Abstract:
A encapsulating sheet container for storing a encapsulating sheet including a substrate and a encapsulating layer stacked on the substrate includes a tray provided with a receiving region receiving the substrate and a cover superposed on the tray not to be in contact with the encapsulating layer and to be at an interval from the receiving region.
Abstract:
The adhering device includes a first mold member having a first cavity in which an adhering preform, which includes an electronic component and a resin sheet disposed to face the electronic component in spaced-apart relation, is accomodated; an elastic member disposed to face the resin sheet so that a first enclosed space can be formed with the first cavity; and a differential pressure generation means connected to the first mold member for allowing the air pressure of the first enclosed space to be lower than the air pressure of a space opposite to the first enclosed space relative to the elastic member. The adhering device is configured such that by operating the differential pressure generation means, the elastic member moves towards the first cavity side, the adhering perform is pressed in the direction facing the electronic component and the resin sheet, thereby adhering the resin sheet to the electronic component.
Abstract:
An element-connecting board is a lead frame for allowing a light emitting diode element to be connected to one side thereof in a thickness direction. The element-connecting board includes the lead frame which is provided with a plurality of leads disposed with spaces from each other and a first insulating resin portion which is light reflective and fills the spaces.