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公开(公告)号：US20140312436A1
公开(公告)日：2014-10-23
申请号：US13868125
申请日：2013-04-23
Applicant: Matthieu Lagouge
Inventor： Matthieu Lagouge
CPC classification number: B81C1/00801 , B81B2201/0235 , B81B2203/0307 , B81C2201/014 , B81C2203/036
Abstract: A method of fabricating a microelectromechanical (MEMS) device includes bonding a transducer wafer to a substrate wafer along a bond interface. An unpatterned transducer layer included within the transducer wafer is patterned. A release etch process is then performed during which a sacrificial layer is exposed to a selected release etchant to remove at a least a portion of the sacrificial layer through the openings in the patterned transducer layer. A release etch stop layer is formed between the sacrificial layer and the bond interface prior to exposing the sacrificial layer to the release etchant. The release etch stop layer prevents the ingress of the selected release etchant into the region of the MEMS device containing the bond interface during the release etch process.
Abstract translation: 一种制造微机电（MEMS）装置的方法包括沿着键合界面将换能器晶片连接到衬底晶片。 包含在换能器晶片内的未图案化的换能器层被图案化。 然后执行释放蚀刻工艺，在此期间，牺牲层暴露于所选择的释放蚀刻剂，以通过图案化的换能器层中的开口在牺牲层的至少一部分上移除。 在将牺牲层暴露于释放蚀刻剂之前，在牺牲层和接合界面之间形成释放蚀刻停止层。 释放蚀刻停止层在释放蚀刻工艺期间防止所选择的剥离蚀刻剂进入包含结合界面的MEMS器件的区域中。
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公开(公告)号：US20100063768A1
公开(公告)日：2010-03-11
申请号：US12283164
申请日：2008-09-09
Applicant: Matthieu Lagouge , Yaohui Mao
Inventor： Matthieu Lagouge , Yaohui Mao
IPC: G01C9/00
Abstract: A system and device for detecting yaw and changes in pitch angle for use with navigational and positional devices. The system and device include a multi-axis magnetic field sensing device and a controller. Preferably, the magnetic field sensing device is a multi-axis magnetic compass that is capable of sensing variations in pitch and yaw. The controller is adapted to process yaw and pitch rotational data to determine a positive or a negative change in pitch.
Abstract translation: 一种用于检测偏航的系统和装置，用于与导航和位置装置一起使用的俯仰角变化。 该系统和装置包括多轴磁场感测装置和控制器。 优选地，磁场感测装置是能够感测俯仰和偏航的变化的多轴磁罗盘。 控制器适于处理偏航和俯仰旋转数据以确定间距的正或负变化。
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公开(公告)号：US09416003B2
公开(公告)日：2016-08-16
申请号：US14188649
申请日：2014-02-24
Applicant: Matthieu Lagouge
Inventor： Matthieu Lagouge
IPC: B81B7/02 , B81C1/00 , H01L21/447
CPC classification number: B81C1/00285 , B81B2201/0235 , B81B2201/0242 , B81C2203/0118
Abstract: A semiconductor die includes a device structure having a micro-electronic device located at a surface of a substrate and a cap coupled to the device structure with the micro-electronic device positioned in a cavity located between the cap and the substrate. A sacrificial material is provided within the cavity, coupling the cap to the device structure. The sacrificial material is heated in the cavity to cause the sacrificial material to decompose to a gaseous species. The presence of the gaseous species in the cavity increases a pressure level in the cavity from an initial pressure to a final pressure.
Abstract translation: 半导体管芯包括具有位于衬底表面处的微电子器件的器件结构，以及耦合到器件结构的帽，微电子器件定位在位于帽和衬底之间的空腔中。 在空腔内提供牺牲材料，将盖连接到装置结构。 牺牲材料在空腔中被加热以使牺牲材料分解成气态物质。 空腔中的气态物质的存在使空腔中的压力水平从初始压力增加到最终压力。
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公开(公告)号：US07832111B2
公开(公告)日：2010-11-16
申请号：US12283164
申请日：2008-09-09
Applicant: Matthieu Lagouge , Yaohui Mao
Inventor： Matthieu Lagouge , Yaohui Mao
IPC: G01C17/02
Abstract: A system and device for detecting yaw and changes in pitch angle for use with navigational and positional devices. The system and device include a multi-axis magnetic field sensing device and a controller. Preferably, the magnetic field sensing device is a multi-axis magnetic compass that is capable of sensing variations in pitch and yaw. The controller is adapted to process yaw and pitch rotational data to determine a positive or a negative change in pitch.
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Patent Agency Ranking
公开(公告)号：US20150239733A1
公开(公告)日：2015-08-27
申请号：US14188649
申请日：2014-02-24
Applicant: Matthieu Lagouge
Inventor： Matthieu Lagouge
CPC classification number: B81C1/00285 , B81B2201/0235 , B81B2201/0242 , B81C2203/0118
Abstract: A semiconductor die includes a device structure having a micro-electronic device located at a surface of a substrate and a cap coupled to the device structure with the micro-electronic device positioned in a cavity located between the cap and the substrate. A sacrificial material is provided within the cavity, coupling the cap to the device structure. The sacrificial material is heated in the cavity to cause the sacrificial material to decompose to a gaseous species. The presence of the gaseous species in the cavity increases a pressure level in the cavity from an initial pressure to a final pressure.
