公开(公告)号：US09554458B2

公开(公告)日：2017-01-24

申请号：US14405823

申请日：2013-06-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Knörr ,  Herbert Brunner

IPC: B23K31/02 ,  H05K1/02 ,  B23K1/00 ,  B23K1/08 ,  B23K1/008 ,  H05K1/18 ,  H01L23/498 ,  H01L23/373

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K1/181 ,  H01L2924/00

Abstract: A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements.

Abstract translation: 用于半导体芯片的安装载体包括用于安装半导体芯片的第二主表面和与第二主表面相对的第一主表面。 安装托架还包括安装体，其中安装体在面向第一主表面的一侧包括第一金属化，第一主表面包括具有多个柱状结构元件的结构。

公开(公告)号：US20150327360A1

公开(公告)日：2015-11-12

申请号：US14405823

申请日：2013-06-12

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Matthias Knörr ,  Herbert Brunner

IPC: H05K1/02 ,  H05K1/18 ,  B23K1/008 ,  B23K1/00 ,  B23K1/08

CPC classification number: H05K1/0271 ,  B23K1/0016 ,  B23K1/008 ,  B23K1/08 ,  H01L23/3735 ,  H01L23/49811 ,  H01L2924/0002 ,  H05K1/181 ,  H01L2924/00

Abstract: A mounting carrier for semiconductor chips includes a second main surface provided for mounting of semiconductor chips, and a first main surface opposite to the second main surface. The mounting carrier also includes a mounting body, wherein the mounting body includes a first metallization on the side facing the first main surface and the first main surface includes a structure having a plurality of columnar structural elements.

Abstract translation: 用于半导体芯片的安装载体包括用于安装半导体芯片的第二主表面和与第二主表面相对的第一主表面。 安装托架还包括安装体，其中安装体在面向第一主表面的一侧包括第一金属化，第一主表面包括具有多个柱状结构元件的结构。

公开(公告)号：US20150228873A1

公开(公告)日：2015-08-13

申请号：US14426072

申请日：2013-08-28

Applicant: OSRAM Opto Semiconductors GmbH

Inventor： Tobias Gebuhr ,  Matthias Knörr ,  Klaus Müller ,  Thomas Schwarz ,  Frank Singer ,  Michael Zitzlsperger

IPC: H01L33/62 ,  H01L21/56 ,  H01L21/48 ,  H01L51/56 ,  H01L51/52

CPC classification number: H01L33/483 ,  H01L21/4828 ,  H01L21/565 ,  H01L23/49861 ,  H01L24/32 ,  H01L25/0753 ,  H01L33/62 ,  H01L51/5237 ,  H01L51/5246 ,  H01L51/5296 ,  H01L51/56 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48471 ,  H01L2224/73265 ,  H01L2224/83192 ,  H01L2224/83385 ,  H01L2224/92247 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/181 ,  H01L2933/0033 ,  H01L2933/0066 ,  Y10T29/49121 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A housing for an optical component is provided in various embodiments. The housing has a leadframe section and a mold compound. The leadframe section is formed from an electrically conductive material and has a first side and a second side facing away from the first side. On the first side, the leadframe section has at least one first receiving region for receiving the optical component and/or at least one contact region for electrically contacting the optical component. The leadframe section has at least one trench which is formed in the leadframe section on the first side thereof alongside the receiving region and/or the contact region. The leadframe section is embedded in the mold compound. The mold compound has at least one receiving recess in which the first receiving region and/or the contact region and the trench are arranged.

Abstract translation: 在各种实施例中提供了用于光学部件的壳体。 壳体具有引线框架部分和模具复合体。 引线框架部分由导电材料形成，并且具有背离第一侧的第一侧和第二侧。 在第一侧，引线框架部分具有用于接收光学部件的至少一个第一接收区域和/或用于电接触光学部件的至少一个接触区域。 引线框架部分具有沿着接收区域和/或接触区域在其第一侧上的引线框架部分中形成的至少一个沟槽。 引线框架部分嵌入模具化合物中。 模具化合物具有至少一个容纳凹槽，其中布置有第一接收区域和/或接触区域和沟槽。