公开(公告)号：US20230291427A1

公开(公告)日：2023-09-14

申请号：US18319072

申请日：2023-05-17

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuudai TANOUE ,  Minoru IWANAGA ,  Takashi WATANABE

IPC: H04B1/38 ,  H03H9/17 ,  H03H9/64 ,  H03H9/70

CPC classification number: H04B1/38 ,  H03H9/17 ,  H03H9/64 ,  H03H9/70

Abstract: A high-frequency module includes a mounting substrate, a first filter, a second filter, and a third filter. The mounting substrate has a first main surface and a second main surface opposite to each other. Simultaneous communication is enabled for the first filter and the second filter, and the third filter is not used in the simultaneous communication using the first filter and the second filter. The first filter, the second filter, and the third filter are mounted on the first main surface of the mounting substrate. A first substrate of the first filter, a second substrate of the second filter, and a third substrate of the third filter are common to each other. The third filter is disposed between the first filter and the second filter in plan view from a thickness direction of the mounting substrate.

公开(公告)号：US20220021126A1

公开(公告)日：2022-01-20

申请号：US17488382

申请日：2021-09-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Yuudai TANOUE

IPC: H01Q21/06 ,  H01Q1/20 ,  H04B1/04 ,  H04B1/16

Abstract: A change in potential at a ground terminal is suppressed. A radio frequency module includes a mount board, a first circuit element, a second circuit element, a signal terminal (an antenna terminal, a signal input terminal, or a signal output terminal) for a radio frequency signal, and a block terminal. The mount board has a first principal surface and a second principal surface facing each other. The first circuit element is mounted on the first principal surface of the mount board. The second circuit element is mounted on the second principal surface of the mount board. The signal terminal (the antenna terminal, the signal input terminal, or the signal output terminal) is disposed on the second principal surface of the mount board. The block terminal is disposed on the second principal surface of the mount board. The block terminal includes a plurality of ground terminals.

公开(公告)号：US20240113848A1

公开(公告)日：2024-04-04

申请号：US18538304

申请日：2023-12-13

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Takanori ITO ,  Terumichi KITA ,  Shinichiro TAKAYANAGI ,  Yuudai TANOUE ,  Minoru IWANAGA

IPC: H04L5/14 ,  H03H9/145 ,  H03H9/25 ,  H03H9/64

CPC classification number: H04L5/14 ,  H03H9/145 ,  H03H9/25 ,  H03H9/6483

Abstract: In a high frequency module, a plurality of filters is connected to an antenna terminal with a switch interposed. The plurality of filters includes a first filter that has a pass band including a frequency band of a first communication band and a second filter that has a pass band including a frequency band of a second communication band that is capable of simultaneous communication with the first communication band. A first electronic component having the first filter and a second antenna end resonator of the second filter is disposed on a first principal surface of the mounting substrate. A second electronic component having at least one second acoustic wave resonator other than a second antenna end resonator of the second filter is disposed on the first principal surface of the mounting substrate.

公开(公告)号：US20240022275A1

公开(公告)日：2024-01-18

申请号：US18475222

申请日：2023-09-27

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kiyoshi AIKAWA ,  Takanori UEJIMA ,  Hiromichi KITAJIMA ,  Takashi YAMADA ,  Yoshihiro DAIMON ,  Syuichi ONODERA ,  Yuudai TANOUE ,  Norihiro SHIMADA

IPC: H04B1/38 ,  H01Q1/22 ,  H03H9/25 ,  H03H7/38

CPC classification number: H04B1/38 ,  H01Q1/2283 ,  H03H9/25 ,  H03H7/38

Abstract: A radio-frequency module includes a module substrate having major surfaces opposite to each other; a module substrate having major surfaces opposite to each other, the major surface being disposed facing the major surface; a first electronic component disposed on the major surface; a second electronic component that includes a first electrode joined to the major surface and a second electrode joined to the major surface and that is disposed between the major surfaces; and a third electronic component disposed on the major surface; and an external connection terminal disposed on the major surface. The second electronic component is at least one of a chip inductor, a chip capacitor, and a chip resistor. The second electronic component is coupled via the first electrode to the first electronic component and is coupled via the second electrode to the third electronic component or external connection terminal.