High Voltage Semiconductor Devices and Methods for their Fabrication
    2.
    发明申请
    High Voltage Semiconductor Devices and Methods for their Fabrication 审中-公开
    高压半导体器件及其制造方法

    公开(公告)号:US20160035822A1

    公开(公告)日:2016-02-04

    申请号:US14447157

    申请日:2014-07-30

    摘要: Semiconductor devices include: (a) a semiconductor substrate containing a source region and a drain region; (b) a gate structure supported by the semiconductor substrate between the source region and the drain region; (c) a composite drift region in the semiconductor substrate, the composite drift region extending laterally from the drain region to at least an edge of the gate structure, the composite drift region including dopant having a first conductivity type, wherein at least a portion of the dopant is buried beneath the drain region at a depth exceeding an ion implantation range; and (d) a well region in the semiconductor substrate, wherein the well region has a second conductivity type and wherein the well region is configured to form a channel therein under the gate structure during operation of the semiconductor device. Methods for the fabrication of semiconductor devices are described.

    摘要翻译: 半导体器件包括:(a)含有源极区和漏极区的半导体衬底; (b)在源极区域和漏极区域之间由半导体衬底支撑的栅极结构; (c)所述半导体衬底中的复合漂移区,所述复合漂移区从所述漏极区域横向延伸到所述栅极结构的至少一个边缘,所述复合漂移区域包括具有第一导电类型的掺杂剂,其中至少一部分 掺杂剂以超过离子注入范围的深度埋在漏极区之下; 和(d)半导体衬底中的阱区,其中所述阱区具有第二导电类型,并且其中所述阱区被配置为在所述半导体器件的操作期间在所述栅极结构下方形成沟道。 描述了制造半导体器件的方法。

    DEVICE HAVING A SHIELD PLATE DOPANT REGION AND METHOD OF MANUFACTURING SAME
    4.
    发明申请
    DEVICE HAVING A SHIELD PLATE DOPANT REGION AND METHOD OF MANUFACTURING SAME 有权
    具有屏蔽板区域的装置及其制造方法

    公开(公告)号:US20160181378A1

    公开(公告)日:2016-06-23

    申请号:US14572773

    申请日:2014-12-17

    IPC分类号: H01L29/40 H01L29/66 H01L29/78

    摘要: A transistor includes a surface region, a gate, a source dopant region, a drain dopant region, a drift dopant region, a set of electrically conductive shield plates, and a shield plate dopant region. A sidewall of the gate aligns with a drain side boundary of the surface region. The drain dopant region is within the surface region on the drain side. The drift dopant region is within the surface region between the drain side boundary and the drain dopant region. The set of electrically conductive shield plates includes a first shield plate overlying the drift dopant region. The shield plate dopant region is within the drift dopant region and underlies the set of shield plates.

    摘要翻译: 晶体管包括表面区域,栅极,源极掺杂区域,漏极掺杂区域,漂移掺杂区域,一组导电屏蔽板以及屏蔽板掺杂区域。 栅极的侧壁与表面区域的漏极边界对准。 漏极掺杂剂区域在漏极侧的表面区域内。 漂移掺杂剂区域在漏极侧边界和漏极掺杂剂区域之间的表面区域内。 该组导电屏蔽板包括覆盖漂移掺杂剂区域的第一屏蔽板。 屏蔽板掺杂剂区域在漂移掺杂区域内并且位于该组屏蔽板之下。

    Device having a shield plate dopant region and method of manufacturing same
    5.
    发明授权
    Device having a shield plate dopant region and method of manufacturing same 有权
    具有屏蔽板掺杂剂区域的器件及其制造方法

    公开(公告)号:US09437693B2

    公开(公告)日:2016-09-06

    申请号:US14572773

    申请日:2014-12-17

    摘要: A transistor includes a surface region, a gate, a source dopant region, a drain dopant region, a drift dopant region, a set of electrically conductive shield plates, and a shield plate dopant region. A sidewall of the gate aligns with a drain side boundary of the surface region. The drain dopant region is within the surface region on the drain side. The drift dopant region is within the surface region between the drain side boundary and the drain dopant region. The set of electrically conductive shield plates includes a first shield plate overlying the drift dopant region. The shield plate dopant region is within the drift dopant region and underlies the set of shield plates.

    摘要翻译: 晶体管包括表面区域,栅极,源极掺杂区域,漏极掺杂剂区域,漂移掺杂区域,一组导电屏蔽板以及屏蔽板掺杂区域。 栅极的侧壁与表面区域的漏极边界对准。 漏极掺杂剂区域在漏极侧的表面区域内。 漂移掺杂剂区域在漏极侧边界和漏极掺杂剂区域之间的表面区域内。 该组导电屏蔽板包括覆盖漂移掺杂剂区域的第一屏蔽板。 屏蔽板掺杂剂区域在漂移掺杂区域内并且位于该组屏蔽板之下。