COIL COMPONENT
    1.
    发明申请
    COIL COMPONENT 审中-公开
    线圈组件

    公开(公告)号:US20140333404A1

    公开(公告)日:2014-11-13

    申请号:US14322628

    申请日:2014-07-02

    IPC分类号: H01F27/28 H01F27/29

    CPC分类号: H01F27/292 H01F17/0013

    摘要: Disclosed herein is a coil component including: an insulating layer containing a ferrite powder and a coil electrode embedded in the insulating layer, in which a particle diameter of the ferrite powder is smaller than a wavelength of light which is used during an exposure process, thereby increasing permeability and improving an impedance characteristic.

    摘要翻译: 这里公开了一种线圈部件,其包括:绝缘层,其包含铁氧体粉末和嵌入绝缘层中的线圈电极,其中铁氧体粉末的粒径小于在曝光过程中使用的光的波长,由此 提高磁导率和改善阻抗特性。

    HYBRID CAPACITOR
    2.
    发明申请
    HYBRID CAPACITOR 审中-公开
    混合电容器

    公开(公告)号:US20140313635A1

    公开(公告)日:2014-10-23

    申请号:US14321399

    申请日:2014-07-01

    IPC分类号: H01G11/06

    摘要: Embodiments of the invention provide a hybrid capacitor that includes a cathode, an anode, a separator and an electrolyte solution. The hybrid capacitor includes a first structure including a cathode containing activated carbon and an anode containing lithium, and a second structure including activated carbon layers formed on both surfaces of a current collector.

    摘要翻译: 本发明的实施例提供了包括阴极,阳极,隔膜和电解质溶液的混合电容器。 混合电容器包括包括含有活性炭的阴极和含锂阳极的第一结构,以及包括形成在集电体的两个表面上的活性炭层的第二结构。

    COMMON MODE NOISE CHIP FILTER AND METHOD FOR PREPARING THEREOF
    3.
    发明申请
    COMMON MODE NOISE CHIP FILTER AND METHOD FOR PREPARING THEREOF 审中-公开
    共通模式噪声芯片滤波器及其制备方法

    公开(公告)号:US20140152402A1

    公开(公告)日:2014-06-05

    申请号:US13843717

    申请日:2013-03-15

    IPC分类号: H03H7/01

    摘要: Disclosed herein are a common mode noise chip filter and a method for preparing thereof, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer composite layer on the substrate provided with the coil patterns, wherein the ferrite-polymer composite layer includes spherical ferrite particles and flake shaped ferrite particles.

    摘要翻译: 这里公开了共模噪声芯片滤波器及其制备方法,该共模噪声芯片滤波器包括:铁氧体衬底; 在铁素体基板上形成的线圈图案; 在设置有线圈图案的基板上的铁素体 - 高分子复合层,其中铁氧体 - 聚合物复合层包括球形铁氧体颗粒和片状铁素体颗粒。

    COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME
    5.
    发明申请
    COMMON MODE FILTER AND METHOD OF MANUFACTURING THE SAME 审中-公开
    共模滤波器及其制造方法

    公开(公告)号:US20140203900A1

    公开(公告)日:2014-07-24

    申请号:US14158650

    申请日:2014-01-17

    IPC分类号: H01F17/04 H01F41/12

    摘要: Disclosed herein is a common mode filter including: a magnetic substrate; an electrode layer disposed on one surface of the magnetic substrate and formed of a coil electrode and an insulating resin enclosing the coil electrode; and an uneven layer disposed between the magnetic substrate and the electrode and formed of a groove and a projection, wherein a part of the insulating resin is depressed between the groove of the uneven layer, whereby an adhesion between the magnetic substrate and the insulating resin is increased.

    摘要翻译: 这里公开了一种共模滤波器,包括:磁性基板; 电极层,设置在所述磁性基板的一个表面上,由线圈电极和包围所述线圈电极的绝缘树脂形成; 以及设置在磁性基板和电极之间并由凹槽和突起形成的不平坦层,其中绝缘树脂的一部分被凹陷在凹凸层的凹槽之间,由此磁性基板和绝缘树脂之间的粘合力是 增加。

    COMMON MODE NOISE FILTER
    7.
    发明申请
    COMMON MODE NOISE FILTER 审中-公开
    通用模式噪声滤波器

    公开(公告)号:US20140002231A1

    公开(公告)日:2014-01-02

    申请号:US13827661

    申请日:2013-03-14

    IPC分类号: H01F3/08

    摘要: Disclosed herein is a common mode noise filter independently including ferrite powder having pores formed in a surface thereof or including at least two kinds of ferrite powder having different particle sizes as a magnetic layer.According to the present invention, the adhesive strength between the polymer binder and the ferrite powder that are included in the magnetic layer is improved, such that at the time of manufacturing or mounting of a chip, a defect such as a crack generated by a thermal impact due to a lack of adhesive strength between the ferrite powder and the polymer binder may be suppressed, thereby securing the reliability with respect to the thermal impact.

