公开(公告)号：US20230352161A1

公开(公告)日：2023-11-02

申请号：US18220937

申请日：2023-07-12

Applicant: OLYMPUS CORPORATION

Inventor： Haruna TADAKOSHI ,  Koki TOKUNAGA ,  Yuya ISHIDA ,  Takeo SUZUKI

IPC: G16H40/40 ,  G16H40/67

CPC classification number: G16H40/40 ,  G16H40/67

Abstract: A first acquisition unit acquires first identification information for identifying a first medical device having a first constituent component and a second constituent component. A second acquisition unit acquires the status of the first constituent component incorporated in a second medical device or second identification information for identifying the constituent component incorporated in the second medical device based on the first identification information. A recording unit records the status of the first constituent component or the second identification information and third identification information for identifying the second medical device in association with each other.

公开(公告)号：US20150358518A1

公开(公告)日：2015-12-10

申请号：US14827949

申请日：2015-08-17

Applicant: OLYMPUS CORPORATION

Inventor： Hiroshi ISHII ,  Yuya ISHIDA ,  Kazuhiro KUMEI ,  Kazuyoshi AKIBA

IPC: H04N5/225 ,  A61B1/005 ,  A61B1/05 ,  G02B23/24 ,  H05K1/18

CPC classification number: G02B23/2484 ,  A61B1/0008 ,  A61B1/00124 ,  A61B1/005 ,  A61B1/051 ,  G03B17/02 ,  H04N5/2253 ,  H04N2005/2255 ,  H05K1/189 ,  H05K2201/042 ,  H05K2201/10121

Abstract: An image pickup apparatus includes a solid-state image pickup device chip, an FPC whose terminals are connected to the solid-state image pickup device chip, and a plurality of electronic components mounted on a front surface of the FPC, wherein behind a back face of the solid-state image pickup device chip, the FPC is disposed by being folded in such a way that the FPC will provide mounting surfaces for the plurality of electronic components in a plurality of layers and that the plurality of electronic components will be superimposed via the FPC.

Abstract translation: 图像拾取装置包括固态图像拾取器件芯片，其端子连接到固态图像拾取器件芯片的FPC和安装在FPC的前表面上的多个电子元件，其中在后面 固体摄像器件芯片的FPC通过折叠来设置，使得FPC将为多个电子部件提供多个层的安装表面，并且多个电子部件将经由 FPC。