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公开(公告)号：US20230178299A1
公开(公告)日：2023-06-08
申请号：US17979973
申请日：2022-11-03
发明人： Younghun Lee , Beomjoon Cho , Gyeong Ju Song , Won Young Jang , Jihong Jo
摘要： An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, and a frame terminal having a supporting portion disposed on the external electrode, and a mounting portion disposed at one end of the supporting portion. The supporting portion has a concave portion spaced apart from the mounting portion and having a distance to the mounting portion less than a distance from the capacitor boy to the mounting portion.
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公开(公告)号：US11587729B2
公开(公告)日：2023-02-21
申请号：US17469164
申请日：2021-09-08
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US11721481B2
公开(公告)日：2023-08-08
申请号：US17343321
申请日：2021-06-09
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes: a body; first and second external electrodes including first and second head portions disposed on opposite end surfaces of the body; and first and second metal frames, the first metal frame including a first support portion bonded to the first head portion, and a first mounted portion extending from the first support portion, and the second metal frame including a second support portion bonded to the second head portion, and a second mounted portion extending from the second support portion. 0.2A≤B≤0.8A, in which an area of each of the first and second head portions is A, and an area of each of a region in which the first head portion and the first support portion are bonded to each other, and a region in which the second head portion and the second support portion are bonded to each other is B.
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公开(公告)号：US20220093338A1
公开(公告)日：2022-03-24
申请号：US17325357
申请日：2021-05-20
发明人： Young Heon Lee , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes: a capacitor body; a pair of external electrodes disposed on opposite end surfaces of the capacitor body, respectively; and a pair of metal frames respectively including a pair of connected portions connected to the pair of external electrodes, respectively, and a pair of mounted portions bent at and extending from one ends of the pair of connected portions, respectively, wherein corners of end portions of the pair of mounted portions facing each other have a curved surface.
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公开(公告)号：US20230282422A1
公开(公告)日：2023-09-07
申请号：US18196257
申请日：2023-05-11
发明人： Gyeong Ju Song , Beom Joon Cho , Seung Min Ahn
CPC分类号： H01G4/30 , H01G4/012 , H01G2/065 , H01G4/232 , H01G4/1209
摘要： There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
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公开(公告)号：US11749460B2
公开(公告)日：2023-09-05
申请号：US17333817
申请日：2021-05-28
发明人： Gyeong Ju Song , Beom Joon Cho , Seung Min Ahn
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/1209 , H01G4/232
摘要： There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
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公开(公告)号：US20230178304A1
公开(公告)日：2023-06-08
申请号：US17975828
申请日：2022-10-28
发明人： Gyeong Ju Song , Beomjoon Cho , Younghun Lee , Jihong Jo , Seungmin Ahn
CPC分类号： H01G4/30 , H01G4/012 , H01G4/224 , H01G4/228 , H01G4/1227
摘要： An electronic component includes a multilayer capacitor including a capacitor body including a dielectric layer and an internal electrode, and an external electrode disposed on one surface of the capacitor body, a frame terminal disposed on the external electrode, and a conductive bonding portion disposed between the external electrode and the frame terminal. The frame terminal has a groove portion extending along an outer periphery of an area in contact with the conductive bonding portion.
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公开(公告)号：US20220181078A1
公开(公告)日：2022-06-09
申请号：US17469164
申请日：2021-09-08
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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公开(公告)号：US12087512B2
公开(公告)日：2024-09-10
申请号：US18196257
申请日：2023-05-11
发明人： Gyeong Ju Song , Beom Joon Cho , Seung Min Ahn
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/1209 , H01G4/232
摘要： There are provided an electronic component and a board including the same. The electronic component includes: a capacitor body; a pair of external electrodes respectively disposed on both ends of the capacitor body; and a pair of metal frames including a pair of connection portions connected to the pair of external electrodes, respectively, and a pair of mounting portions connected to the pair of connection portions, respectively. A bottom surface of one of the pair of mounting portions has roughness.
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公开(公告)号：US11837404B2
公开(公告)日：2023-12-05
申请号：US18098280
申请日：2023-01-18
发明人： Sang Yeop Kim , Beom Joon Cho , Gyeong Ju Song
CPC分类号： H01G2/06 , H01G4/2325 , H01G4/30
摘要： An electronic component includes a multilayer capacitor including a body and an external electrode disposed externally on the body; a metal frame coupled to the multilayer capacitor; and an adhesive layer disposed between the external electrode and the metal frame and including a solder layer and a conductive resin layer.
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