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公开(公告)号：US12181493B2
公开(公告)日：2024-12-31
申请号：US17898446
申请日：2022-08-29
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu , Garret R. Smalley
Abstract: Probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segments and in some embodiments include one or both of:(1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements and/or (2) pairs of joined probes with at least one end of the probe set having independently compressible tips (e.g. as Kelvin probe pairs for use in 4 wire Kelvin probe tests).
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公开(公告)号：US20240094258A1
公开(公告)日：2024-03-21
申请号：US17968638
申请日：2022-10-18
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07314 , G01R1/06722 , G01R1/06738 , G01R3/00
Abstract: Probes for contacting electronic components include compliant modules stacked in a serial configuration, which are supported by a sheath, exoskeleton, or endoskeleton which allows for linear longitudinal compression of probe ends toward one another wherein the compliant elements within the compliant modules include planar springs (when unbiased). Alternatively, probes may be formed from single modules or back-to-back modules that may share a common base/standoff. Modules may allow for lateral and/or longitudinal alignment relative to array structures or other modules. Planar springs may be spirals, interlaced spirals having common or offset longitudinal levels, with similar or different rotational orientations that are functionally joined, and planar springs may transition into multiple thinner planar spring elements along their length. Compression of probe tips toward one another may cause portions of spring elements to move closer together or further apart.
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公开(公告)号：US11802891B1
公开(公告)日：2023-10-31
申请号：US17139933
申请日：2020-12-31
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu
IPC: G01R1/067
CPC classification number: G01R1/06722
Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays. In the various embodiments, probes include at least two flat spring segments with at least one of those segments being used in a compressive manner wherein the probe additionally includes guide elements, framing structures or other structural configurations that limit or inhibit one or more compressive spring segments from bowing or deflecting out of a desired position when subjected to loading.
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公开(公告)号：US20230243870A1
公开(公告)日：2023-08-03
申请号：US18295712
申请日：2023-04-04
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/06722 , G01R1/07314 , G01R1/06733
Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise lower retention features that protrudes from a probe body with a size and configuration that limits the longitudinal extent to which the probes can be inserted into plate probe holes in the lower array plate and an upper retention feature undergoing lateral displacement relative to the upper plate probe hole such that it can no longer longitudinally pass through the extension of the upper plate probe hole in the upper array plate.
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公开(公告)号：US12078657B2
公开(公告)日：2024-09-03
申请号：US17854756
申请日：2022-06-30
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu , Arun S. Veeramani
CPC classification number: G01R1/06722 , G01R1/06738 , G01R1/0735 , G01R3/00
Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat extension spring segment and wherein in some embodiments the probes also provide: (1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements, and/or (2) ratcheting elements on probe arms and/or frame elements to allow permanent or semi-permanent transition from a build state or initial state to a working state or pre-biased state.
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Patent Agency Ranking
公开(公告)号：US20240094250A1
公开(公告)日：2024-03-21
申请号：US17898446
申请日：2022-08-29
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu , Garret R. Smalley
CPC classification number: G01R1/06722 , G01R1/06738 , G01R1/0735 , G01R3/00
Abstract: Probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segments and in some embodiments include one or both of:(1) narrowed channel passage segments (e.g. by increasing width of plunger elements or by decreasing channel widths) along portions of channel lengths (e.g. not entire channel lengths) to enhance stability or pointing accuracy while still allowing for assembled formation of movable probe elements and/or (2) pairs of joined probes with at least one end of the probe set having independently compressible tips (e.g. as Kelvin probe pairs for use in 4 wire Kelvin probe tests).
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7.发明授权公开(公告)号：US11906549B1
公开(公告)日：2024-02-20
申请号：US17682340
申请日：2022-02-28
Applicant: Microfabrica Inc.
Inventor： Ming Ting Wu
CPC classification number: G01R1/06722 , G01R1/06738 , G01R1/0735 , G01R3/00
Abstract: Embodiments are directed to probe structures, arrays, methods of using probes and arrays, and/or methods for making probes and/or arrays wherein the probes include at least one flat tensional spring segment.
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公开(公告)号：US20230314482A1
公开(公告)日：2023-10-05
申请号：US18295738
申请日：2023-04-04
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/07371 , G01R31/2831
Abstract: Probe array for contacting electronic components includes a plurality of probes for making contact between two electronic circuit elements and a dual array plate mounting and retention configuration. The probes may comprise one or more mounting features that extend laterally from a body portion of the probe and the lower and upper array plates, in combination, capture: (1) at least one of the mounting features to inhibit excessive downward vertical movement of the probe body relative to the array plates, (2) at least one of the mounting features to inhibit excessive upward vertical movement of the probe body relative to the array plates, and (3) at least one of the mounting features to inhibit excessive lateral movement of the probe relative to the array plates, and wherein the at least one lower and upper plates longitudinally contact each other in a stacked assembly.
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公开(公告)号：US20230243872A1
公开(公告)日：2023-08-03
申请号：US18295748
申请日：2023-04-04
Applicant: Microfabrica Inc.
Inventor： Arun S. Veeramani , Ming Ting Wu , Dennis R. Smalley
CPC classification number: G01R1/06733 , G01R1/06722 , G01R1/07314
Abstract: Probe for making contact between two electronic circuit elements comprises a feature selected from the group consisting of: (A) at least one first tip and second tip arm supporting a shunting element that makes an electrical connection to at least one standoff while shunting current flow away from a spring element of the probe that joins a respective standoff and supports the respective tip arm, and (B) both of the first tip arm and the second tip arm support a respective shunting element that makes an electrical connection to the at least one respective standoff while shunting current flow away from a respective spring element that joins the respective standoff and supports the respective tip arm.
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10.发明授权公开(公告)号：US10961967B1
公开(公告)日：2021-03-30
申请号：US16551652
申请日：2019-08-26
Applicant: Microfabrica Inc.
Inventor： Gregory P. Schmitz , Ming Ting Wu , Uri Frodis , Eli Baldwin , Gabriel Jacobsohn
Abstract: Embodiments are directed to fuel injectors for internal combustion engines (e.g. engines with reciprocating pistons and with compression-ignition or spark-ignition, Wankel engines, turbines, jets, rockets, and the like) and more particularly to improved nozzle configurations for use as part of such fuel injectors. Other embodiments are directed to enabling fabrication technology that can provide for formation of nozzles with complex configurations and particularly for technologies that form structures via multiple layers of selectively deposited material or in combination with fabrication from a plurality of layers where critical layers are planarized before attaching additional layers thereto or forming additional layers thereon. Other embodiments are directed to methods and apparatus for integrating such nozzles with injector bodies.
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