公开(公告)号：US20250055441A1

公开(公告)日：2025-02-13

申请号：US18925553

申请日：2024-10-24

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Patrick TURNER ,  Mike EDDY ,  Andrew KAY ,  Ventsislav YANTCHEV

IPC: H03H9/25 ,  H03H9/02 ,  H03H9/10 ,  H03H9/58 ,  H03H9/64

Abstract: A radio frequency filter includes bulk acoustic resonator chips that each include a substrate; a piezoelectric plate that includes multiple separate plates; and a conductor pattern on the piezoelectric layer and including an interdigitated transducer (IDT) with interleaved fingers on the piezoelectric layer opposite the substrate. The filter further includes an interposer having a surface facing the piezoelectric layer of each of the plurality of bulk acoustic resonator chips; a conductor pattern on the surface of the interposer; a conductive metal bump between the piezoelectric layer and the interposer that electrically connects the plurality of bulk acoustic resonator chips to the interposer; and a cover bonded to the substrates of the plurality of bulk acoustic resonator chips and to the interposer, wherein the cover seals an interior of the plurality bulk acoustic resonator chips.

公开(公告)号：US20250015774A1

公开(公告)日：2025-01-09

申请号：US18893017

申请日：2024-09-23

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Albert CARDONA ,  Andrew KAY ,  Chris O'BRIEN

IPC: H03H3/02 ,  H03H9/02 ,  H03H9/205 ,  H03H9/56

Abstract: An acoustic resonator device is provided that includes a wafer having a wafer surface and a wafer conductor pattern on the wafer surface; a piezoelectric layer having front and back surfaces, a portion of the piezoelectric layer being over a cavity between the wafer and the piezoelectric layer, and the wafer conductor pattern; a device conductor pattern including a first metal layer including an interdigital transducer on the front surface of the piezoelectric layer and facing the wafer, and a second metal layer attached to a portion of the device conductor pattern to provide an electrical connection between the IDT and the wafer conductor pattern. The second metal layer is bonded to the wafer conductor pattern and the piezoelectric layer comprises openings extending therethrough.

公开(公告)号：US20250096769A1

公开(公告)日：2025-03-20

申请号：US18966231

申请日：2024-12-03

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Andrew KAY ,  Sean MCHUGH ,  John KOULAKIS ,  Albert CARDONA

IPC: H03H9/02 ,  H03H3/02 ,  H03H9/13 ,  H03H9/17 ,  H03H9/56

Abstract: A filter device is provided that includes a plurality of bulk acoustic resonators that each includes a piezoelectric layer; a conductor pattern on the piezoelectric layer and including an interdigital transducer (IDT) having a first plurality of fingers extending from a first busbar and a second plurality of fingers extending from the second busbar, such that the first plurality of fingers and the second plurality of fingers are interleaved with each other; a dielectric strip that overlaps a margin of the first plurality of fingers and that extends into a gap between ends of the first plurality of fingers and the second busbar. Moreover, a thickness ts of the dielectric strip a first bulk acoustic resonator of the plurality of bulk acoustic resonators is different than a thickness ts of the dielectric strip of a second bulk acoustic resonator of the plurality of bulk acoustic resonators.

公开(公告)号：US20250088167A1

公开(公告)日：2025-03-13

申请号：US18960226

申请日：2024-11-26

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kuan ZHANG ,  James R. COSTA ,  Andrew KAY ,  Greg DYER ,  Viktor PLESSKI ,  Soumya YANDRAPALLI ,  Robert B. HAMMOND ,  Bryant GARCIA ,  Patrick TURNER ,  Jesson JOHN ,  Ventsislav YANTCHEV

IPC: H03H9/02 ,  H03H3/02 ,  H03H3/04 ,  H03H9/13 ,  H03H9/17 ,  H03H9/56

Abstract: Acoustic filters, resonators and methods are disclosed. An acoustic filter device includes a substrate; a piezoelectric layer attached to the substrate, wherein at least a portion of the piezoelectric layer is disposed over a cavity of the acoustic resonator device; and an interdigital transducer (IDT) on a surface of the piezoelectric layer, the IDT including interleaved fingers extending at least over the portion of the piezoelectric layer disposed over the cavity. The cavity has at least one rounded corner, and a portion of interleaved fingers extend from at least one busbar. Moreover, at least a portion of the rounded corner of the cavity is under the at least one busbar in a plan view of the piezoelectric layer.

公开(公告)号：US20250062747A1

公开(公告)日：2025-02-20

申请号：US18935753

申请日：2024-11-04

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Andrew KAY ,  Patrick TURNER ,  Albert CARDONA

IPC: H03H9/54 ,  H03H3/02 ,  H03H9/02 ,  H03H9/13 ,  H03H9/17 ,  H03H9/205 ,  H03H9/56

Abstract: A filter device is provided that includes a substrate having a surface; and a piezoelectric layer over a first cavity and a second cavity. The piezoelectric layer is attached to the surface of the substrate either directly or via one or more intermediate layers. An area of the piezoelectric layer has a first thickness for at least one first resonator that forms at least one first membrane over the first cavity. Moreover, an area of the piezoelectric layer has a second thickness for at least one second resonator that forms at least one second membrane over the second cavity, the second thickness being thinner than the first thickness. A bottom of the first cavity that is opposite from the at least one first membrane extends farther down away from the piezoelectric layer than a bottom of the second cavity that is opposite from the at least one second membrane.

公开(公告)号：US20250007482A1

公开(公告)日：2025-01-02

申请号：US18829076

申请日：2024-09-09

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Patrick TURNER ,  Mike EDDY ,  Andrew KAY ,  Ventsislav YANTCHEV

IPC: H03H3/02 ,  H03H3/04 ,  H03H9/02 ,  H03H9/10 ,  H03H9/25 ,  H03H9/58 ,  H03H9/64

Abstract: A bulk acoustic resonator device is provided that includes a bulk acoustic resonator chip having a substrate; a piezoelectric layer attached to the substrate either directly or via one or more intermediate layers; and a first conductor pattern on the piezoelectric layer, the first conductor pattern comprising an interdigitated transducer (IDT). Moreover, an interposer is provided having a surface facing the piezoelectric layer and having a second conductor pattern on the surface of the interposer. A conductive metal bump is between the piezoelectric layer and the interposer that electrically connects the first conductor pattern to the second conductor pattern; and a cover is bonded both to the substrate and to a portion of the surface of the interposer. The cover seals an interior of the bulk acoustic resonator chip.