公开(公告)号：US20140116909A1

公开(公告)日：2014-05-01

申请号：US14059958

申请日：2013-10-22

Applicant: NITTO DENKO CORPORATION

Inventor： Daisuke TSUKAHARA ,  Yuki EBE

IPC: B65D81/05

CPC classification number: B65D81/05 ,  H01L23/053 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A encapsulating sheet container for storing a encapsulating sheet including a substrate and a encapsulating layer stacked on the substrate includes a tray provided with a receiving region receiving the substrate and a cover superposed on the tray not to be in contact with the encapsulating layer and to be at an interval from the receiving region.

Abstract translation: 一种用于储存包含衬底和封装层的封装片的封装片容器，该封装片容纳在衬底上，该封装片容纳有一个托盘，该托盘设置有容纳衬底的容纳区域和叠置在托盘上的与封装层不接触的盖子 在距接收区域的间隔处。

公开(公告)号：US20160035592A1

公开(公告)日：2016-02-04

申请号：US14776830

申请日：2014-01-30

Applicant: NITTO DENKO CORPORATION

Inventor： Munehisa MITANI ,  Yasunari OOYABU ,  Daisuke TSUKAHARA

IPC: H01L21/56

CPC classification number: H01L21/565 ,  H01L21/67126 ,  H01L23/10 ,  H01L33/52 ,  H01L2924/0002 ,  H01L2933/005 ,  H01L2924/00

Abstract: The adhering device includes a first mold member having a first cavity in which an adhering preform, which includes an electronic component and a resin sheet disposed to face the electronic component in spaced-apart relation, is accomodated; an elastic member disposed to face the resin sheet so that a first enclosed space can be formed with the first cavity; and a differential pressure generation means connected to the first mold member for allowing the air pressure of the first enclosed space to be lower than the air pressure of a space opposite to the first enclosed space relative to the elastic member. The adhering device is configured such that by operating the differential pressure generation means, the elastic member moves towards the first cavity side, the adhering perform is pressed in the direction facing the electronic component and the resin sheet, thereby adhering the resin sheet to the electronic component.

Abstract translation: 粘合装置包括具有第一空腔的第一模具构件，其中包含电子部件的粘合预成型件和以间隔开的方式设置成面对电子部件的树脂片; 弹性构件，其设置成面对所述树脂片，使得能够与所述第一空腔形成第一封闭空间; 以及连接到第一模具构件的差压产生装置，用于允许第一封闭空间的空气压力低于与第一封闭空间相对于弹性构件的空间的空气压力。 粘接装置被构造成使得通过操作差压产生装置，弹性构件朝着第一腔侧移动，粘附表面在面向电子部件和树脂片的方向上被按压，从而将树脂片粘附到电子 零件。

公开(公告)号：US20140329346A1

公开(公告)日：2014-11-06

申请号：US14315948

申请日：2014-06-26

Applicant: NITTO DENKO CORPORATION

Inventor： Yasunari OOYABU ,  Kazuhiro FUKE ,  Daisuke TSUKAHARA ,  Takashi KONDO

IPC: H01L33/52

CPC classification number: H01L33/52 ,  F21V21/00 ,  H01L25/0753 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H05K13/00 ,  Y10T29/49124 ,  H01L2924/00014

Abstract: An element-connecting board is a lead frame for allowing a light emitting diode element to be connected to one side thereof in a thickness direction. The element-connecting board includes the lead frame which is provided with a plurality of leads disposed with spaces from each other and a first insulating resin portion which is light reflective and fills the spaces.

Abstract translation: 元件连接板是用于允许发光二极管元件在厚度方向上与其一侧连接的引线框架。 元件连接板包括引线框架，引线框架设置有彼此间隔开的多个引线，以及第一绝缘树脂部分，其是光反射并填充空间的。