SOLID-STATE IMAGING DEVICE AND DISTANCE-MEASURING IMAGING DEVICE

    公开(公告)号:US20190280030A1

    公开(公告)日:2019-09-12

    申请号:US16421071

    申请日:2019-05-23

    Abstract: A solid-state imaging device includes: an imager including pixels arranged in rows and columns; vertical transfer portions in one-to-one correspondence with columns of the pixels, each of which includes a readout electrode that reads out signal charges generated in the pixels and a transfer electrode that transfers the read-out signal charges in the column direction; and a horizontal transfer portion which transfers, in the row direction, the signal charges transferred by the vertical transfer portions, and outputs the signal charges. The imager is formed by alternately disposing, in the column direction, a first row in which visible light pixels each including a first photoelectric converter that converts visible light into signal charges are arranged adjacent in the row direction and a second row in which infrared light pixels each including a second photoelectric converter that converts infrared light into signal charges are arranged adjacent in the row direction.

    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS INCLUDING SAME

    公开(公告)号:US20200213539A1

    公开(公告)日:2020-07-02

    申请号:US16817145

    申请日:2020-03-12

    Abstract: A solid-state imaging device includes: pixels arranged in a matrix on a semiconductor substrate. Each of the pixels includes: a photoelectric converter that converts received light into a signal charge; at least one read gate that reads the signal charge from the photoelectric converter; charge accumulators that each accumulate the signal charge read by the at least one read gate; and a charge holder that receives, from one of the charge accumulators, transfer of the signal charge accumulated in the charge accumulator, holds the signal charge, and transfers, to one of the charge accumulators, the signal charge held, each of the charge accumulators includes a part of a transfer channel and a part of a transfer electrode overlapping with the part of the transfer channel in a planar view of the semiconductor substrate, and the transfer channel per one pixel comprises transfer channels.

    IMAGING DEVICE, AND SOLID-STATE IMAGING ELEMENT USED FOR SAME

    公开(公告)号:US20180227475A1

    公开(公告)日:2018-08-09

    申请号:US15946270

    申请日:2018-04-05

    Abstract: An imaging device includes: a light source that applies light at a timing according to a light emission control signal; a light receiver that performs exposure to reflected light from an object at different timings according to an exposure control signal, and outputs exposure signals generated as a result of the exposure; a calculator that calculates a distance to the object; and a controller that outputs the light emission control signal and the exposure control signal for any of: modulating a length of a light emission period and an exposure period by increasing or decreasing the number of pulses of each of the light emission control signal and the exposure control signal; and modulating a repetition sequence of the light emission period and the exposure period while maintaining a phase relationship between the light emission control signal and the exposure control signal, randomly or in conformity with a specific rule.

    IMAGE-CAPTURING DEVICE AND DRIVE METHOD THEREFOR
    5.
    发明申请
    IMAGE-CAPTURING DEVICE AND DRIVE METHOD THEREFOR 审中-公开
    图像捕获设备及其驱动方法

    公开(公告)号:US20150341573A1

    公开(公告)日:2015-11-26

    申请号:US14817088

    申请日:2015-08-03

    Abstract: An image-capturing device includes an infrared light source configured to emit infrared light, and a solid-state image-capturing device including a plurality of first pixels configured to convert visible light into signal charge and a plurality of second pixels configured to convert infrared light into signal charge, the plurality of first pixels and the plurality of second pixels being arranged on a semiconductor substrate in a matrix. The solid-state image-capturing device outputs, during the same single frame scanning period, a first signal obtained from the plurality of first pixels, a second signal obtained from the plurality of second pixels during a period of time when the infrared light is emitted, and a third signal obtained from the plurality of second pixels during a period of time when the infrared light is not emitted.

