公开(公告)号：US10568201B2

公开(公告)日：2020-02-18

申请号：US16072680

申请日：2017-01-24

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD. ,  TOMOEGAWA CO., LTD.

Inventor： Hiroaki Takahashi ,  Tomoyuki Aoki ,  Kiyotaka Komori ,  Jun Tochihira ,  Ryu Harada

IPC: H05K1/02 ,  H05K1/09 ,  H01B3/30 ,  H01B1/02 ,  H01B3/42 ,  H05K1/03

Abstract: A multilayer printed wiring board has excellent high-frequency characteristics. The multilayer printed wiring board includes one or more conductive layers and one or more insulating layers. In the multilayer printed wiring board, the one or more conductive layers and the one or more insulating layers are alternately stacked. Each insulating layer of the one or more insulating layers includes one or more of a polyolefin resin layer, a fluororesin layer, a polyphenylene ether resin layer, a polyamideimide resin layer, and a polyimide resin layer. At least one insulating layer of the one or more insulating layers includes a polyolefin resin layer.

公开(公告)号：US12006433B2

公开(公告)日：2024-06-11

申请号：US17426917

申请日：2020-01-30

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Kouichi Aoki ,  Tomoyuki Aoki ,  Eiichiro Saito

IPC: C08L71/12 ,  C08F255/06 ,  C08F283/08 ,  H05K3/02 ,  H05K3/46

CPC classification number: C08L71/126 ,  C08F255/06 ,  C08F283/08 ,  C08L2201/02 ,  C08L2205/035 ,  H05K3/022 ,  H05K3/4611 ,  H05K3/4673 ,  H05K2201/0195 ,  C08L71/126 ,  C08L23/16 ,  C08L25/10 ,  C08K3/36 ,  C08K5/49 ,  C08F255/06 ,  C08F226/06 ,  C08F283/08 ,  C08F226/06 ,  C08F283/08 ,  C08F222/103 ,  C08F283/08 ,  C08F212/34 ,  C08F255/06 ,  C08F212/34 ,  C08F255/06 ,  C08F210/16 ,  C08F283/08 ,  C08F210/16 ,  C08F283/08 ,  C08F220/1811 ,  C08F255/06 ,  C08F220/1811

Abstract: The thermosetting resin composition contains a radical polymerizable unsaturated compound and an organic radical compound.