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    Self-heating container
    2.
    发明授权
    Self-heating container 失效
    自供暖容器

    公开(公告)号：US5018505A

    公开(公告)日：1991-05-28

    申请号：US608817

    申请日：1990-11-05

    申请人： Ryoichi Suzuki ,  Kunio Yamauchi ,  Choji Kawabata ,  Akira Takeuchi ,  Koki Ando

    发明人： Ryoichi Suzuki ,  Kunio Yamauchi ,  Choji Kawabata ,  Akira Takeuchi ,  Koki Ando

    IPC分类号： A47J36/30 ,  F24V30/00

    CPC分类号： A47J36/30 ,  F24J1/00

    摘要： A self-heating container comprising a container with a heater fixed therein. The heater includes a pyrogen, a firing agent in contact with and easier to fire than the pyrogen, and an igniter including a rotatably supported striker wheel and a flint mounted for compressive engagement with the wheel. The wheel is rotatably engageable from outside the container.

    摘要翻译： 一种自加热容器，其包括固定有加热器的容器。 加热器包括热原，与热原接触并易于起火的焙烧剂，以及点火器，其包括可旋转地支撑的撞击轮和安装成与车轮压缩接合的火石。 轮可旋转地从容器外部接合。

    Testing method for semiconductor device, testing apparatus therefor, and semiconductor device suitable for the test
    5.
    发明授权
    Testing method for semiconductor device, testing apparatus therefor, and semiconductor device suitable for the test 有权
    用于半导体器件的测试方法，其测试装置以及适于测试的半导体器件

    公开(公告)号：US07465923B2

    公开(公告)日：2008-12-16

    申请号：US11654663

    申请日：2007-01-18

    申请人： Toshiya Nishiumi ,  Koki Ando

    发明人： Toshiya Nishiumi ,  Koki Ando

    IPC分类号： G01N23/00

    CPC分类号： H01J37/295 ,  G01B15/02 ,  G01N23/20058

    摘要： The present invention relates to a method of testing, in the manufacturing process of an LSI (large scale integration) device, a result apparatus therefor, and a cross-sectional microstructure of the LSI device. The method includes thinning a semiconductor chip such that the semiconductor chip includes a substrate crystal and a portion added by the manufacturing process, irradiating an electron beam to the semiconductor chip, detecting an electron beam transmitted through the semiconductor chip to thereby obtain an electron beam diffraction image, removing an electron beam diffracted due to the substrate crystal, and comparing, in the electron beam diffraction image, the thickness of grating stripes obtained from the substrate crystal with the thickness of the portion added by the manufacturing process.

    摘要翻译： 本发明涉及在LSI（大规模集成）器件的制造工艺中的测试方法，其结果装置以及LSI器件的横截面微结构。 该方法包括使半导体芯片变薄，使得半导体芯片包括基板晶体和通过制造工艺添加的部分，向半导体芯片照射电子束，检测透过半导体芯片的电子束，从而获得电子束衍射 去除由于衬底晶体衍射的电子束，并且在电子束衍射图像中比较从衬底晶体获得的光栅条纹的厚度与通过制造过程添加的部分的厚度。

    Testing method for semiconductor device, testing apparatus therefor, and semiconductor device suitable for the test
    6.
    发明申请
    Testing method for semiconductor device, testing apparatus therefor, and semiconductor device suitable for the test 有权
    用于半导体器件的测试方法，其测试装置以及适于测试的半导体器件

    公开(公告)号：US20070114410A1

    公开(公告)日：2007-05-24

    申请号：US11654663

    申请日：2007-01-18

    申请人： Toshiya Nishiumi ,  Koki Ando

    发明人： Toshiya Nishiumi ,  Koki Ando

    IPC分类号： G21K7/00 ,  G01N23/00

    CPC分类号： H01J37/295 ,  G01B15/02 ,  G01N23/20058

    摘要： The present invention relates to a method of testing, in the manufacturing process of an LSI (large scale integration) device, a result obtained by the manufacturing process, a testing apparatus therefor, and a semiconductor device suitable for the test. The present invention relates, in particular, to a testing method used to immediately and accurately perform a test of the cross-sectional microstructure of an LSI device obtained by the manufacturing process. The above testing method is characterized by including a sample production step of thinning a semiconductor chip such that the semiconductor chip includes a substrate crystal and a portion added by the manufacturing process, a step of irradiating an electron beam to the semiconductor chip, a step of detecting an electron beam transmitted through the semiconductor chip to thereby obtain an electron beam diffraction image, a step of removing an electron beam diffracted due to the substrate crystal, and a step of comparing, in the electron beam diffraction image, the thickness of grating stripes obtained from the substrate crystal with the thickness of the portion added by the manufacturing process.

