Electronic component conveyance device and method of manufacturing taping electronic component array

    公开(公告)号:US10297399B2

    公开(公告)日:2019-05-21

    申请号:US15182115

    申请日:2016-06-14

    摘要: As an electronic component conveyance device in which an electronic component is unlikely to jam in a conveyance path. A first magnetic force generation unit is provided lateral to a first sidewall in a midstream part. A second magnetic force generation unit is provided downstream of the first magnetic force generation unit and lateral to a second sidewall in the midstream part. The midstream part includes a first transition part connected with an upstream part and a second transition part connected with a downstream part. The first sidewall is parallel to a conveyance direction in the first transition part. The second sidewall extends in a direction different from the conveyance direction in the first transition part. The second sidewall is parallel to the conveyance direction in the second transition part. The first sidewall extends in a direction different from the conveyance direction in the second transition part.