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公开(公告)号：US20230288261A1
公开(公告)日：2023-09-14
申请号：US18019994
申请日：2021-04-12
Inventor： Nobuaki SHIMAMOTO , Nayuta MINAMI
CPC classification number: G01J5/16 , G01J5/0853
Abstract: An infrared sensor includes: a package body; an infrared sensor chip mounted on a front surface of the package body; an outside cap made of metal, having a function of transmitting infrared light as a detection target for the infrared sensor chip, and attached to the package body such that the outside cap is in front of, and covers, the infrared sensor chip; an inside cap made of metal, having a function of transmitting the infrared light as the detection target for the infrared sensor chip, and disposed between the package body and the outside cap such that the inside cap is in front of, and covers the infrared sensor chip; and a ground terminal to be connected to external ground. The outside cap is electrically insulated from the inside cap and the infrared sensor chip. The inside cap is electrically connected to the ground terminal.
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Patent Agency Ranking
公开(公告)号：US20240344888A1
公开(公告)日：2024-10-17
申请号：US18263836
申请日：2021-12-28
Inventor： Ryota SUDO , Nobuaki SHIMAMOTO , Yuichi YAMAMOTO , Takashi HARADA , Yasushi SAKASHITA
CPC classification number: G01J5/0025 , G06T7/70 , G06V20/53 , G06V40/103 , G01J2005/0077 , G06T2207/10048 , G06T2207/30196
Abstract: An aspect of the present disclosure is to accurately estimate whether or not a plurality of people are in close contact with each other in a target space. An estimation system (1) includes a first estimator (12) and a second estimator (13). The first estimator (12) is configured to estimate, based on a heat distribution including a plurality of heat sources detected by at least one infrared sensor (2), three-dimensional positions of heads of a plurality of people in a target space. The second estimator (13) is configured to estimate, based on data on the three-dimensional positions estimated by the first estimator (12), estimate whether or not the plurality of people are in close contact with each other.
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3.发明申请公开(公告)号：US20220408037A1
公开(公告)日：2022-12-22
申请号：US17777484
申请日：2020-09-16
Inventor： Ryota SUDO , Nayuta MINAMI , Nobuaki SHIMAMOTO , Naoki KOBAYASHI , Shoya KIDA
Abstract: An infrared processing system includes a first thermal image generating unit, an object extracting unit, a second thermal image generating unit, and an object temperature calculating unit. The first thermal image generating unit generates, using a first temperature correction value, a first thermal image based on the output signal of the image sensor. The object extracting unit extracts the object from the first thermal image. The second thermal image generating unit generates, using a second temperature correction value corresponding to the object that has been extracted by the object extracting unit, a second thermal image based on the output signal of the image sensor. The object temperature calculating unit calculates, based on the second thermal image that has been generated by the second thermal image generating unit, a temperature of the object that has been extracted by the object extracting unit.
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公开(公告)号：US20220398764A1
公开(公告)日：2022-12-15
申请号：US17783529
申请日：2020-10-16
Inventor： Nobuaki SHIMAMOTO , Nayuta MINAMI
Abstract: A spatial temperature estimation system includes a thermal image acquisition unit and a space temperature estimation unit. The thermal image acquisition unit is configured to detect a temperature of at least one surface of a ceiling, a floor, or a plurality of walls of a room. The space temperature estimation unit is configured to estimate a temperature of air in an interior space of a room with reference to a CRI coefficient relating to the at least one surface and the temperature detected by the thermal image acquisition unit.
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公开(公告)号：US20220252458A1
公开(公告)日：2022-08-11
申请号：US17437640
申请日：2020-02-17
Inventor： Ryota SUDO , Takanori SUGIYAMA , Takaaki HIRAMATSU , Nobuaki SHIMAMOTO , Hiroshi YAMANAKA , Naoki KOBAYASHI
Abstract: A temperature sensing system senses a temperature in the monitor space. The temperature sensing system includes a first detector, a second detector, and a processing unit. The first detector detects a temperature on a ceiling and outputs first information about the temperature on the ceiling. The second detector detects infrared radiation emitted from a floor and outputs second information about the infrared radiation from the floor. The processing unit calculates, based on at least the first information and the second information, a spatial temperature distribution which includes a component in a height direction with respect to the monitor space between the ceiling and the floor.
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公开(公告)号：US20220196481A1
公开(公告)日：2022-06-23
申请号：US17598862
申请日：2020-02-26
Inventor： Shoya KIDA , Nobuaki SHIMAMOTO , Nayuta MINAMI , Isao HATTORI , Naoki KOBAYASHI , Hiroshi YAMANAKA
Abstract: A film structural component is supported by a substrate. The film structural component includes a plurality of thermal infrared detectors arranged in an array. Each of the plurality of thermal infrared detectors includes a thermopile having a plurality of hot junctions and a plurality of cold junctions. An infrared sensor further includes a plurality of heaters and at least one thermometer. The plurality of heaters are provided on the first principal surface of the substrate. The at least one thermometer is provided on the first principal surface of the substrate and is configured to detect a temperature of the substrate. Each of the plurality of heaters faces another heater of the plurality of heaters via a region including the plurality of thermal infrared detectors in plan view in the thickness direction of the substrate.
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