公开(公告)号：US20020061715A1

公开(公告)日：2002-05-23

申请号：US10042244

申请日：2002-01-11

Applicant: Nu Tool Inc.

Inventor： Cyprian Uzoh ,  Bulent Basol ,  Homayoun Talieh

IPC: B24B001/00

CPC classification number: B24B37/042 ,  C25D3/38 ,  C25D7/12 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/7684 ,  H01L21/76877 ,  H01L23/53228 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A modified plating solution that can be used to electroplate a high quality conductive material that can be effectively polished and planarized includes (1) a solvent, (2) an ionic species of the conductive material to be deposited, (3) at least one additive to improve electrical and structural properties, and (4) a modifying agent.

Abstract translation: 可用于电镀可以有效抛光和平坦化的高质量导电材料的改性电镀溶液包括（1）溶剂，（2）待沉积的导电材料的离子种类，（3）至少一种添加剂 改善电气和结构性能，和（4）改性剂。

公开(公告)号：US20020088715A1

公开(公告)日：2002-07-11

申请号：US10093185

申请日：2002-03-05

Applicant: NU-TOOL, INC.

Inventor： Homayoun Talieh ,  Bulent Basol

IPC: C25D007/12 ,  C25D017/00 ,  C25D011/32

CPC classification number: H01L21/6715 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/67075

Abstract: The present invention is directed to a method and apparatus for plating a surface of a semiconductor workpiece (wafer, flat panel, magnetic films, etc.) using a liquid conductor that makes contact with the outer surface of the workpiece. The liquid conductor is stored in a reservoir and pump through an inlet channel to the liquid chamber. The liquid conductor is injected into a liquid chamber such that the liquid conductor makes contact with the outer surface of the workpiece. An inflatable tube is also provided to prevent the liquid conductor from reaching the back face of the workpiece. A plating solution can be applied to the front face of the workpiece where a retaining ring/seal further prevents the plating solution and the liquid conductor from making contact with each other. In an alternative embodiment, electrical contacts may be formed using an inflatable tube that has either been coated with a conductive material or contains a conductive object. The inflatable tube further provides uniform contact and pressure along the periphery of the workpiece, which may not necessarily be perfectly flat, because the tube can conform according to the shape of the periphery of the workpiece. Further, the present invention can be used to dissolve/etch a metal layer from the periphery of the workpiece.

Abstract translation: 本发明涉及一种使用与工件的外表面接触的液体导体对半导体工件的表面（晶片，平板，磁性膜等）进行电镀的方法和装置。 液体导体储存在储存器中并通过入口通道泵送到液体室。 液体导体被注入到液体室中，使得液体导体与工件的外表面接触。 还设有可充气管以防止液体导体到达工件的背面。 可以将电镀液施加到工件的前表面，其中保持环/密封件进一步防止电镀溶液和液体导体彼此接触。 在替代实施例中，可以使用已经涂覆有导电材料或包含导电物体的可充气管来形成电接触。 可膨胀管还可以沿着工件的周边提供均匀的接触和压力，这可能不一定是完全平坦的，因为管可以根据工件的周边的形状来适应。 此外，本发明可用于从工件的周边溶解/蚀刻金属层。