公开(公告)号：US10790008B2

公开(公告)日：2020-09-29

申请号：US16112133

申请日：2018-08-24

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: G11C11/4091 ,  G11C11/4094 ,  G11C11/408 ,  G11C11/4096 ,  G11C11/4076 ,  G11C11/404 ,  H01L27/108

Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes volatile memory cells located along a pillar that has a length extending in a direction perpendicular to a substrate of a memory device. Each of the volatile memory cells includes a capacitor and at least one transistor. The capacitor includes a capacitor plate. The capacitor plate is either formed from a portion a semiconductor material of the pillar or formed from a conductive material separated from the pillar by a dielectric.

公开(公告)号：US11295807B2

公开(公告)日：2022-04-05

申请号：US17020536

申请日：2020-09-14

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: G11C11/4091 ,  G11C11/4094 ,  G11C11/408 ,  G11C11/4096 ,  G11C11/4076 ,  G11C11/404 ,  H01L27/108

Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes volatile memory cells located along a pillar that has a length extending in a direction perpendicular to a substrate of a memory device. Each of the volatile memory cells includes a capacitor and at least one transistor. The capacitor includes a capacitor plate. The capacitor plate is either formed from a portion a semiconductor material of the pillar or formed from a conductive material separated from the pillar by a dielectric.

公开(公告)号：US20210391634A1

公开(公告)日：2021-12-16

申请号：US17461539

申请日：2021-08-30

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: H01P3/12 ,  H01P1/24 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F13/40

Abstract: Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.

公开(公告)号：US11728555B2

公开(公告)日：2023-08-15

申请号：US17461539

申请日：2021-08-30

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: G06F3/12 ,  H01P3/12 ,  H01P1/24 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F13/40 ,  H01P5/08

CPC classification number: H01P3/12 ,  G06F13/1668 ,  G06F13/4068 ,  H01P1/24 ,  H05K1/0243 ,  H05K1/181 ,  H01P5/085 ,  H05K2201/10159 ,  H05K2201/10257 ,  H05K2201/10515 ,  H05K2201/10522

Abstract: Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.

公开(公告)号：US11108127B2

公开(公告)日：2021-08-31

申请号：US16141797

申请日：2018-09-25

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: G06F3/12 ,  H01P3/12 ,  H01P1/24 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F13/40 ,  H01P5/08

Abstract: Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.

公开(公告)号：US20200099119A1

公开(公告)日：2020-03-26

申请号：US16141797

申请日：2018-09-25

Applicant: Micron Technology, Inc.

Inventor： Yoshihito Koya

IPC: H01P3/12 ,  H01P1/24 ,  H05K1/18 ,  H05K1/02 ,  G06F13/16 ,  G06F13/40

Abstract: Disclosed herein is an apparatus that includes a memory, a processor, and a rectangular waveguide coupled to the memory and the processor so that the memory and the processor communicate with each other via the rectangular waveguide.