HEATING MODULE AND SEMICONDUCTOR FABRICATING SYSTEM INCLUDING THE SAME

    公开(公告)号:US20200260534A1

    公开(公告)日:2020-08-13

    申请号:US16656054

    申请日:2019-10-17

    Abstract: A heating module including: a plate including heating regions; heater coils disposed in the heating regions; a power source supplying an electric power to the heater coils; a switching circuit connected to the heater coils and the power source to control the electric power; temperature sensors disposed in the heating regions to sense temperatures of the heating regions; current sensors connected to the switching circuit and the heater coils to sense currents supplied to the heater coils; and a heating controller connected to the temperature sensors and the current sensors to measure temperatures of the heating regions. The heating controller is configured to detect the currents supplied to the heater coils and provides a maximum power to the heater coils regardless of a resistance difference of the heater coils, when a measured temperature is less than a predetermined temperature.

    SEMICONDUCTOR PROCESS APPARATUS
    3.
    发明申请

    公开(公告)号:US20250028257A1

    公开(公告)日:2025-01-23

    申请号:US18436744

    申请日:2024-02-08

    Abstract: A semiconductor process apparatus includes a light generator configured to output extreme ultraviolet (EUV) light having an EUV wavelength band, a mask stage configured to seat a mask reflecting the EUV light output from the light generator, a light-receiving optical unit including a plurality of mirrors generating output light by reflecting the EUV light reflected from the mask, at least one of the plurality of mirrors including a mirror body and a reflective layer attached to a surface of the mirror body, a power supply configured to apply a bias voltage to the reflective layer, and a substrate stage configured to seat a substrate to be irradiated with the output light.

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