公开(公告)号：US20230365842A1

公开(公告)日：2023-11-16

申请号：US18043226

申请日：2021-08-26

Applicant: OSAKA SODA CO., LTD.

Inventor： Masatoshi OKUDA ,  Takamichi MORI ,  Ryo KATOU ,  Junichirou MINAMI

IPC: C09J9/02 ,  C09J163/00 ,  C09J5/06

CPC classification number: C09J9/02 ,  C09J163/00 ,  C09J5/06 ,  C08K2003/0806

Abstract: Provided is an electroconductive adhesive with which, when made into an electroconductive adhesive and sintered suitably at low temperature even without pressurization during sintering of the electroconductive adhesive, a sintered body having high denseness and mechanical strength (shear strength) is formed. An electroconductive adhesive containing silver particles A having an average particle size of less than 40 nm, silver particles B having an average particle size in the range of 40 nm to less than 500 nm, silver particles C having an average particle size in the range of 0.5 to less than 5.5 μm, and a solvent, wherein the mass ratio of silver particles A:silver particles B:silver particles C is 1-20:30-60:40-70.

公开(公告)号：US20210346949A1

公开(公告)日：2021-11-11

申请号：US17250764

申请日：2019-09-02

Applicant: OSAKA SODA CO., LTD.

Inventor： Takamichi MORI ,  Junichiro MINAMI ,  Naruhito IWASA ,  Masatoshi OKUDA

IPC: B22F1/00 ,  C09J9/02 ,  C09J11/04

Abstract: The present invention provides silver nanoparticles that form a sintered body having a high shear strength and a low specific resistance when sintered at a low temperature (for example, 200° C. or less), even though the silver nanoparticles have an average particle diameter as large as 200 nm or more. Silver nanoparticles having an average particle diameter of 200 to 600 nm, wherein an exothermic peak due to binding of the silver nanoparticles in thermogravimetry-differential thermal analysis appears at less than 175° C., and a weight loss on heating from 30 to 500° C. by thermogravimetry-differential thermal analysis is 0.4% by weight or less.

公开(公告)号：US20240052213A1

公开(公告)日：2024-02-15

申请号：US18546658

申请日：2022-02-14

Applicant: THE SCHOOL CORPORATION KANSAI UNIVERSITY ,  OSAKA SODA CO., LTD.

Inventor： Hideya KAWASAKI ,  Suguru HASHIDATE ,  Ryo KATOU ,  Takamichi MORI ,  Junichiro MINAMI

IPC: C09J9/02 ,  C09J11/04 ,  C09J163/00

CPC classification number: C09J9/02 ,  C09J11/04 ,  C09J163/00 ,  C09J2301/50

Abstract: Provided is a novel electrically conductive adhesive which can yield a sintered body having low resistivity despite containing a thermosetting resin in addition to silver particles. This electrically conductive adhesive contains silver particles and a thermosetting resin. The silver particles are provided with a protective layer that contains a compound represented by general formula (1).
[In general formula (1), R1 is an alkyl group having 1-5 carbon atoms, and R2 is a hydrogen atom or an alkyl group having 1-5 carbon atoms.]

公开(公告)号：US20230303895A1

公开(公告)日：2023-09-28

申请号：US18040624

申请日：2021-09-03

Applicant: OSAKA SODA CO., LTD.

Inventor： Ryo KATOU ,  Masatoshi OKUDA ,  Junichirou MINAMI ,  Takamichi MORI

IPC: C09J9/02 ,  C09J11/04 ,  C08K3/08

CPC classification number: C09J9/02 ,  C09J11/04 ,  C08K3/08 ,  C08K2003/0806 ,  C08K2201/011

Abstract: The present invention provides an electroconductive adhesive which is desirably sintered at low temperatures even without pressurization during the sintering of the electroconductive adhesive, and which forms a sintered body that has high denseness and high mechanical strength (shear strength) if used as an electroconductive adhesive. An electroconductive adhesive which contains a solvent and silver particles that have an average particle diameter within the range of from 20 nm (inclusive) to 500 nm (exclusive), wherein the moisture content in the electroconductive adhesive is 1,300 ppm or less.

公开(公告)号：US20250084286A1

公开(公告)日：2025-03-13

申请号：US18963230

申请日：2024-11-27

Applicant: Osaka Soda Co., Ltd.

Inventor： Takamichi MORI ,  Junichiro MINAMI ,  Naruhito IWASA

IPC: C09J9/02 ,  C09J5/06 ,  C09J11/06 ,  H01L23/00

Abstract: An electroconductive adhesive comprising a plurality of metal fine particles A that each comprise a protective layer, wherein: (a) the metal fine particles A comprise two or more different types of particles, each coated with a C5-C7 monoalkylamine, wherein the two or more different types of particles comprise: (i) a first type of particle having an average particle diameter of 100-300 nm, and (ii) a second type of particle having an average particle diameter of 30-100 nm; and (b) the protective layer suppresses mutual aggregation of the metal fine particles A. Also disclosed are sintered objects of the electroconductive adhesive, methods of manufacturing the electroconductive adhesive and methods of bonding members with the electroconductive adhesive.

公开(公告)号：US20200172767A1

公开(公告)日：2020-06-04

申请号：US16304098

申请日：2017-05-24

Applicant: Osaka Soda Co., Ltd.

Inventor： Takamichi MORI ,  Junichiro MINAMI ,  Naruhito IWASA

IPC: C09J9/02 ,  C09J11/06 ,  C09J5/06 ,  H01L23/00

Abstract: Provided is an electroconductive adhesive which is less apt to suffer cracking, chipping, etc. upon sintering and gives sintered objects having excellent mechanical strength. The electroconductive adhesive comprises metallic microparticles which include a protective layer comprising one or more amines and have an average particle diameter of 30-300 nm, the amines comprising a C5-7 monoalkylamine and/or an alkoxyamine represented by the following general formula (1). NH2—R2—O—R1 (1) In the protective layer, the ratio of the C5-7 monoalkylamine and/or alkoxyamine represented by the general formula (1) to one or more amines different therefrom is in the range of 100:0 to 10:90. [In formula (1), R1 represents a C1-4 alkyl group and R2 represents a C1-4 alkylene group.]