,  H01L24/16 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L2224/03003 ,  H01L2224/03334 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/04105 ,  H01L2224/0603 ,  H01L2224/06102 ,  H01L2224/06131 ,  H01L2224/06135 ,  H01L2224/06136 ,  H01L2224/06177 ,  H01L2224/09151 ,  H01L2224/12105 ,  H01L2224/16238 ,  H01L2224/32221 ,  H01L2224/32245 ,  H01L2224/45124 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48245 ,  H01L2224/48247 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81815 ,  H01L2224/85 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2224/05599 ,  H01L2224/81 ,  H01L2924/00012

摘要： An electronic device may include leads, an IC having first and second bond pads, and an encapsulation material adjacent the leads and the IC so the leads extend to a bottom surface of the encapsulation material defining first contact pads. The electronic device may include bond wires between the first bond pads and corresponding ones of the leads, and conductors extending from corresponding ones of the second bond pads to the bottom surface of the encapsulation material defining second contact pads.

公开(公告)号：US09355992B2

公开(公告)日：2016-05-31

申请号：US14450998

申请日：2014-08-04

申请人： Micron Technology, Inc.

发明人： Lee Choon Kuan ,  David J. Corisis ,  Chin Hui Chong

IPC分类号： H01L23/00 ,  H01L23/31 ,  H01L23/495 ,  H01L23/498 ,  H01L25/065 ,  H01L25/16 ,  H01L25/00 ,  H01L21/66

CPC分类号： H01L24/92 ,  H01L22/14 ,  H01L22/32 ,  H01L23/3121 ,  H01L23/49531 ,  H01L23/49861 ,  H01L24/48 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92127 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06527 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/01087 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device package includes a land grid array package. At least one semiconductor die is mounted to an interposer substrate, with bond pads of the semiconductor die connected to terminal pads on the same side of the interposer substrate as the at least one semiconductor die. Terminal pads of the interposer substrate may be electrically connected to either or both of a peripheral array pattern of lands and to a central, two-dimensional array pattern of pads, both array patterns located on the opposing side of the interposer substrate from the at least one semiconductor die. Additional components, active, passive or both, may be connected to pads of the two-dimensional array to provide a system-in-a-package. Lead fingers of a lead frame may be superimposed on the opposing side of the interposer substrate, bonded directly to the land grid array land and wire bonded to pads as desired for repair or to ease routing problems on the interposer. The land grid array package may be mounted to a carrier substrate, and the lands wire bonded to conductive pads on the carrier substrate. Methods of fabrication are also disclosed.

摘要翻译： 半导体器件封装包括焊盘栅格阵列封装。 至少一个半导体管芯安装到插入器衬底上，其中半导体管芯的接合焊盘连接到与至少一个半导体管芯在内插器衬底的同一侧上的端子焊盘。 插入器基板的端子焊盘可以电连接到焊盘的外围阵列图案中的一个或两个以及中心的二维阵列阵列图案，两个阵列图案位于至少从中间层基板的相对侧起至少 一个半导体芯片。 可以将主动，被动或两者的附加组件连接到二维阵列的焊盘以提供系统级封装。 引线框架的引脚可以叠置在插入器基板的相对侧上，直接接合到焊盘栅格阵列焊盘，并且焊接到焊盘上，以便修理或者简化插入器上的布线问题。 焊盘阵列封装可以安装到载体衬底上，焊盘引线键合到载体衬底上的导电焊盘上。 还公开了制造方法。

公开(公告)号：US20150371962A1

公开(公告)日：2015-12-24

申请号：US14734267

申请日：2015-06-09

申请人： FUJITSU LIMITED

发明人： TOSHIYA AKAMATSU

IPC分类号： H01L23/00

CPC分类号： H01L24/13 ,  H01L24/11 ,  H01L2224/0361 ,  H01L2224/10145 ,  H01L2224/10175 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/1161 ,  H01L2224/11825 ,  H01L2224/11826 ,  H01L2224/11849 ,  H01L2224/11903 ,  H01L2224/11906 ,  H01L2224/13007 ,  H01L2224/13017 ,  H01L2224/13076 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13565 ,  H01L2224/1357 ,  H01L2224/13582 ,  H01L2224/13624 ,  H01L2224/13666 ,  H01L2224/13671 ,  H01L2224/1368 ,  H01L2224/13681 ,  H01L2224/13684 ,  H01L2224/13686 ,  H01L2224/16145 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81011 ,  H01L2224/81075 ,  H01L2224/81097 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/81951 ,  H01L2224/92127 ,  H01L2224/92225 ,  H01L2924/3512 ,  H01L2924/3841 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/053

