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公开(公告)号:US20230156924A1
公开(公告)日:2023-05-18
申请号:US17914961
申请日:2020-12-24
Inventor: Kazuya SHIMADA , Masahito HAYAMIZU , Toshihiko SAKATA , Makoto CHAKUNO
CPC classification number: H05K3/022 , H05K3/422 , H05K3/426 , H05K3/427 , C23C28/322 , H05K2203/0716 , H05K2203/072 , H05K2203/0723
Abstract: A method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.
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公开(公告)号:US20250161928A1
公开(公告)日:2025-05-22
申请号:US18873950
申请日:2023-12-27
Inventor: Masahito HAYAMIZU , Kazuya SHIMADA , Asuka HIROOKA , Toshihiko SAKATA
Abstract: A method for forming a tin oxide multilayer film with a catalyst layer, the method including preparing a concentrated liquid in which a tin compound is dissolved in a polar solvent; diluting the concentrated liquid with the polar solvent and a fluoride solution to prepare a reaction liquid that is a stable divalent tin solution; immersing a substance to be treated in the reaction liquid to form a tin oxide layer on a surface of the substance to be treated; and immersing the substance to be treated having the tin oxide layer formed on the surface in a catalyst solution containing catalyst metal ions to form a catalyst layer on the tin oxide layer.
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公开(公告)号:US20230389189A1
公开(公告)日:2023-11-30
申请号:US18205318
申请日:2023-06-02
Inventor: Kazuya SHIMADA , Masahito HAYAMIZU , Toshihiko SAKATA , Makoto CHAKUNO
CPC classification number: H05K3/022 , C23C28/322 , H05K3/422 , H05K3/426 , H05K3/427 , H05K2203/0716 , H05K2203/072 , H05K2203/0723
Abstract: Method for forming a metal film includes forming an oxide layer on a to-be-treated surface of a to-be-treated object by bringing the to-be-treated surface into contact with a reaction solution containing fluorine and an oxide precursor, removing fluorine in the oxide layer, supporting a catalyst on the oxide layer by bringing the oxide layer into contact with a catalyst solution, and depositing a metal film on the oxide layer by bringing the oxide layer into contact with an electroless plating liquid.
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