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7 条记录 (耗时 0.021 秒)

    Test socket
    1.
    发明授权
    Test socket 失效
    测试插座

    公开(公告)号：US06204680B1

    公开(公告)日：2001-03-20

    申请号：US09139543

    申请日：1998-08-25

    申请人： Mark A. Swart ,  Charles J. Johnston ,  Gordon A. Vinther ,  Steve B. Sargeant ,  Roy W. Green

    发明人： Mark A. Swart ,  Charles J. Johnston ,  Gordon A. Vinther ,  Steve B. Sargeant ,  Roy W. Green

    IPC分类号： G01R3102

    CPC分类号： G01R1/06722 ,  G01R1/0483

    摘要： A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A nonconductive pushrod is positioned between the spring and a beveled edge of the plunger and a nonconductive cap is positioned above the load board for high frequency test signals. For closely spaced test sites a thinner daughter board is electrically connected to the load board through a hole in the load board. The test socket is then positioned on the daughter board.

    摘要翻译： 一种用于集成电路封装的测试插座，其具有分别固定到负载板的顶表面和底表面的上壳体和下壳体。 上壳体具有用于接收集成电路封装的空腔，并且在上壳体的基部中包括孔，以允许多个实心插座柱塞接触集成电路封装上的测试位置。 插座柱塞定位在形成在下壳体中的多个通道内并且延伸穿过负载板中的多个孔以接触测试位置。 多个弹簧定位在下壳体的通道内，位于插座柱塞下方，以提供弹簧力，以将插座柱塞向上朝向集成电路封装偏置。 非导电推杆位于弹簧和柱塞的斜边之间，并且非导电帽位于负载板上方以用于高频测试信号。 对于紧密间隔的测试位置，较薄的子板通过负载板上的孔与负载板电连接。 然后将测试插座定位在子板上。

    Test socket
    2.
    发明授权
    Test socket 失效
    测试插座

    公开(公告)号：US6084421A

    公开(公告)日：2000-07-04

    申请号：US44874

    申请日：1998-03-20

    申请人： Mark A. Swart ,  Charles J. Johnston ,  Gordon A. Vinther ,  Steve B. Sargeant

    发明人： Mark A. Swart ,  Charles J. Johnston ,  Gordon A. Vinther ,  Steve B. Sargeant

    IPC分类号： G01R31/26 ,  G01R1/04 ,  G01R1/073 ,  G01R31/02 ,  H01L21/66 ,  H01L21/822 ,  H01L23/32 ,  H01L27/04 ,  H01R12/16 ,  H01R33/76

    CPC分类号： G01R1/0483

    摘要： A test socket for an integrated circuit package having an upper housing and a lower housing secured to the top and bottom surfaces, respectively, of a load board. The upper housing having a cavity for receipt of the integrated circuit package and including a hole in the base of the upper housing to allow a plurality of solid socket plungers to contact test sites on the integrated circuit package. The socket plungers are positioned within a plurality of channels formed in the lower housing and extend through a plurality of holes in the load board to contact the test sites. A plurality of springs are positioned in the channels of the lower housing below the socket plungers to provide a spring force to bias the socket plungers upwardly toward the integrated circuit package. A ball is positioned between the spring and a beveled edge of the plunger to aid in biasing the plunger. Electrically conductive cylindrical eyelets or plated through holes are positioned within the holes in the load board to guide the travel of the socket plungers and to transfer the test signals from the socket plungers to the load board.

    摘要翻译： 一种用于集成电路封装的测试插座，其具有分别固定到负载板的顶表面和底表面的上壳体和下壳体。 上壳体具有用于接收集成电路封装的空腔，并且在上壳体的基部中包括孔，以允许多个实心插座柱塞接触集成电路封装上的测试位置。 插座柱塞定位在形成在下壳体中的多个通道内并且延伸穿过负载板中的多个孔以接触测试位置。 多个弹簧定位在下壳体的通道内，位于插座柱塞下方，以提供弹簧力，以将插座柱塞向上朝向集成电路封装偏置。 一个球定位在弹簧与柱塞的斜边之间，有助于偏压柱塞。 导电圆柱形孔眼或电镀通孔位于负载板的孔内，以引导插座柱塞的行进，并将测试信号从插座柱塞传输到负载板。

    SWAGING PROCESS FOR IMPROVED COMPLIANT CONTACT ELECTRICAL TEST PERFORMANCE
    5.
    发明申请
    SWAGING PROCESS FOR IMPROVED COMPLIANT CONTACT ELECTRICAL TEST PERFORMANCE 审中-公开
    改进合规接触电流测试性能的改进方法

    公开(公告)号：US20100267291A1

    公开(公告)日：2010-10-21

    申请号：US12707596

    申请日：2010-02-17

    申请人： Scott Chabineau-Lovgren ,  Steve B. Sargeant ,  Mark A. Swart

    发明人： Scott Chabineau-Lovgren ,  Steve B. Sargeant ,  Mark A. Swart

    IPC分类号： H01R4/48 ,  H01R43/16

    CPC分类号： H01R13/2421 ,  H01R2201/20 ,  Y10T29/49204

    摘要： A spring contact assembly having a first plunger with a tail portion having a flat contact surface and a swagable surface and a second plunger having a tail portion with a flat contact surface and a swagable surface wherein the flat contact surfaces are overlapping and are surrounded by an external compression spring such that the swagable surfaces are swaged by the coils of the spring during the initial compression of the spring.

    摘要翻译： 一种具有第一柱塞的弹簧接触组件，该第一柱塞的尾部具有平坦的接触表面和可变形表面;以及第二柱塞，其具有带有平坦接触表面和可摆动表面的尾部，其中平坦的接触表面重叠并被 外部压缩弹簧，使得在弹簧的初始压缩期间，可变形表面由弹簧的线圈挤压。