公开(公告)号：US4803180A

公开(公告)日：1989-02-07

申请号：US56990

申请日：1987-06-03

Applicant: Mitsuo Ohdate

Inventor： Mitsuo Ohdate

IPC: H01L21/52 ,  H01L21/58 ,  H01L23/049 ,  H01L23/48 ,  H01L25/11 ,  B01J17/00 ,  H01L23/04 ,  H01L23/10

CPC classification number: H01L24/72 ,  H01L23/049 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01033 ,  Y10T29/49169 ,  Y10T29/49918

Abstract: A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconductor element and the elastic body, the lower end of the cylindrical body being fixed to the support member; and a plurality of curved projections produced so as to be in contact with the upper end of the elastic body by curving at least three points of the top end of the cylindrical body while pressure is applied to the semiconductor element through the elastic body.

Abstract translation: 一种半导体器件包括：支撑构件; 安装在所述支撑构件上的半导体元件; 将所述半导体元件与所述支撑部件压力接触的弹性体; 用于容纳半导体元件和弹性体的圆柱体，圆柱体的下端固定到支撑构件; 以及多个弯曲突起，其通过弯曲至少三个圆柱体顶端的点而与弹性体的上端接触，同时通过弹性体向半导体元件施加压力。

公开(公告)号：US4274106A

公开(公告)日：1981-06-16

申请号：US957330

申请日：1978-11-03

Applicant: Mitsuo Ohdate

Inventor： Mitsuo Ohdate

IPC: H01L23/051 ,  H01L23/16 ,  H01L23/42 ,  H01L23/44 ,  H01L23/46

CPC classification number: H01L23/051 ,  H01L23/16 ,  H01L24/00 ,  H01L2924/01322

Abstract: Two opposite electrodes are disposed at both ends of a hollow, electrically insulating cylinder to sandwich a semiconductor element between them and connected to those ends through thin metallic annuli respectively. The semiconductor element is physically isolated from each of the metallic annuli either by an annular member interposed between a circumferential protrusion of each electrode and the hollow cylinder or by contacting directly the protrusion with the cylinder. The annulr member may be resilient or not elastically deformable.

Abstract translation: 两个相对电极设置在中空的电绝缘圆柱体的两端，以将半导体元件夹在它们之间并分别通过薄金属环连接到这些端。 半导体元件通过设置在每个电极的周向突起与中空圆柱体之间的环形构件或通过直接接触突起与气缸而与金属环形物理隔离。 环形构件可以是弹性的或不可弹性变形的。

公开(公告)号：US4792844A

公开(公告)日：1988-12-20

申请号：US75218

申请日：1987-07-20

Applicant: Mitsuo Ohdate

Inventor： Mitsuo Ohdate

IPC: H01L21/52 ,  H01L21/58 ,  H01L23/049 ,  H01L23/48 ,  H01L25/11 ,  H01L23/42 ,  H01L23/02

CPC classification number: H01L24/72 ,  H01L23/049 ,  H01L2924/01006 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01033 ,  Y10T29/49169 ,  Y10T29/49918

Abstract: A semiconductor device includes a support member; a semiconductor element mounted on the support member; an elastic body which places the semiconductor element in pressure-contact with the support member; a cylindrical body for containing the semiconductor element and the elastic body, the lower end of the cylindrical body being fixed to the support member; and a plurality of curved projections produced so as to be in contact with the upper end of the elastic body by curving at least three points of the top end of the cylindrical body while pressure is applied to the semiconductor element through the elastic body.

Abstract translation: 一种半导体器件包括：支撑构件; 安装在所述支撑构件上的半导体元件; 将所述半导体元件与所述支撑部件压力接触的弹性体; 用于容纳半导体元件和弹性体的圆柱体，圆柱体的下端固定到支撑构件; 以及多个弯曲突起，其通过弯曲至少三个圆柱体顶端的点而与弹性体的上端接触，同时通过弹性体向半导体元件施加压力。