    摘要翻译: 本文公开了一种共模噪声滤波器,其独立地包括在其表面形成有孔的铁氧体粉末或者包括至少两种具有不同粒径的铁氧体粉末作为磁性层。 根据本发明,包含在磁性层中的聚合物粘合剂和铁氧体粉末之间的粘合强度得到改善,使得在制造或安装芯片时,由热量产生的裂纹等缺陷 可以抑制由于铁氧体粉末和聚合物粘合剂之间的粘合强度的不足而引起的冲击,从而确保了相对于热冲击的可靠性。

    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME
    8.
    发明申请
    ELECTRONIC COMPONENT AND METHOD OF MANUFACTURING THE SAME 审中-公开
    电子元件及其制造方法

    公开(公告)号:US20140159849A1

    公开(公告)日:2014-06-12

    申请号:US14101496

    申请日:2013-12-10

    IPC分类号: H01F27/29 H01F41/10

    摘要: Disclosed herein are an electronic component and a method of manufacturing the same. In the electronic component having a hexahedral shape and including an insulating portion formed on an upper part of a base substrate, a coil pattern portion formed in the insulating portion and wound with a conductive wire, and a plurality of external electrodes separated from each other and electrically connected with the coil pattern portion, each external electrode covers a part of an upper surface of the insulating portion and extending to an upper surface of the electronic component and a region between the external electrodes is provided with a ferrite block covering an exposed surface of the insulating portion, thereby improving magnetic permeability as compared with the electronic component of the related art.

    摘要翻译: 这里公开的是电子部件及其制造方法。 在具有六面体形状并且包括形成在基底基板的上部上的绝缘部分的电子部件中,形成在绝缘部分中并缠绕有导线的线圈图案部分和彼此分离的多个外部电极以及 与线圈图案部电连接,每个外部电极覆盖绝缘部分的上表面的一部分并延伸到电子部件的上表面,并且外部电极之间的区域设置有铁氧体块,该铁氧体块覆盖 绝缘部分,从而与现有技术的电子部件相比提高磁导率。

    THIN FILM TYPE CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME
    9.
    发明申请
    THIN FILM TYPE CHIP DEVICE AND METHOD OF MANUFACTURING THE SAME 审中-公开
    薄膜型芯片装置及其制造方法

    公开(公告)号:US20140145814A1

    公开(公告)日:2014-05-29

    申请号:US14086152

    申请日:2013-11-21

    IPC分类号: H01F27/28

    CPC分类号: H01F17/0013 H01F2017/0066

    摘要: Disclosed herein is a thin film type chip device including a coil pattern formed on the substrate; a cavity defining pattern defining a cavity through which a part of the coil pattern is exposed; a filling layer filled in the cavity; and a magnetic layer including a surface layer covering a surface of the filling layer.

    摘要翻译: 这里公开了一种薄膜型芯片装置,其包括形成在基板上的线圈图案; 限定图案的空腔限定图案,所述线圈图案的一部分通过所述腔暴露; 填充在空腔中的填充层; 以及包括覆盖填充层的表面的表面层的磁性层。

    COMMON MODE NOISE CHIP FILTER AND METHOD FOR MANUFACTURING THE SAME
    10.
    发明申请
    COMMON MODE NOISE CHIP FILTER AND METHOD FOR MANUFACTURING THE SAME 审中-公开
    通用模式噪声芯片滤波器及其制造方法

    公开(公告)号:US20140145797A1

    公开(公告)日:2014-05-29

    申请号:US13842789

    申请日:2013-03-15

    IPC分类号: H03H7/01

    摘要: Disclosed herein are a common mode noise chip filter and a method for manufacturing the same, the common mode noise chip filter including: a ferrite substrate; coil patterns formed on the ferrite substrate; and a ferrite-polymer complex layer formed on the result substrate having the coil patterns formed therein, wherein the ferrite-polymer complex layer has a multilayer structure, so that the ferrite-polymer complex layer filling an inner space of the substrate having inner coil patterns is formed to have the multilayer structure but not a single-layer structure, thereby lowering internal stress, and thus improving reliability of the common mode noise chip filter as a product.

    摘要翻译: 这里公开了共模噪声芯片滤波器及其制造方法,该共模噪声芯片滤波器包括:铁氧体基板; 在铁素体基板上形成的线圈图案; 以及形成在其上形成有线圈图案的结果基板上的铁氧体 - 聚合物复合层,其中铁氧体 - 聚合物复合层具有多层结构,使得铁氧体 - 聚合物复合层填充具有内部线圈图案的基板的内部空间 形成为具有多层结构而不是单层结构,从而降低内应力,从而提高作为产品的共模噪声芯片滤波器的可靠性。