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公开(公告)号：US20200007096A1
公开(公告)日：2020-01-02
申请号：US16567243
申请日：2019-09-11
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Terumichi KITA
Abstract: A high-frequency module (10) includes a filter unit (20) including a plurality of filters, a switch unit (30) that is connected to the filter unit (20) and that includes a switch configured to switch filters through which a high-frequency signal passes among the plurality of filters, an amplifying unit (50) configured to amplify the high-frequency signal passing through the filter unit (20), a matching unit (40) that is connected between the filter unit (20) and the amplifying unit (50) and that is configured to perform impedance matching of the amplifying unit (50), and a multilayer substrate (100) provided with the filter unit (20), the switch unit (30), the amplifying unit (50), and the matching unit (40).
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公开(公告)号：US20240106413A1
公开(公告)日：2024-03-28
申请号：US18527826
申请日：2023-12-04
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Shinichiro TAKAYANAGI , Terumichi KITA , Takanori ITO
CPC classification number: H03H9/58 , H05K1/0243 , H05K2201/1003 , H05K2201/1006 , H05K2201/10098
Abstract: The deterioration in characteristics of a filter is reduced. In a high frequency module, the filter includes a first substrate, a first functional electrode provided on the first substrate and forming a part of an antenna end resonator, a second substrate separate from the first substrate, and a second functional electrode provided on the second substrate and forming a part of at least one acoustic wave resonator other than the antenna end resonator among a plurality of acoustic wave resonators. A first electronic component including the first substrate and the first functional electrode is disposed on the first main surface of the mounting substrate. An inductor is adjacent to the first electronic component in a plan view from a thickness direction of the mounting substrate. The inductor does not overlap the antenna end resonator in a side view from a direction of a winding axis of a winding portion.
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公开(公告)号：US20240113848A1
公开(公告)日：2024-04-04
申请号：US18538304
申请日：2023-12-13
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Takanori ITO , Terumichi KITA , Shinichiro TAKAYANAGI , Yuudai TANOUE , Minoru IWANAGA
CPC classification number: H04L5/14 , H03H9/145 , H03H9/25 , H03H9/6483
Abstract: In a high frequency module, a plurality of filters is connected to an antenna terminal with a switch interposed. The plurality of filters includes a first filter that has a pass band including a frequency band of a first communication band and a second filter that has a pass band including a frequency band of a second communication band that is capable of simultaneous communication with the first communication band. A first electronic component having the first filter and a second antenna end resonator of the second filter is disposed on a first principal surface of the mounting substrate. A second electronic component having at least one second acoustic wave resonator other than a second antenna end resonator of the second filter is disposed on the first principal surface of the mounting substrate.
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Patent Agency Ranking
公开(公告)号：US20210281225A1
公开(公告)日：2021-09-09
申请号：US17327046
申请日：2021-05-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Terumichi KITA
Abstract: A radio frequency module includes a substrate having first and second main surfaces; a first filter; third and fourth switches connected to the filter; an amplifier; and/or a matching circuit element connected to the first filter. In various embodiments, the matching circuit element may be on the first main surface while the amplifier may be on the second main surface; the matching circuit element may be on the first main surface while the third switch may be on the second main surface; and/or the filter may be on the first main surface while the fourth switch may be on the second main surface.
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公开(公告)号：US20210143780A1
公开(公告)日：2021-05-13
申请号：US17152108
申请日：2021-01-19
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Terumichi KITA
Abstract: A radio frequency module includes a substrate having first and second main surfaces; a first filter; third and fourth switches connected to the filter; an amplifier; and/or a matching circuit element connected to the first filter. In various embodiments, the matching circuit element may be on the first main surface while the amplifier may be on the second main surface; the matching circuit element may be on the first main surface while the third switch may be on the second main surface; and/or the filter may be on the first main surface while the fourth switch may be on the second main surface.
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公开(公告)号：US20220246345A1
公开(公告)日：2022-08-04
申请号：US17660032
申请日：2022-04-21
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Terumichi KITA
Abstract: Coupling between inductors is restrained, and the layout area of a substrate is also ensured. A high-frequency module includes a mounting substrate, a first inductor, a second inductor, at least one high-frequency component, a shield layer, and a conductive member. The mounting substrate has a main surface. The first inductor is located on a main surface side of the mounting substrate. The second inductor is located on the main surface side of the mounting substrate. The high-frequency component is located on the main surface side of the mounting substrate and between the first inductor and the second inductor. The shield layer is connected to the ground. The conductive member connects the high-frequency component and the shield layer. The conductive member is connected to a main surface of the high-frequency component, the main surface facing the shield layer.
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公开(公告)号：US20190035716A1
公开(公告)日：2019-01-31
申请号：US16133735
申请日：2018-09-18
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Terumichi KITA
Abstract: A circuit module includes a multilayer board including an inner-layer ground electrode and an extended electrode that extends from the inner-layer ground electrode in an inner layer thereof, a mounting component mounted on the multilayer board, a resin that covers the mounting component, and a shield electrode that covers the resin and at least a portion of a side surface of the multilayer board. The extended electrode is electrically connected to the inner-layer ground electrode in the multilayer board and at least a portion of the extended electrode overlaps the inner-layer ground electrode when viewed in a lamination direction of the multilayer board. An end portion of the extended electrode is exposed at the side surface of the multilayer board and connected to the shield electrode. An end portion of the inner-layer ground electrode is exposed at the side surface of the multilayer board and connected to the shield electrode.
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公开(公告)号：US20180145642A1
公开(公告)日：2018-05-24
申请号：US15857710
申请日：2017-12-29
Applicant: Murata Manufacturing Co., Ltd.
Inventor： Terumichi KITA
CPC classification number: H03F1/3205 , H03F1/32 , H03F1/56 , H03F3/19 , H03F2200/165 , H03F2200/294 , H03H1/0007 , H03H9/02574 , H03H9/1092 , H03H9/145 , H03H9/6436 , H03H9/6483
Abstract: A radio-frequency module includes a filter connected at one end to an input terminal and at the other end to an output terminal, and an amplifier connected at one end to the output terminal and at the other end to the other end of the filter. The filter includes first and second filter portions. The first filter portion is disposed on a signal line electrically connecting the input terminal and the output terminal. The second filter portion is connected between the signal line and a ground. Each of the first and second filter portions includes a surface acoustic wave resonator including an IDT electrode on a piezoelectric substrate. The IDT electrode includes first and second electrode fingers. In the surface acoustic wave resonator of the second filter portion, at least some of the first and second electrode fingers are electrically connected to each other.
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