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公开(公告)号：US20210092868A1
公开(公告)日：2021-03-25
申请号：US16743958
申请日：2020-01-15
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien Huang , Tsung-Ta LI , Kuo-Wei LEE
Abstract: A fan arrangement to generate increased airflow in a chassis is disclosed. The chassis includes one area having electronic components. A first row of fan modules is located in the chassis relative to the electronic components to generate airflow in a direction of the length of the chassis through the electronic components. The first row of fan modules includes at least one gap between the fan modules. A second row of fan modules is located a predetermined distance from the first row. The second row of fan modules includes at least one gap between the fan modules. Each of the fan modules in the second row is staggered from one of the fan modules of the first row. A first panel connects one of fan modules in the first row with one of the fan modules of the second row to create a channel.
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公开(公告)号：US20200214172A1
公开(公告)日：2020-07-02
申请号：US16393380
申请日：2019-04-24
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Ching-Yu CHEN , Kuo-Wei LEE
IPC: H05K7/20
Abstract: A cold plate base is provided. The cold plate includes a fluid intake region located at a distal end of the cold plate, and a fluid outtake region located at a proximal end of the cold plate that is opposite the distal end. The cold plate also includes a fin region positioned between the fluid intake region and the fluid outtake region. The fin region extends from a base surface of the cold plate base. The cold plate also includes a plurality of protrusions at the fluid intake region. Each of the plurality of protrusions radiates from the fluid intake region to create flow paths across the fin region.
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公开(公告)号：US20190025529A1
公开(公告)日：2019-01-24
申请号：US15876572
申请日：2018-01-22
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuen-Hsien WU , Kuo-Wei LEE
IPC: G02B6/42
Abstract: A transceiver cage and heat sink assembly for an optical switch is disclosed. A transceiver cage has an open front end to receive an optical transceiver and an opposite rear end. A front heat sink is mounted over the transceiver cage that includes a thermal interface material to contact a contact surface of an optical transceiver. A printed circuit board has a connector electronic circuit to receive a connector on the optical transceiver. A rear heat sink has a beveled surface facing the rear end of the transceiver cage. A cam structure in the front heat sink forces the transceiver into contact with the front heat sink. A metal foil layer is coated on the thermal interface material.
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公开(公告)号：US20220377937A1
公开(公告)日：2022-11-24
申请号：US17445374
申请日：2021-08-18
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuo-Wei LEE
IPC: H05K7/20
Abstract: A cold plate for cooling a heat-generating component in a computer system is disclosed. The cold plate includes a lid member with a lower supply manifold housing and a lower collection manifold housing. The cold plate includes a base member having coolant channels defined by fins. Each of the fins have a top section and a bottom section attached to the base member. An interior cavity is defined by an arc-shaped section of the fins, the interior surface of the base, and the lower supply manifold housing. An interior corner is formed by the lower supply manifold housing of the lower manifold housing at the top of the fins to trap debris. An upper inlet manifold has a connector to receive coolant. An upper outlet manifold has a connector to circulate coolant. The upper manifolds are in fluid communication with the collection manifold housings.
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公开(公告)号：US20180376617A1
公开(公告)日：2018-12-27
申请号：US15783043
申请日：2017-10-13
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuen-Hsien WU , Kuo-Wei LEE
IPC: H05K7/20
CPC classification number: H05K7/20336 , G02B6/4269 , H05K7/20272 , H05K7/20781 , H05K7/20809 , H05K7/20818
Abstract: A heat dissipating apparatus for cooling a transceiver is provided. The apparatus includes a cooling jacket configured to receive the transceiver. The transceiver is secured within the cooling jacket via a connecting structure. The apparatus also includes cooling devices secured to an exterior surface of the cooling jacket, the plurality of cooling devices comprising a highly thermal conductivity material. The apparatus also includes a heat dissipation device connected to a distal end of each of the plurality of cooling devices.
