公开(公告)号：US20140085834A1

公开(公告)日：2014-03-27

申请号：US14092054

申请日：2013-11-27

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Keishi KATO ,  Osamu TABATA ,  Yoshio OKAYAMA ,  Ryosuke USUI

IPC: H05K1/05

CPC classification number: H05K1/053 ,  H01L23/13 ,  H01L23/142 ,  H01L24/48 ,  H01L24/49 ,  H01L25/072 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/49113 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/1431 ,  H01L2924/1435 ,  H01L2924/1438 ,  H01L2924/19107 ,  H05K1/0203 ,  H05K1/0215 ,  H05K1/0216 ,  H05K2201/09972 ,  H05K2201/10166 ,  H05K2203/0315 ,  H05K2203/0323 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: In the upper surface of a metallic substrate, a region near the central part of the metallic substrate is surrounded by a rectangle having dotted sides electrically separate the interior and exterior of the rectangle. Each dot of the sides is formed of a pillared insulating resin that penetrates from the upper surface to the lower surface of the metallic substrate. Oxide films are so formed as to fill in the spaces between adjacent cylinders of insulating resins and the surrounding of the cylinders. That is, a separation layer is formed of the pillared insulating resins and the oxide films that fill up the spaces between the pillared insulating resins as well as their vicinities.

Abstract translation: 在金属基板的上表面，靠近金属基板的中心部分的区域由具有虚线的矩形围绕，矩形的内部和外部电气分离。 侧面的每个点由从金属基板的上表面到下表面贯穿的柱状绝缘树脂形成。 氧化膜被形成为填充绝缘树脂的相邻气缸和气缸周围之间的空间。 也就是说，分离层由柱状绝缘树脂和填充柱状绝缘树脂之间的空间及其附近的氧化物膜形成。

公开(公告)号：US20140077354A1

公开(公告)日：2014-03-20

申请号：US14092322

申请日：2013-11-27

Applicant: SANYO ELECTRIC CO., LTD.

Inventor： Tetsuya YAMAMOTO ,  Ryosuke USUI

IPC: H01L23/367

CPC classification number: H01L23/3675 ,  H01L25/16 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/13062 ,  H01L2924/13091 ,  H02M7/003 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A semiconductor module has a first substrate and a second substrate placed opposite to the first substrate. A first semiconductor element is provided such that the high-heat main face of the first semiconductor faces the second substrate and is thermally connected to the second substrate via a wiring layer. A second semiconductor element is provided such that the high-heat main face of the second semiconductor faces the first substrate and is thermally connected to the first substrate via another wiring layer. The emitter electrode of the first semiconductor element and the collector electrode of the second semiconductor element are electrically connected to each other via a heat spreader.

Abstract translation: 半导体模块具有与第一基板相对设置的第一基板和第二基板。 提供第一半导体元件，使得第一半导体的高热主面面向第二基板，并且经由布线层热连接到第二基板。 提供第二半导体元件，使得第二半导体的高热主面面向第一基板，并且经由另一布线层热连接到第一基板。 第一半导体元件的发射电极和第二半导体元件的集电极通过散热器彼此电连接。