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公开(公告)号：US20240038566A1
公开(公告)日：2024-02-01
申请号：US18088753
申请日：2022-12-26
Applicant: SEMES CO., LTD.
Inventor： Jong Gun LEE , Hyung Joon Kim
IPC: H01L21/683
CPC classification number: H01L21/6833
Abstract: A substrate processing apparatus is provided. The substrate processing apparatus includes: a chuck member; a ceramic puck disposed on the chuck member; a focus ring disposed to surround the ceramic puck; an insulating layer disposed below the focus ring to surround the chuck member; and two electrodes formed in the insulating layer, wherein a distance between the two electrodes is adjustable to form a variable capacitance.
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公开(公告)号：US11534859B2
公开(公告)日：2022-12-27
申请号：US17388356
申请日：2021-07-29
Applicant: SEMES Co., Ltd.
Inventor： Duk Hyun Son , Hyung Joon Kim
Abstract: A substrate treatment apparatus includes a transport part to transport a transparent rectangular substrate, a substrate support part to support the substrate, light generators to irradiate two different lights onto the moving substrate, and sense the irradiated lights, and a controller to determine a posture of the substrate with reference to the sensed lights and control the transport part such that the substrate is seated on the substrate support part in a default posture that is preset. The controller determines the posture of the transparent rectangular substrate with respect to the default posture using a time difference between a time point at which a first light of the two different lights is not transmitted through an edge of the transparent rectangular substrate and a time point at which a second light of the two different lights is not transmitted through the edge of the transparent rectangular substrate.
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公开(公告)号：US11139195B2
公开(公告)日：2021-10-05
申请号：US16043537
申请日：2018-07-24
Applicant: SEMES CO., LTD.
Inventor： Kang Rae Ha , Hyung Joon Kim
IPC: H01L21/687 , H01L21/67
Abstract: Provided is a substrate supporting unit. The substrate supporting unit includes a susceptor supporting the substrate and having a pin hole vertically formed therein, a lift pin provided to move up and down along the pin hole, a support plate supporting the lift pin, and a driving unit vertically moving the support plate. The lift pin has a first magnetic substance formed at a lower end thereof. The support plate has a second magnetic substance provided thereon and having an opposite polarity to a polarity of the first magnetic substance.
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公开(公告)号：US20150114565A1
公开(公告)日：2015-04-30
申请号：US14528120
申请日：2014-10-30
Applicant: SEMES CO., LTD.
Inventor： Hyung Joon Kim , Seung Kue Kim
IPC: H01J37/32
Abstract: Provided is an apparatus for treating a substrate which is capable of uniformly controlling a temperature of a support plate. The apparatus for treating the substrate includes a chamber having a treating space with an opened top surface, a support unit disposed within the chamber to support the substrate, a dielectric assembly disposed on the opened top surface of the chamber to cover the opened top surface, and a plasma source disposed above the dielectric assembly, the plasma source including an antenna generating plasma from a gas supplied into the chamber. The dielectric assembly includes a dielectric window, and heating units each of which is formed of a non-metallic material, the heating units being disposed on a top surface of the dielectric window to heat the dielectric window.
Abstract translation: 提供一种能够均匀地控制支撑板的温度的基板的处理装置。 用于处理衬底的设备包括具有开放的顶表面的处理空间的腔室，设置在室内以支撑衬底的支撑单元，设置在腔室的敞开的顶表面上以覆盖敞开的顶表面的电介质组件， 以及设置在电介质组件上方的等离子体源，等离子体源包括从供应到腔室中的气体产生等离子体的天线。 电介质组件包括电介质窗和各自由非金属材料形成的加热单元，加热单元设置在电介质窗口的顶表面上以加热电介质窗口。
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公开(公告)号：US12170191B2
公开(公告)日：2024-12-17
申请号：US18078958
申请日：2022-12-11
Applicant: SEMES CO., LTD.
Inventor： Jong Gun Lee , So Hyung Jiong , Hyung Joon Kim
IPC: H01J37/32 , H01L21/683
Abstract: Provided is a substrate supporting apparatus with improved durability. The substrate supporting apparatus includes a body configured to support a substrate and formed of a dielectric substance; a heat transfer medium supply hole installed to penetrate the body; a first electrostatic electrode disposed in the body; and a second electrostatic electrode disposed in the body, located on the first electrostatic electrode, and electrically connected to the first electrostatic electrode.
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Patent Agency Ranking
公开(公告)号：US11251066B2
公开(公告)日：2022-02-15
申请号：US16411195
申请日：2019-05-14
Applicant: SEMES CO., LTD.