摘要： A terminal structure includes: a pillar containing a first metal material; and a cover layer covering an upper surface and a side surface of the pillar, the cover layer containing a second metal material into which a solder material diffuses more slowly than into the first metal material.And the terminal structure further includes a bonding layer over the cover layer, the bonding layer containing a metal material capable of solder bonding.

摘要翻译： 端子结构包括：包含第一金属材料的柱; 以及覆盖所述柱的上表面和侧表面的覆盖层，所述覆盖层包含第二金属材料，焊料材料比所述第一金属材料扩散更慢地扩散到所述第二金属材料中。 并且端子结构还包括覆盖层上的接合层，该接合层包含能够焊接的金属材料。

公开(公告)号：US20110298128A1

公开(公告)日：2011-12-08

申请号：US13088817

申请日：2011-04-18

申请人： Roland SCHUETZ

发明人： Roland SCHUETZ

IPC分类号： H01L23/48 ,  H01L21/58

CPC分类号： H01L25/50 ,  H01L21/4853 ,  H01L23/49811 ,  H01L24/05 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/92 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05554 ,  H01L2224/05556 ,  H01L2224/16105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49175 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/8114 ,  H01L2224/81192 ,  H01L2224/81193 ,  H01L2224/81194 ,  H01L2224/92127 ,  H01L2225/0651 ,  H01L2225/06517 ,  H01L2225/06551 ,  H01L2225/06562 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device has a substrate having a first plurality of substrate bonding pads disposed on a bonding surface thereof. A plurality of semiconductor dice is disposed on the substrate. Each die of the plurality of dice has a first plurality of die bonding pads arranged along at least one first edge thereof. A plurality of bonding pillars extends substantially vertically from the substrate bonding pads. Each bonding pillar electrically connects one of the first plurality of substrate bonding pads to a corresponding one of the first plurality of die bonding pads. A method of assembling a semiconductor device is also described.

摘要翻译： 半导体器件具有基板，该基板具有设置在其接合表面上的第一多个基板接合焊盘。 多个半导体管芯设置在基板上。 多个骰子中的每个管芯具有沿其至少一个第一边缘布置的第一多个管芯接合焊盘。 多个接合柱从衬底接合焊盘基本垂直地延伸。 每个接合柱将第一多个基板接合焊盘中的一个电连接到第一多个管芯接合焊盘中的对应的一个。 还描述了组装半导体器件的方法。

公开(公告)号：US20110020982A1

公开(公告)日：2011-01-27

申请号：US12736040

申请日：2009-03-13

申请人： Markus Wimplinger

发明人： Markus Wimplinger

IPC分类号： H01L21/56

CPC分类号： H01L24/94 ,  B62H3/04 ,  H01L21/6835 ,  H01L21/6836 ,  H01L23/3128 ,  H01L24/13 ,  H01L24/16 ,  H01L24/81 ,  H01L24/97 ,  H01L25/50 ,  H01L2221/68331 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/0557 ,  H01L2224/13009 ,  H01L2224/13025 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16235 ,  H01L2224/17181 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73207 ,  H01L2224/81005 ,  H01L2224/81075 ,  H01L2224/81805 ,  H01L2224/8182 ,  H01L2224/92127 ,  H01L2224/94 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/157 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/05552 ,  H01L2224/81

摘要： Method for bonding a plurality of chips onto a base wafer.