    摘要翻译： 本发明涉及在LSI（大规模集成）装置的制造工艺中测试通过制造过程获得的结果，其测试装置和适用于该测试的半导体器件的方法。 本发明特别涉及一种用于立即且准确地进行通过制造工艺获得的LSI器件的横截面微结构测试的测试方法。 上述测试方法的特征在于包括：将半导体芯片变薄以使得半导体芯片包括基板晶体和通过制造工艺添加的部分的样品制备步骤，向半导体芯片照射电子束的步骤， 检测通过半导体芯片透射的电子束，从而获得电子束衍射图像，去除由于衬底晶体衍射的电子束的步骤，以及在电子束衍射图像中比较光栅条纹的厚度 通过制造工艺加入的部分的厚度从基板晶体获得。

    Self-heating container
    7.
    发明授权
    Self-heating container 失效
    自供暖容器

    公开(公告)号：US5299556A

    公开(公告)日：1994-04-05

    申请号：US525464

    申请日：1990-05-18

    申请人： Koki Ando

    发明人： Koki Ando

    IPC分类号： B65D81/34 ,  A47J36/28 ,  A47J36/30 ,  F23Q1/00 ,  F23Q1/02 ,  F24V30/00 ,  F24J1/00

    CPC分类号： A47J36/30 ,  F23Q1/02 ,  F24J1/00

    摘要： A self-heating container comprises an outer casing (56) having a bottom wall (60) an inner casing (64) secured within the outer casing and a heat-generating material (72) contained in the inner casing. The container includes also a vertical shaft (38) journalled within the inner casing and having a lower end extending out of the bottom wall of the outer casing, a sparking wheel (36) having an abrasive surface and secured to the shaft adjacent the heat-generating material and a flint (40) supported by the inner casing and pressed against the abrasive surface to generate sparks when the wheel is caused to rotate. A horizontal shaft (82) is journalled to the outer casing and adapted to be rotated, and gear means (78,80) couples the vertical shaft (38) and the horizontal shaft (82).

    摘要翻译： 自加热容器包括具有底壁（60）的外壳（56），固定在外壳内的内壳（64）和容纳在内壳中的发热材料（72）。 所述容器还包括一个垂直轴（38），其轴颈安装在所述内壳体内并且具有延伸出所述外壳底壁的下端;火花轮（36），具有研磨表面，并且固定在所述轴上， 产生材料和由内壳支撑并且当轮被旋转时被压靠在研磨表面上以产生火花的火石（40）。 水平轴（82）被轴颈支撑到外壳并适于旋转，并且齿轮装置（78,80）联接垂直轴（38）和水平轴（82）。

    Lid of a receptacle for instant cooking food
    8.
    发明授权
    Lid of a receptacle for instant cooking food 失效
    盖上即时烹饪食物的容器

    公开(公告)号：US4020969A

    公开(公告)日：1977-05-03

    申请号：US669974

    申请日：1976-03-24

    申请人： Koki Ando

    发明人： Koki Ando

    IPC分类号： B65D77/20 ,  B65D81/00 ,  B65D85/816 ,  B65D41/02 ,  B65D41/32

    CPC分类号： B65D85/816 ,  B65D77/206 ,  B65D2577/205 ,  B65D2577/2091

    摘要： A lid for a receptacle containing instant-cooking foods. The lid has an upper layer attached to a lower layer, and one of the layers is either perforated to be easily rupturable or has at least one opening therethrough. Furthermore, the upper layer has at least one portion extending beyond the edge of the lower layer.

    摘要翻译： 用于容纳即食烹饪食物的容器的盖子。 盖子具有连接到下层的上层，并且其中一层被穿孔以容易地破裂或者具有穿过其中的至少一个开口。 此外，上层具有延伸超过下层边缘的至少一个部分。

    Inner lid of a receptacle for instant-cooking foods
    9.
    发明授权
    Inner lid of a receptacle for instant-cooking foods 失效
    用于即食烹饪的容器的内盖

    公开(公告)号：US4018355A

    公开(公告)日：1977-04-19

    申请号：US641039

    申请日：1975-12-15

    申请人： Koki Ando

    发明人： Koki Ando

    IPC分类号： A47J19/00 ,  A47J36/08 ,  A47J36/20 ,  B65D51/28 ,  B65D81/00 ,  B65D81/32 ,  B65D85/816 ,  B65D1/34 ,  A47G19/22

    CPC分类号： B65D85/816 ,  B65D51/28 ,  B65D81/3216

    摘要： A lid which has a bottom portion and an upwardly extending sidewall surrounding the bottom portion and which is to be removably fitted within the inside walls of a receptacle. The sidewall portion is formed with a plurality of longitudinal grooves, whereby when the lid is fitted into the receptacle, a passageway is created which connects the interior of the receptacle beneath said bottom portion with the exterior of said receptacle above said bottom portion. The lid may be made of heat-resistant plastic.

    摘要翻译： 盖子，其具有围绕底部的底部和向上延伸的侧壁，并且可拆卸地装配在容器的内壁内。 侧壁部分形成有多个纵向凹槽，由此当将盖子装配到容器中时，产生一个通道，其将所述底部下方的容器的内部与所述底部的所述容器的外部连接。 盖可以由耐热塑料制成。