Inventor： Hyung Joon Kim
IPC: H01L21/687 , H01J37/32 , H01L21/683 , H01J37/20 , H01L21/3065
Abstract: The substrate processing apparatus includes a processing unit and a transfer unit that transfers a substrate into the processing unit. The processing unit includes a support unit that supports the substrate in the process chamber. The support unit includes a support on which the substrate is placed and an edge ring that surrounds the substrate placed on the support and that is detachable from the support. The transfer unit includes a hand having a top side on which the substrate is placed and a fixing member that is provided in the hand and that fixes the edge ring to a bottom side of the hand with an electrostatic force. The fixing member includes a first electrode and second electrode, and the transfer unit further includes a voltage applying device that applies voltages of different polarities to the first electrode and the second electrode.
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公开(公告)号：US10763138B2
公开(公告)日：2020-09-01
申请号：US13873333
申请日：2013-04-30
Applicant: SEMES CO., LTD.
Inventor： Hyung Joon Kim
Abstract: Provided is a substrate treating apparatus using a process gas and an adjustment plate used thereof. A substrate treating apparatus including a chamber providing a space in which a process is performed, a support member supporting a substrate in the chamber, a gas supply member supplying a process gas onto the substrate disposed on the support member, and an exhaust assembly coupled to the chamber to exhaust a gas in the chamber, wherein the exhaust assembly includes an exhaust pipe connected to the chamber, an exhaust member connected to the exhaust pipe to provide a vacuum pressure in the exhaust pipe, a valve adjusting an opening rate of the exhaust pipe, and an adjustment plate having a cover plate which is provided in the chamber to interfere with a flow of the process gas in an internal region of the chamber in a direction corresponding to, when the exhaust pipe is partially opened, an opened region of the exhaust pipe. Consequently, the process gas may be uniformly supplied onto the substrate.
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公开(公告)号：US20230140253A1
公开(公告)日：2023-05-04
申请号：US18050711
申请日：2022-10-28
Applicant: Semes Co., Ltd.
Inventor： Ji Hun Kim , Hyung Joon Kim
IPC: H01J37/32
Abstract: The inventive concept provides a substrate treating apparatus. The substrate treating apparatus includes a housing having a treating space for treating a substrate; a support unit configured to support the substrate at the treating space; and a plasma source for generating a plasma from a process gas supplied into the treating space; an exhaust line connecting to the housing and exhausting an atmosphere of the treating space; and a pressure adjusting unit positioned between the support unit and the exhaust line and configured to adjust an exhaust pressure exhausted from the exhaust line, and wherein the pressure adjusting unit includes: an opening/closing member for opening and closing the exhaust line; a lifting/lowering member for moving the opening/closing member in an up/down direction; and an elastic member for providing a restoring force to the lifting/lowering member.
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公开(公告)号：US11062885B2
公开(公告)日：2021-07-13
申请号：US15967736
申请日：2018-05-01
Applicant: SEMES CO., LTD.
Inventor： Jinwoo Sim , Hyung Joon Kim
IPC: H01J37/32
Abstract: An apparatus for treating a substrate comprises a chamber having a treatment space for treating the substrate; a supporting unit which supports the substrate, inside the treatment space; a gas supplying unit which supplies process gas into the treatment space; and a plasma source which generates plasma based on the process gas inside the treatment space. The supporting unit comprises a supporting plate on which the substrate is placed; a focus ring which is disposed to surround the substrate supported by the supporting plate; a temperature control unit which adjusts a temperature of the focus ring. The temperature control unit may include a first heater which is disposed to heat the focus ring under the focus ring and to be opposite to the focus ring; and a cooling member which is provided under the first heater.
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公开(公告)号：US11049737B2
公开(公告)日：2021-06-29
申请号：US16166614
申请日：2018-10-22
Applicant: SEMES CO., LTD.
Inventor： Jinwoo Sim , Hyung Joon Kim
Abstract: Disclosed is An apparatus for treating a substrate includes a chamber having a treatment space provided therein to treat the substrate and having an entrance for introducing or withdrawing the substrate, a liner disposed in the treatment space, disposed adjacent to an inner sidewall of the chamber, and having an opening formed at a position of facing the entrance to introduce or withdraw the substrate, a supporting unit to support the substrate in the treatment space, a gas supplying unit to supply process gas to the treatment space, a plasma source to produce plasma from the process gas, and a door assembly to open or close the entrance. The door assembly includes a door which includes a door unit provided outside the chamber to be movable between an opening position to open the entrance and a closing position to close the entrance, and an insertion unit extending from the door unit toward the treatment space and inserted into the opening of the liner at the closing position, and a door driving unit to drive the door.
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