摘要翻译： 将多个芯片接合到基底晶片上的方法。

公开(公告)号：US20100246152A1

公开(公告)日：2010-09-30

申请号：US12722483

申请日：2010-03-11

申请人： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Hsin-Jung Lo ,  Ping-Jung Yang ,  Te-Sheng Liu

发明人： Mou-Shiung Lin ,  Jin-Yuan Lee ,  Hsin-Jung Lo ,  Ping-Jung Yang ,  Te-Sheng Liu

IPC分类号： H05K7/00

CPC分类号： G06F1/16 ,  G11C5/147 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/3171 ,  H01L23/3192 ,  H01L23/481 ,  H01L23/5223 ,  H01L23/5227 ,  H01L23/60 ,  H01L23/66 ,  H01L24/02 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/18 ,  H01L25/50 ,  H01L2223/6611 ,  H01L2223/6666 ,  H01L2224/02166 ,  H01L2224/02311 ,  H01L2224/02313 ,  H01L2224/02321 ,  H01L2224/0233 ,  H01L2224/02331 ,  H01L2224/0235 ,  H01L2224/0237 ,  H01L2224/02371 ,  H01L2224/02375 ,  H01L2224/02381 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/03912 ,  H01L2224/0392 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05024 ,  H01L2224/05027 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05171 ,  H01L2224/05176 ,  H01L2224/05181 ,  H01L2224/05187 ,  H01L2224/05541 ,  H01L2224/05548 ,  H01L2224/05554 ,  H01L2224/0556 ,  H01L2224/05567 ,  H01L2224/05572 ,  H01L2224/056 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05664 ,  H01L2224/05669 ,  H01L2224/05673 ,  H01L2224/05676 ,  H01L2224/11 ,  H01L2224/11009 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/11464 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/1191 ,  H01L2224/13 ,  H01L2224/13006 ,  H01L2224/1302 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13084 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13164 ,  H01L2224/13169 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/13311 ,  H01L2224/13609 ,  H01L2224/1403 ,  H01L2224/1411 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16245 ,  H01L2224/16265 ,  H01L2224/17181 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/293 ,  H01L2224/29339 ,  H01L2224/32105 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48111 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/48624 ,  H01L2224/48644 ,  H01L2224/48647 ,  H01L2224/48664 ,  H01L2224/48669 ,  H01L2224/48764 ,  H01L2224/48769 ,  H01L2224/48824 ,  H01L2224/48844 ,  H01L2224/48847 ,  H01L2224/48864 ,  H01L2224/4911 ,  H01L2224/49175 ,  H01L2224/4918 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/73207 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/81191 ,  H01L2224/81411 ,  H01L2224/81444 ,  H01L2224/81801 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/81895 ,  H01L2224/81903 ,  H01L2224/83101 ,  H01L2224/83104 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/9202 ,  H01L2224/92125 ,  H01L2224/92127 ,  H01L2224/92147 ,  H01L2224/92225 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06562 ,  H01L2225/06589 ,  H01L2225/1023 ,  H01L2225/1029 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01007 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01018 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01044 ,  H01L2924/01045 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01056 ,  H01L2924/01059 ,  H01L2924/01068 ,  H01L2924/01072 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/04953 ,  H01L2924/05042 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/1305 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1421 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19104 ,  H01L2924/19105 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/48869 ,  H01L2224/48744 ,  H01L2924/00012 ,  H01L2224/03 ,  H01L2224/0361 ,  H01L2924/0665 ,  H01L2224/81 ,  H01L2224/83 ,  H01L24/78 ,  H01L2224/85 ,  H01L21/56 ,  H01L21/78 ,  H01L2924/0635 ,  H01L2924/07025 ,  H01L21/304 ,  H01L21/76898 ,  H01L2224/0231

摘要： Integrated circuit chips and chip packages are disclosed that include an over-passivation scheme at a top of the integrated circuit chip and a bottom scheme at a bottom of the integrated circuit chip using a top post-passivation technology and a bottom structure technology. The integrated circuit chips can be connected to an external circuit or structure, such as ball-grid-array (BGA) substrate, printed circuit board, semiconductor chip, metal substrate, glass substrate or ceramic substrate, through the over-passivation scheme or the bottom scheme. Related fabrication techniques are described.

