公开(公告)号：US20240222171A1

公开(公告)日：2024-07-04

申请号：US18542665

申请日：2023-12-16

Applicant: SEMES CO., LTD.

Inventor： Young Eun JEON ,  Yun Sang KIM ,  Min Sung JEON ,  Tae Hwan LEE ,  Sung Min CHOI ,  Jin Hee HONG ,  Dong Young JANG ,  Young Jo JIN

IPC: H01L21/67 ,  H01J37/32

CPC classification number: H01L21/67276 ,  H01J37/3244 ,  H01J37/32495 ,  H01L21/67098 ,  H01L21/67213 ,  H01J2237/002 ,  H01J2237/334

Abstract: Proposed are a substrate treatment system and a substrate treatment method. More particularly, a technology capable of realizing a fine etching adjustment and capable of increasing a Unit Per Equipment Hour (UPEH) by reducing time required for a process is provided.

公开(公告)号：US20240213001A1

公开(公告)日：2024-06-27

申请号：US18542776

申请日：2023-12-18

Applicant: SEMES CO., LTD.

Inventor： Young Jo JIN ,  Sang Jeong LEE ,  Min Sung JEON ,  Tae Hwan LEE ,  Min Hee HONG

IPC: H01J37/32 ,  H01L21/3065 ,  H01L21/687

CPC classification number: H01J37/32724 ,  H01J37/32522 ,  H01L21/30655 ,  H01L21/68742 ,  H01J2237/3341

Abstract: Proposed are a substrate treatment method and a substrate treatment apparatus that are capable of adjusting cooling efficiency for a substrate. According to an embodiment of the present disclosure, there may be provided the substrate treatment method including a heating process in which a surface of the substrate is heated and a cooling process in which the substrate is cooled by supplying a cooling gas to a lower surface of the substrate. Furthermore, the cooling process includes a cooling condition controlling process in which a cooling condition is controlled.