    Abstract translation: 一种图像捕获装置包括被配置为发射红外光的红外光源,以及包括被配置为将可见光转换为信号电荷的多个第一像素的固态图像捕获装置以及被配置为转换红外光的多个第二像素 进入信号电荷,多个第一像素和多个第二像素被布置在矩阵中的半导体衬底上。 固态图像捕获装置在同一单帧扫描周期期间输出从多个第一像素获得的第一信号,在发射红外光的时间段期间从多个第二像素获得的第二信号 以及在不发射红外光的时间段期间从多个第二像素获得的第三信号。

    SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE INCLUDING THE SAME

    公开(公告)号:US20200213550A1

    公开(公告)日:2020-07-02

    申请号:US16813482

    申请日:2020-03-09

    Abstract: A solid-state imaging device includes pixels arranged in matrix form, each including a photoelectric converter and first transfer electrodes, and control lines connected to mutually-corresponding ones of the first transfer electrodes in pixels arranged in a specific row. The pixels include first pixels that receive visible light and second pixels that receive infrared light. Each of floating diffusion layer-including pixels, which are some of the plurality of pixels, further includes a floating diffusion layer and a readout circuit. Each floating diffusion layer-lacking pixel shares the floating diffusion layer with one of the first pixels arranged in a column direction. At least some of the control lines are further connected to the first transfer electrodes of pixels arranged adjacent in the column direction to respective ones of the pixels arranged in the specific row and that share at least one of the floating diffusion layers.

    SOLID-STATE IMAGING DEVICE AND IMAGING DEVICE PROVIDED WITH SAME

    公开(公告)号:US20200213553A1

    公开(公告)日:2020-07-02

    申请号:US16814691

    申请日:2020-03-10

    Abstract: A solid-state imaging device includes a plurality of pixels arranged in matrix form, each pixel including a photoelectric converter and a plurality of first transfer electrodes, and a plurality of control lines connected to mutually-corresponding ones of the first transfer electrodes in a plurality of pixels arranged in a specific row. The plurality of pixels include a plurality of first pixels and second pixels. Each of the first pixels includes a floating diffusion layer and a readout circuit. Each of the second pixels shares the floating diffusion layer with one of the first pixels arranged in a column direction. At least some of the plurality of control lines are further connected to the first transfer electrodes of pixels that are arranged adjacent in the column direction to respective ones of the plurality of pixels arranged in the specific row and that share at least one of the floating diffusion layers.

    SOLID-STATE IMAGING DEVICE AND IMAGING APPARATUS INCLUDING SAME

    公开(公告)号:US20200213540A1

    公开(公告)日:2020-07-02

    申请号:US16817159

    申请日:2020-03-12

    Abstract: A solid-state imaging device includes: a plurality of pixels arranged in a matrix on a semiconductor substrate, wherein each of the plurality of pixels includes: a photoelectric converter that converts received light into a signal charge; a plurality of read gates that each read the signal charge from the photoelectric converter; a plurality of charge accumulators that each accumulate the signal charge read by any one of the plurality of read gates; and a charge holder that receives, from one of the plurality of charge accumulators, transfer of the signal charge accumulated in the charge accumulator, holds the signal charge, and transfers, to one of the plurality of charge accumulators, the signal charge held.

    IMAGE-CAPTURING DEVICE AND DRIVE METHOD THEREFOR

    公开(公告)号:US20190110006A1

    公开(公告)日:2019-04-11

    申请号:US16213920

    申请日:2018-12-07

    Abstract: An image-capturing device includes an infrared light source configured to emit infrared light, and a solid-state image-capturing device including a plurality of first pixels configured to convert visible light into signal charge and a plurality of second pixels configured to convert infrared light into signal charge, the plurality of first pixels and the plurality of second pixels being arranged on a semiconductor substrate in a matrix. The solid-state image-capturing device outputs, during the same single frame scanning period, a first signal obtained from the plurality of first pixels, a second signal obtained from the plurality of second pixels during a period of time when the infrared light is emitted, and a third signal obtained from the plurality of second pixels during a period of time when the infrared light is not emitted.

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