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公开(公告)号：US20220223348A1
公开(公告)日：2022-07-14
申请号：US17706777
申请日：2022-03-29
发明人： Won Kuen Oh , Hye Hun Park , Tae Gyeom Lee
摘要： A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
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公开(公告)号：US20210065984A1
公开(公告)日：2021-03-04
申请号：US16778965
申请日：2020-01-31
发明人： Won Kuen Oh , Hye Hun Park , Tae Gyeom Lee
摘要： A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
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公开(公告)号：US11948744B2
公开(公告)日：2024-04-02
申请号：US17716202
申请日：2022-04-08
发明人： Seo Won Jung , Won Kuen Oh , Gyu Ho Yeon , Seo Ho Lee
CPC分类号： H01G4/008 , H01G4/2325 , H01G4/248 , H01G4/30
摘要： A multilayer electronic component includes a body including a dielectric layer and internal electrodes disposed alternately with the dielectric layer therebetween and including first and second surfaces opposing each other in a first direction, third and fourth surfaces opposing each other in a second direction, and external electrodes disposed on the body. One end of each internal electrode is connected to the third or fourth surface. The external electrodes include a first electrode layer disposed on the third and fourth surfaces and including a conductive metal and a second electrode layer disposed on the first electrode layer, including silver (Ag) and glass, and further including one or more of palladium (Pd), platinum (Pt), and gold (Au), and the first electrode layer is disposed to cover all of one end of each internal electrode connected to the third and fourth surfaces and does not extend to the other surfaces.
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公开(公告)号：US11721485B2
公开(公告)日：2023-08-08
申请号：US17704741
申请日：2022-03-25
发明人： Hye Hun Park , Won Kuen Oh , Tae Gyeom Lee , Ji Hong Jo
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic electronic component includes a ceramic body including a dielectric layer and an internal electrode, an electrode layer connected to the internal electrode, and a conductive resin layer disposed on the electrode layer. The conductive resin layer includes a conductive metal, a metal having a lower melting point than the conductive metal, a conductive carbon, and a base resin. The metal having the lower melting point than the conductive metal is tin (Sn). The conductive metal of the conductive resin layer includes at least one of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).
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公开(公告)号：US20230197343A1
公开(公告)日：2023-06-22
申请号：US17725246
申请日：2022-04-20
发明人： Gyu Ho Yeon , Won Kuen Oh , Seo Won Jung
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic capacitor includes a body including a dielectric layer and internal electrodes and external electrodes disposed on one surface of the body, wherein the external electrodes respectively include a first electrode layer connected to the internal electrodes and including copper (Cu); a second electrode layer disposed on the first electrode layer and including silver (Ag) and palladium (Pd); and a copper-palladium intermetallic compound formed at an interface between the first electrode layer and the second electrode layer, wherein the second electrode layer includes a first layer and a second layer formed to be sequentially adjacent to the first electrode layer, and the first layer has a content of palladium higher than a content of palladium of the second layer.
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公开(公告)号：US11676766B2
公开(公告)日：2023-06-13
申请号：US17706777
申请日：2022-03-29
发明人： Won Kuen Oh , Hye Hun Park , Tae Gyeom Lee
CPC分类号： H01G4/30 , H01G2/065 , H01G4/012 , H01G4/1209
摘要： A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
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公开(公告)号：US12087509B2
公开(公告)日：2024-09-10
申请号：US17725246
申请日：2022-04-20
发明人： Gyu Ho Yeon , Won Kuen Oh , Seo Won Jung
CPC分类号： H01G4/2325 , H01G4/30
摘要： A multilayer ceramic capacitor includes a body including a dielectric layer and internal electrodes and external electrodes disposed on one surface of the body, wherein the external electrodes respectively include a first electrode layer connected to the internal electrodes and including copper (Cu); a second electrode layer disposed on the first electrode layer and including silver (Ag) and palladium (Pd); and a copper-palladium intermetallic compound formed at an interface between the first electrode layer and the second electrode layer, wherein the second electrode layer includes a first layer and a second layer formed to be sequentially adjacent to the first electrode layer, and the first layer has a content of palladium higher than a content of palladium of the second layer.
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公开(公告)号：US11887789B2
公开(公告)日：2024-01-30
申请号：US17725105
申请日：2022-04-20
发明人： Won Kuen Oh , Gyu Ho Yeon , Seo Won Jung
CPC分类号： H01G4/2325 , H01G2/065 , H01G4/30
摘要： A multilayer electronic component includes: a body including a dielectric layer, first and second internal electrodes, alternately disposed with the dielectric layer interposed therebetween, first and second surfaces opposing each other in a first direction, third and fourth surfaces connected to the first and second surfaces and opposing each other in a second direction; and an external electrode disposed on the third or fourth surface of the body. The external electrode includes first electrode layers connected to the internal electrodes and containing copper (Cu), second electrode layers, disposed on the first electrode layers, contain copper (Cu) and silver (Ag), and further contain at least one of palladium (Pd), platinum (Pt), and gold (Au), and third electrode layers that are disposed on the second electrode layers and contain silver (Ag), and an average thickness of the third electrode layers may be 3 μm or more and 15 μm or less.
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公开(公告)号：US11842856B2
公开(公告)日：2023-12-12
申请号：US17707384
申请日：2022-03-29
发明人： Hye Won Kim , Won Kuen Oh , Chae Dong Lee , Og Soon Kim , Jung Won Park
摘要： A multilayer electronic component includes a body including a dielectric layer and internal electrodes and external electrodes disposed on the body and connected to the internal electrodes, wherein the external electrodes include a first electrode layer disposed on the body and including Cu and glass, a second electrode layer disposed on the first electrode layer and including Ni and Cu, and a third electrode layer disposed on the second electrode layer and including Ni and glass.
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公开(公告)号：US11322305B2
公开(公告)日：2022-05-03
申请号：US16778965
申请日：2020-01-31
发明人： Won Kuen Oh , Hye Hun Park , Tae Gyeom Lee
摘要： A multilayer capacitor includes a capacitor body having first through six surfaces, and having alternately stacked first internal electrodes and second internal electrodes having dielectric layers therebetween and each having one end thereof exposed through a respective one of third and fourth surfaces. First and second conductive layers respectively include first and second connection portions respectively disposed on the third and fourth surfaces of the capacitor body and respectively connected to the first and second internal electrodes, and first and second band portions respectively extending from the first and second connection portions to respective portions of the first, second, fifth, and sixth surfaces of the capacitor body. First and second reinforcing layers each include a carbon material and an impact-absorbing binder and are respectively disposed on the first and second band portions.
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