Setting method for substrate processing apparatus

    公开(公告)号:US11527423B2

    公开(公告)日:2022-12-13

    申请号:US17501569

    申请日:2021-10-14

    Abstract: A method for setting a substrate processing apparatus having a head for dispensing ink includes aligning a position of at least one vision unit, by moving the vision unit above a reference mark and taking, by the vision unit, an image of the reference mark, in which the vision unit takes an image of a substrate, and the reference mark is made on the substrate processing apparatus and fixed in one position, and aligning at least one of a movement axis of the vision unit, a position of the substrate, or a movement axis of the substrate, by moving the vision unit or the substrate in a state in which the substrate having alignment marks made thereon is located under the vision unit and taking, by the vision unit, an image of the alignment marks.

    Apparatus for distributing load and system for treating substrate with the apparatus

    公开(公告)号:US11518169B2

    公开(公告)日:2022-12-06

    申请号:US17237175

    申请日:2021-04-22

    Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.

    APPARATUS FOR DISTRIBUTING LOAD AND SYSTEM FOR TREATING SUBSTRATE WITH THE APPARATUS

    公开(公告)号:US20210331466A1

    公开(公告)日:2021-10-28

    申请号:US17237175

    申请日:2021-04-22

    Abstract: Provided are a load distribution apparatus capable of efficiently distributing loads for a plurality of inkjet head modules and a substrate treatment system including the same. The load distribution apparatus includes a second support formed to be elongated in one direction and having both side portions higher than a central portion and in which a head module for discharging droplets onto a substrate is installed in the central portion, a first support supporting the second support on at least one side and supporting the second support below the second support, a first support unit supporting the second support on at least one side and supporting the second support above the second support, and a plate installed above the first support unit and connected to the first support unit, wherein a load of the head module is distributed by the first support and the first support unit.

Patent Agency Ranking