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Patent Agency Ranking
公开(公告)号：US20210092877A1
公开(公告)日：2021-03-25
申请号：US16752367
申请日：2020-01-24
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Tsung-Ta LI , Kuo-Wei LEE
Abstract: An equipment assembly for cooling heat-generating electrical components is disclosed. The assembly includes a housing for containing a heat-generating electrical component. The housing includes an open end having a planar area. A closed-loop liquid cooling system includes a liquid coolant conduit in proximity to the heat-generating electrical component. The conduit allows circulation of a liquid coolant to extract heat from the heat-generating electrical component. A heat exchanger is fluidly coupled to the liquid coolant conduit to extract heat from circulated liquid coolant within the heat exchanger. The heat exchanger includes a shaped front facing the open end of the housing. The surface area of the shaped front is greater than the planar area of the open end. An air flow system propels ambient air through the shaped front of the heat exchanger.
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公开(公告)号：US20190024675A1
公开(公告)日：2019-01-24
申请号：US15935853
申请日：2018-03-26
Applicant: QUANTA COMPUTER INC.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuen-Hsien WU , Kuo-Wei LEE
Abstract: A cooling system for providing streamlined airflow is provided. The system includes a fan with a plurality of fan blades configured to rotate in a fan direction. The system also includes a shroud component abutting the fan upstream. The shroud component includes a plurality of blade farings, a spinner faring, and optionally a strut interconnecting each of the plurality of blade farings.
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公开(公告)号：US20240196565A1
公开(公告)日：2024-06-13
申请号：US18192317
申请日：2023-03-29
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Kuo-Wei LEE , Huan-Shu CHIEN
IPC: H05K7/20
CPC classification number: H05K7/20272 , H05K7/20772
Abstract: A cooling distribution system cools an electronic computing device and includes a plurality of hot-swappable pump modules mounted within a distribution unit chassis and configured to circulate a coolant along a main cooling path. A coolant inlet manifold is mounted within the chassis and is fluidly coupled to the pump modules to allow entry of the coolant into the main cooling path. A coolant collection pan collects leaked coolant from the coolant circulating along the main cooling path. A recycle pump is fluidly coupled to form a recycle cooling path between the collection pan and the inlet manifold, and is configured to pump the leaked coolant from the collection pan back to the inlet manifold for recirculating the leaked coolant into the main cooling path.
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公开(公告)号：US20220197353A1
公开(公告)日：2022-06-23
申请号：US17237018
申请日：2021-04-21
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Kuo-Wei LEE
Abstract: A cooling device for a computing system is disclosed. The device includes a heat sink, a base, and a cover. The heat sink includes a plurality of fins extending from a first section of the heat sink. The base includes a plurality of grooves on a first side. The plurality of grooves is configured to mate with at least a portion of the plurality of fins of the heat sink. The cover is configured to be coupled to the base and encapsulate the heat sink. The cover further includes two apertures, each aperture configured to be connected to a tube. A width of the plurality of fins of the heat sink is less than a width of the plurality of grooves of the base. A height of the heat sink is less than a height of an interior portion of the cover.
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公开(公告)号：US20210092879A1
公开(公告)日：2021-03-25
申请号：US16752100
申请日：2020-01-24
Applicant: Quanta Computer Inc.
Inventor： Chao-Jung CHEN , Yu-Nien HUANG , Tsung-Ta LI , Kuo-Wei LEE
Abstract: A cold plate assembly for cooling heat-generating electrical component on a circuit board is disclosed. The cold plate assembly includes a cold plate with a bottom contact surface to thermally contact the heat-generating electrical component. The cold plate has an inlet coupler on an opposite top surface to receive coolant; an internal conduit to circulate the received coolant; and an outlet coupler on the opposite top surface to return the coolant. A flexible metal inlet tube is fluidly connected to the inlet coupler to supply coolant. A flexible metal outlet tube is fluidly connected to the outlet coupler to return coolant.
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