Abstract translation: 半导体管芯包括具有位于衬底表面处的微电子器件的器件结构，以及耦合到器件结构的帽，微电子器件定位在位于帽和衬底之间的空腔中。 在空腔内提供牺牲材料，将盖连接到装置结构。 牺牲材料在空腔中被加热以使牺牲材料分解成气态物质。 空腔中的气态物质的存在使空腔中的压力水平从初始压力增加到最终压力。
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公开(公告)号：US08932893B2
公开(公告)日：2015-01-13
申请号：US13868125
申请日：2013-04-23
Applicant: Matthieu Lagouge
Inventor： Matthieu Lagouge
CPC classification number: B81C1/00801 , B81B2201/0235 , B81B2203/0307 , B81C2201/014 , B81C2203/036
Abstract: A method of fabricating a microelectromechanical (MEMS) device includes bonding a transducer wafer to a substrate wafer along a bond interface. An unpatterned transducer layer included within the transducer wafer is patterned. A release etch process is then performed during which a sacrificial layer is exposed to a selected release etchant to remove at a least a portion of the sacrificial layer through the openings in the patterned transducer layer. A release etch stop layer is formed between the sacrificial layer and the bond interface prior to exposing the sacrificial layer to the release etchant. The release etch stop layer prevents the ingress of the selected release etchant into the region of the MEMS device containing the bond interface during the release etch process.
Abstract translation: 一种制造微机电（MEMS）装置的方法包括沿着键合界面将换能器晶片连接到衬底晶片。 包含在换能器晶片内的未图案化的换能器层被图案化。 然后执行释放蚀刻工艺，在此期间，牺牲层暴露于所选择的释放蚀刻剂，以通过图案化的换能器层中的开口在牺牲层的至少一部分上移除。 在将牺牲层暴露于释放蚀刻剂之前，在牺牲层和接合界面之间形成释放蚀刻停止层。 释放蚀刻停止层在释放蚀刻工艺期间防止所选择的剥离蚀刻剂进入包含结合界面的MEMS器件的区域中。
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公开(公告)号：US20110234218A1
公开(公告)日：2011-09-29
申请号：US12730717
申请日：2010-03-24
Applicant: Matthieu Lagouge
Inventor： Matthieu Lagouge
CPC classification number: G01R33/072
Abstract: A multi-axis magnetic field sensing device combines two magnetoresistive sensors to measure the two orthogonal components X, Y of a magnetic field parallel to a system's plane and a Hall sensor to measure the Z component of the magnetic field substantially perpendicular to the system's plane. The two magnetoresistive sensors may be built together in one single chip and then stacked on top of a CMOS die embedding the Hall sensor and associated electronics for the signal processing management of the three sensors and the system's interface.
Abstract translation: 多轴磁场感测装置组合两个磁阻传感器来测量平行于系统平面的磁场的两个正交分量X，Y和用于测量基本上垂直于系统平面的磁场的Z分量的霍尔传感器。 两个磁阻传感器可以一起构建在单个芯片中，然后堆叠在嵌入霍尔传感器和相关电子装置的CMOS管芯的顶部，用于三个传感器和系统接口的信号处理管理。
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公开(公告)号：US07617599B2
公开(公告)日：2009-11-17
申请号：US11999516
申请日：2007-12-05
Applicant: Zongya Li , Matthieu Lagouge , Hongyuan Yang , Yanwei Chen
Inventor： Zongya Li , Matthieu Lagouge , Hongyuan Yang , Yanwei Chen
CPC classification number: G01L1/18 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/1461 , H01L2924/1815 , Y10T29/49146 , Y10T29/49169 , H01L2924/00014 , H01L2924/00
Abstract: Methods of packaging systems pressure-sensitive devices that are subject to human contact force are disclosed. The methods include coupling and attaching the sensing devices and at least one other integrated circuit to a substrate; applying and curing a relatively-soft, protective material over the sensing portion of the sensing device; positioning a covering tool over the cured material; applying and curing a relatively-hard, protective coating around the covering tool and the relatively-soft, protective material; and applying a second, relatively-soft, protective material in the void left by the withdrawn covering tool.
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公开(公告)号：US20090145237A1
公开(公告)日：2009-06-11
申请号：US11999516
申请日：2007-12-05
Applicant: Zongya Li , Matthieu Lagouge , Hongyuan Yang , Yanwei Chen
Inventor： Zongya Li , Matthieu Lagouge , Hongyuan Yang , Yanwei Chen
IPC: G01L7/00
CPC classification number: G01L1/18 , H01L2224/48091 , H01L2224/48137 , H01L2224/73265 , H01L2924/1461 , H01L2924/1815 , Y10T29/49146 , Y10T29/49169 , H01L2924/00014 , H01L2924/00
Abstract: Methods of packaging systems pressure-sensitive devices that are subject to human contact force are disclosed. The methods include coupling and attaching the sensing devices and at least one other integrated circuit to a substrate; applying and curing a relatively-soft, protective material over the sensing portion of the sensing device; positioning a covering tool over the cured material; applying and curing a relatively-hard, protective coating around the covering tool and the relatively-soft, protective material; and applying a second, relatively-soft, protective material in the void left by the withdrawn covering tool.
Abstract translation: 公开了受到人的接触力的包装系统压敏装置的方法。 所述方法包括将感测装置和至少一个其它集成电路耦合并附接至基板; 在感测装置的感测部分上施加和固化相对柔软的保护材料; 将覆盖工具定位在固化材料上; 在覆盖工具和相对柔软的保护材料周围施加和固化相对硬的保护涂层; 以及将第二个相对柔软的保护材料施加在被撤回的覆盖工具留下的空隙中。
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