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公开(公告)号：US20240057284A1
公开(公告)日：2024-02-15
申请号：US18055650
申请日：2022-11-15
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN , Tien-Juei CHUANG
IPC: H05K7/20
CPC classification number: H05K7/20263 , H05K7/20272 , H05K7/20318 , H05K7/20718 , H05K7/20254 , H05K7/20763 , H05K7/208
Abstract: A system for cooling a heat-generating electronic component includes a first stage, a second stage, and a heat exchanger. The first stage has a first cooling path that circulates a first cooling fluid past the heat-generating electronic component to cause the first cooling fluid to absorb heat from the heat-generating electronic component and the temperature of the first cooling fluid to increase. The second stage circulates a second cooling fluid to increase a pressure of the second cooling fluid, remove heat from the second cooling fluid to decrease a temperature of the second cooling fluid, and decrease the pressure of the second cooling fluid to further decrease the temperature of the second cooling fluid. The heat exchanger is fluidly connected to the first stage and the second stage, and causes the second cooling fluid to flow past and absorb heat from the first cooling fluid.
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公开(公告)号：US20190219058A1
公开(公告)日：2019-07-18
申请号：US15994667
申请日：2018-05-31
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN
CPC classification number: H05K7/20172 , F04D29/646 , F05B2240/12 , F05B2240/14 , F05B2250/50 , H05K7/20727
Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan assembly that includes an inlet side and an outlet side. The fan assembly also includes an inlet fan guard connector located at the inlet side of the fan assembly and an outlet fan guard connector located at the outlet side of the fan assembly. The fan assembly also includes a lever housings located between the inlet fan guard connector and the outlet fan guard connector and a slots oriented between the lever housings and the inlet fan guard connector and the outlet fan guard connector, the plurality of slots configured to secure an additional modular component.
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公开(公告)号：US20190159361A1
公开(公告)日：2019-05-23
申请号：US15949423
申请日：2018-04-10
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN , Chih-Wei LIN
IPC: H05K7/20 , H05K7/14 , G10K11/162
Abstract: An apparatus is provided that includes a first distal end and a second distal end. The apparatus also includes a first connecting member located at the first distal end and a second connecting member located at the second distal end. The apparatus also includes at least one bracket secured within the apparatus at the first and second connecting members. The bracket includes a flow guiding depressions and micro pores. The apparatus also includes a plate configured to abut the bracket within the apparatus. The first and second connecting members are configured to connect the apparatus within a server device.
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公开(公告)号：US20230071055A1
公开(公告)日：2023-03-09
申请号：US17505109
申请日：2021-10-19
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN , Tien-Juei CHUANG
IPC: H01L23/427 , H01L23/473
Abstract: A nucleate boiling apparatus is disclosed that includes a base configured to fit onto a heat-producing object to provide immersion cooling to the object in a liquid-cooled computing environment. The apparatus further includes first and second pluralities of pipes extending from opposite sides of the base. Each of the first and second pluralities of pipes including a respective transition region and a respective flat region. The first and second pluralities of pipes in the transition regions extend away and up from the base, and the first and second pluralities of pipes in the flat regions extend away from the base in a fanned-out arrangement. The flat region of the second plurality of pipes is at a greater distance from the base than the flat region of the first plurality of pipes.
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公开(公告)号：US20220124919A1
公开(公告)日：2022-04-21
申请号：US17158775
申请日：2021-01-26
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN
Abstract: A system chassis insertable in a rack is disclosed. The system chassis includes a first end panel. The first end panel includes a first base surface, a first component slot, a first plurality of venting apertures, and a first protrusion. The first base surface has a first portion and a second portion. The first component slot is formed on the first portion of the first base surface. The first component slot is configured to receive a first system component. The first plurality of venting apertures is formed on the first portion of the first base surface and surrounding the first component slot. The first protrusion extends from the second portion of the first base surface. The first protrusion includes a second plurality of venting apertures and a second component slot. The second component slot configured to receive a second system component.
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Patent Agency Ranking
公开(公告)号：US20190008075A1
公开(公告)日：2019-01-03
申请号：US15895363
申请日：2018-02-13
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN
Abstract: A faceplate of an apparatus is provided. The faceplate includes a top panel and a front panel. The top panel includes a portion angled towards a front side of the faceplate. The angled portion includes an obtuse angle. The front panel disposed on the front side of the faceplate includes a first face and a second face angled towards the front side of the faceplate. The first face and the second face both include a plurality of holes. The angled portion of the top panel, the angled first face, and the angled second face facilitate an intake/outlet area for air flow across the front side of the front side of the face plate into the plurality of holes.
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公开(公告)号：US20230397361A1
公开(公告)日：2023-12-07
申请号：US17829869
申请日：2022-06-01
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Herman TAN , Tien-Juei CHUANG , Chieh-Ling CHANG
IPC: H05K7/20
CPC classification number: H05K7/20145 , H05K7/20209
Abstract: An air duct is disclosed. The air duct includes a housing for directing air over a plurality of slots within a computer system. The housing includes side housing walls and a top housing wall. The side housing walls are respectively connected to opposing ends of the top housing wall. The side housing walls extend in the same direction from the top housing wall. The air duct further includes a plurality of fins extending from the top housing wall in the same direction as the side housing walls. Each fin of the plurality of fins is arranged on the top housing wall so as to be positioned between adjacent slots of the plurality of slots when the housing is located within the computer system.
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公开(公告)号：US20210324878A1
公开(公告)日：2021-10-21
申请号：US16947526
申请日：2020-08-05
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN
Abstract: A fan guard for a fan container includes a housing and a plurality of wings. The housing has a hollow interior defined by a cylindrical inner surface. The housing extends longitudinally between a first housing end and a second housing end. The plurality of wings is positioned within the hollow interior of the housing. Each wing of the plurality of wings extends radially, from a center of symmetry of the cylindrical inner surface to the cylindrical inner surface. Each wing of the plurality of wings is radially curved between the first housing end and the second housing end.
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公开(公告)号：US20190223317A1
公开(公告)日：2019-07-18
申请号：US15939690
申请日：2018-03-29
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN , Yung-Hsiang LU
CPC classification number: H05K7/20009 , H05F1/00 , H05K7/20145 , H05K7/20709
Abstract: An air duct that can be attached to existing grille of an electronic device to improve airflow and reduce overall system impedance/pressure drop without increasing the power to an air mover. The air duct has a wall configuration to smooth-out airflow while simultaneously delivering more airflow to selected portions of the interior of an electronic device, such as a server.
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公开(公告)号：US20250040099A1
公开(公告)日：2025-01-30
申请号：US18481130
申请日：2023-10-04
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Herman TAN
IPC: H05K7/20
Abstract: The present disclosure relates to a rack unit for circulating coolant to equipment racks. The rack unit has a cold coolant manifold for supplying coolant to an electronic component such as a server. The rack unit has a pump fluidly coupled to the cold coolant manifold for circulating the coolant. The rack unit has a hot coolant manifold for collecting hot coolant from the electronic component. The rack unit has a liquid-to-liquid heat exchanger fluidly coupled to the cold coolant manifold and the hot coolant manifold to form a first coolant loop. The first coolant loop transfers heat to a second coolant loop formed in part by the liquid-to-liquid heat exchanger.
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