公开(公告)号：US20240222028A1

公开(公告)日：2024-07-04

申请号：US18127808

申请日：2023-03-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Da Mi KIM ,  Bum Suk KANG ,  Su Jin LEE ,  Dae Woo YOON

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/2325

Abstract: A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the third and fourth surfaces of the body and connected to the internal electrodes. At least one of the internal electrodes includes an interfacial layer disposed on at least a portion of a region connected to the external electrode, and the interfacial layer includes an oxide containing Fe.

公开(公告)号：US20230133669A1

公开(公告)日：2023-05-04

申请号：US17702223

申请日：2022-03-23

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Woo YOON ,  Su Jin LEE ,  Da Mi KIM ,  Bum Suk KANG ,  Seong Han PARK ,  Jeong Ryeol KIM

IPC: H01G4/008 ,  H01G4/248 ,  C03C4/14 ,  C03C8/18 ,  C03C8/04 ,  C03C3/066 ,  C03C3/093

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

公开(公告)号：US20240258030A1

公开(公告)日：2024-08-01

申请号：US18635700

申请日：2024-04-15

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Woo YOON ,  Su Jin LEE ,  Da Mi KIM ,  Bum Suk KANG ,  Seong Han PARK ,  Jeong Ryeol KIM

IPC: H01G4/008 ,  C03C3/066 ,  C03C3/093 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01G4/248 ,  H01G4/30

CPC classification number: H01G4/008 ,  C03C3/066 ,  C03C3/093 ,  C03C4/14 ,  C03C8/04 ,  C03C8/18 ,  H01G4/248 ,  C03C2204/00 ,  H01G4/30

Abstract: A capacitor component includes a body, including a dielectric layer and an internal electrode layer, and an external electrode disposed on one surface of the body. The external electrode includes a conductive base and a glass disposed in the conductive base, and the glass includes 0.01 wt % or more to 5.8 wt % or less of nitrogen (N) based on a total weight of the glass.

公开(公告)号：US20240161976A1

公开(公告)日：2024-05-16

申请号：US18121247

申请日：2023-03-14

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Dae Woo YOON ,  Bum Suk KANG ,  Da Mi KIM ,  Su Jin LEE

IPC: H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/30

CPC classification number: H01G4/008 ,  H01G4/012 ,  H01G4/1227 ,  H01G4/30

Abstract: A multilayer electronic component according to an embodiment of the present disclosure includes: a body including a dielectric layer and internal electrodes; and an electrode layer disposed on the body and connected to the internal electrodes; and the electrode layer includes Cu particles and glass, wherein oxides including Cu is disposed on at least a portion of the interface between the Cu particles and the glass.

公开(公告)号：US20240420895A1

公开(公告)日：2024-12-19

申请号：US18814950

申请日：2024-08-26

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bum Suk KANG ,  Su Jin LEE ,  Dae Woo YOON ,  Da Mi KIM ,  Jeong Ryeol KIM

IPC: H01G4/30 ,  H01G4/008 ,  H01G4/012 ,  H01G4/12 ,  H01G4/232

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.

公开(公告)号：US20230162921A1

公开(公告)日：2023-05-25

申请号：US17707390

申请日：2022-03-29

Applicant: SAMSUNG ELECTRO-MECHANICS CO., LTD.

Inventor： Bum Suk KANG ,  Su Jin LEE ,  Dae Woo YOON ,  Da Mi KIM ,  Jeong Ryeol KIM

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12

CPC classification number: H01G4/30 ,  H01G4/012 ,  H01G4/008 ,  H01G4/12

Abstract: A ceramic electronic component includes a body including a dielectric layer and an internal electrode; an external electrode disposed on the body; and a bonding layer disposed between the body and the external electrode. The bonding layer has a thickness less than a thickness of the external electrode.