MULTILAYER ELECTRONIC COMPONENT
    1.
    发明公开

    公开(公告)号:US20240222028A1

    公开(公告)日:2024-07-04

    申请号:US18127808

    申请日:2023-03-29

    CPC classification number: H01G4/30 H01G4/008 H01G4/012 H01G4/12 H01G4/2325

    Abstract: A multilayer electronic component is provided, the multilayer electronic component, including: a body including a dielectric layer and internal electrodes alternately disposed with the dielectric layer interposed therebetween in a first direction, the body having first and second surfaces opposing each other in the first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction, fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other in a third direction; and an external electrode disposed on the third and fourth surfaces of the body and connected to the internal electrodes. At least one of the internal electrodes includes an interfacial layer disposed on at least a portion of a region connected to the external electrode, and the interfacial layer includes an oxide containing Fe.

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