摘要翻译： 公开了集成电路芯片和芯片封装，其包括在集成电路芯片的顶部处的过钝化方案，以及使用顶部后钝化技术和底部结构技术的集成电路芯片的底部的底部方案。 集成电路芯片可以通过过钝化方案或者通过钝化方案连接到外部电路或结构，例如球栅阵列（BGA）衬底，印刷电路板，半导体芯片，金属衬底，玻璃衬底或陶瓷衬底 底部方案。 描述了相关的制造技术。

公开(公告)号：US20070290376A1

公开(公告)日：2007-12-20

申请号：US11589120

申请日：2006-10-30

申请人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

发明人： Sam Ziqun Zhao ,  Rezaur Rahman Khan

IPC分类号： H01L23/28

CPC分类号： H01L25/105 ,  H01L21/56 ,  H01L23/3128 ,  H01L24/10 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/91 ,  H01L2224/13 ,  H01L2224/13099 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48237 ,  H01L2224/48465 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2225/06568 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2225/1088 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/3011 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： Methods, systems, and apparatuses for integrated circuit (IC) package vertical interconnection are described herein. In an aspect of the invention, an IC package includes an IC die with contact pads. The IC package also includes interconnect members which are coupled to the die at the contact pads. An encapsulating material encapsulates the IC die and the interconnect members such that a contact surface of each interconnect member is accessible at a surface of the encapsulating material. A second IC package is coupled to the first IC package through the plurality of interconnect members of the first IC package. In an example, solder balls attached to a bottom of the second IC package are coupled to the contact surfaces of the interconnect members to couple the first IC package and the second IC package.

摘要翻译： 本文描述了用于集成电路（IC）封装垂直互连的方法，系统和装置。 在本发明的一个方面，IC封装包括具有接触焊盘的IC管芯。 IC封装还包括在接触焊盘处耦合到管芯的互连构件。 封装材料封装IC芯片和互连构件，使得每个互连构件的接触表面在封装材料的表面可访问。 第二IC封装通过第一IC封装的多个互连构件耦合到第一IC封装。 在一个示例中，附接到第二IC封装的底部的焊球耦合到互连构件的接触表面，以耦合第一IC封装和第二IC封装。

公开(公告)号：US12051685B2

公开(公告)日：2024-07-30

申请号：US16934905

申请日：2020-07-21

申请人： LUMILEDS LLC

发明人： Tze Yang Hin ,  Seng Huat Lau ,  Hideo Kageyama

IPC分类号： H01L25/00 ,  H01L23/00 ,  H01L25/16 ,  H01L25/18 ,  H01L33/48 ,  H01L33/56 ,  H01L33/62

CPC分类号： H01L25/50 ,  H01L24/73 ,  H01L24/92 ,  H01L25/167 ,  H01L25/18 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/73207 ,  H01L2224/73265 ,  H01L2224/92127

摘要： Light-emitting devices are described herein. A light-emitting device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening in the packaging substrate and conductive vias. The metal inlay is thermally coupled to the bottom surface of the hybridized device. Conductive contacts are disposed on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of conductive vias. Conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate. Each of the conductive connectors is electrically coupled to a respective one of the conductive contacts on the bottom surface of the packaging substrate by a respective on of the conductive vias.

公开(公告)号：US09721928B1

公开(公告)日：2017-08-01

申请号：US15141628

申请日：2016-04-28

申请人： FREESCALE SEMICONDUCTOR, INC.

发明人： Navas Khan Oratti Kalandar ,  Lan Chu Tan ,  Chetan Verma

IPC分类号： H01L23/48 ,  H01L25/065 ,  H01L25/00 ,  H01L23/00 ,  H01L23/31 ,  H01L21/56

CPC分类号： H01L24/81 ,  H01L23/3128 ,  H01L23/49833 ,  H01L24/13 ,  H01L24/16 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/92 ,  H01L24/97 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/131 ,  H01L2224/16227 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49052 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/92127 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/15321 ,  H01L2224/45099 ,  H01L2224/32225 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/85

摘要： A packaged IC device in which a die is sandwiched between first and second substrates such that (i) peripheral electrical contact pads of the die are wire bonded to the first substrate, e.g., for routing functional input/output signals, and (ii) core-area electrical contact pads of the die are connected to the second substrate in a flip-chip arrangement, e.g., for routing one or more power supply voltages to the core area of the die. The second substrate has a shape and position that (i) expose the peripheral electrical contact pads of the die for unencumbered machine-implemented wire bonding during the assembly process, and (ii) enable direct electrical connections between the first and second substrates outside the footprint of the die, e.g., by way of the corresponding solder bumps attached between the two substrates.