Patent search ap:("Microfabrica Inc.") AND inv:"Jia Li" Page 1

1.

发明授权
Micro heat transfer arrays, micro cold plates, and thermal management systems for semiconductor devices, and methods for using and making such arrays, plates, and systems 有权

公开(公告)号：US12255123B2

公开(公告)日：2025-03-18

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu , Richard T. Chen , Will J. Tan , Jia Li , Uri Frodis , Nina C. Levy , Dennis R. Smalley

IPC: H01L23/473 , F28F3/12 , F28F13/06 , H01L21/48 , H05K7/20

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

2.

发明公开
Shielded Probes for Semiconductor Testing, Methods for Using, and Methods for Making 审中-公开

公开(公告)号：US20240094252A1

公开(公告)日：2024-03-21

申请号：US17493802

申请日：2021-10-04

Applicant: Microfabrica Inc.

Inventor： Jia Li , Arun S. Veeramani , Stefano Felici , Dennis R. Smalley

IPC: G01R1/067 , G01R3/00

CPC classification number: G01R1/06761 , G01R1/06716 , G01R3/00

Abstract: Dual shield probes are provided having one or more of a plurality of different features including: discontinuous dielectric spacers, fixed nodes, sliding nodes, shield nodes, bridges, stops, interlocked dielectric and conductive elements, along with methods of using and making such probes.

3.

发明公开
Micro Heat Transfer Arrays, Micro Cold Plates, and Thermal Management Systems for Semiconductor Devices, and Methods for Using and Making Such Arrays, Plates, and Systems 审中-公开

公开(公告)号：US20230207426A1

公开(公告)日：2023-06-29

申请号：US17699049

申请日：2022-03-18

Applicant: Microfabrica Inc.

Inventor： Onnik Yaglioglu , Richard T. Chen , Will J. Tan , Jia Li , Uri Frodis , Nina C. Levy , Dennis R. Smalley

IPC: H01L23/473 , F28F3/12 , F28F13/06 , H01L21/48 , H05K7/20

CPC classification number: H01L23/4735 , F28F3/12 , F28F13/06 , H01L21/4871 , H01L23/473 , H01L21/4882 , H05K7/20254 , H05K7/20272 , H05K7/20281 , F28F2260/02

Abstract: Embodiments of the present invention are directed to heat transfer arrays, cold plates including heat transfer arrays along with inlets and outlets, and thermal management systems including cold-plates, pumps and heat exchangers. These devices and systems may be used to provide cooling of semiconductor devices or other devices and particularly such devices that produce high heat concentrations. The heat transfer arrays may include microjets, multi-stage microjets, microchannels, fins, wells, wells with flow passages, well with stress relief or stress propagation inhibitors, and integrated microjets and fins.

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