摘要:
A spring probe for performing tests on an electrical device having a plunger positioned within a barrel and including a spring in the barrel adjacent the plunger to apply a spring force against the plunger. The plunger includes a contact end having an angled surface for contacting the electrical device for applying a side load to the barrel, and a slot in the contact end for dividing the spring force upon contact with the electrical device.
摘要:
A hollow plunger spring probe assembly for performing tests on an electrical device including a probe receptacle for receipt of the hollow plunger. The plunger includes a tip at one end of the plunger for contacting the electrical device and a spring positioned within the opening in the plunger between the tip and a receptacle post having a head portion extending into the plunger through a second end. The post is rigidly attached to the receptacle. The plunger includes an attachment mechanism for releasably attaching the plunger to the head portion of the post.
摘要:
A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A nonconductive pushrod is positioned between the spring and a beveled edge of the plunger and a nonconductive cap is positioned above the load board for high frequency test signals. For closely spaced test sites a thinner daughter board is electrically connected to the load board through a hole in the load board. The test socket is then positioned on the daughter board.
摘要:
A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A ball is positioned between the spring and a beveled edge of the plunger to aid in biasing the plunger. Electrically conductive cylindrical eyelets or plated through holes are positioned within the holes in the load board to guide the travel of the socket plungers and to transfer the test signals from the socket plungers to the load board.
摘要:
An external spring probe is provided having a first section and a second section which extend and compress relative to each other. The first section consists of a tip at one end and a first contact component opposite the tip. A flange extends radially outward between the tip and the first contact component. The second section consists of a tip at one end and a second contact component opposite the tip. The second contact component is in contact with the first contact component. A flange extends radially outward between the second section tip and the second contact component. A spring is sandwiched between the two flanges surrounding the two contact components. The first and second contact components remain in contact with each other during compression and extension of the two sections.
摘要:
An external spring probe is provided having a first section and a second section which extend and compress relative to each other. The first section consists of a tip at one end and a first contact component opposite the tip. A flange extends radially outward between the tip and the first contact component. The second section consists of a tip at one end and a second contact component opposite the tip. The second contact tip is in contact with the first contact tip. A flange extends radially outward between the second section tip and the second contact component. A spring is sandwiched between the two flanges surrounding the two contact components. The first and second contact components remain in contact with each other during compression and extension of the two sections.
摘要:
Integrated circuit (IC) packages mounted on a loaded printed circuit board (PCB) are tested by a translator module by first placing a corresponding module over each package. Each module has rows of spring contacts for releasably contacting corresponding electrical leads adjacent opposite sides of the IC package. An upper surface of the module has an array of electrically conductive test pads internally connected to corresponding contacts on the module. The test pads match an array of spring probes in the test unit. The module can be a molded plastic housing with metal leaf spring contacts, or it can comprise a composite flex-circuit material with individual contacts comprising flexible spring-like metalized plastic fingers. Contacts on the test module can releasably engage the leads on the IC package directly, or they can contact separate conductive leads on the PCB adjacent the leads on the IC package. During testing, the spring probes contact the test pads on the test modules and circuit continuity is established via the electrical connections from the spring probes through the modules to the leads adjacent the IC packages. The modules translate dense in-line spacing of leads adjacent the IC packages to the oversized in-line spacing of test pads on the module. In another embodiment, the translator module is attached to a flex-circuit cable coupled to the test system electronics. The translator module is manually placed over each IC package during testing. In a further embodiment, an integrated circuit package contains a built-in test verifier system so that standard test probes can be used to test the package without use of a separate translator module.
摘要:
Optical fiber test probes test the optical functions of light-emitting circuit elements or displays, or are used in optical test fixtures. In one embodiment, an optical fiber test probe comprises an optical fiber in two sections in which both are movable with a receptacle against the bias of a compression spring during testing. One fiber is contained within a removable barrel so it can be replaced by removing it from the receptacle independently of the compression spring. In their operative test position, the two optical fibers are mounted in the receptacle to maintain light-tight optical continuity during testing. In another embodiment, an optical fiber test probe comprises a barrel and an optical fiber contained within a plunger movable in the barrel, in which a free end portion of the optical fiber extends unsupported through a compression spring which applies a spring bias to an internal end of the plunger. The fiber optic probe is isolated from loads imposed on the plunger during repetitive testing with the probe. A further embodiment comprises a fiber optic test having a low compliance, one-piece, spring loaded, molded plastic optical fiber retainer.
摘要:
A test fixture for testing circuit boards has a vacuum chamber between a stationary probe plate and a movable top plate. Separate adjustable linear bearings located in quadrants of the fixture provide parallel alignment between the top plate and the probe plate. A continuous vacuum seal between the probe plate and top plate bypasses the bearings so the bearings are outside the vacuum area. Spring loaded test probes in the probe plate extend through holes in the top plate for access to a circuit board under test. The probes contact the board when the top plate moves down toward the probes under a vacuum. The top plate is secured to the probe plate by separate quick-release latch pins extending through the linear bearings. The moving top plate carries fixed tooling pins for mounting the board to the top plate. Movable bearing blocks support the bearings. The top plate is movable for aligning the board with the test probes. The top plate, latch pins, bearings and bearing blocks are movable as a unit relative to the probe plate. After the top plate is aligned with the probes to compensate for art shift among circuit board lots, the quick-release latches are engaged to retain the alignment. The latches can comprise part of a guide post assembly for guiding vertical travel of the top plate during vacuum cycling of the test fixture. An optical alignment system in combination with the movable bearings provides a quick and easy means of aligning the board and the probes with extremely high accuracy.