公开(公告)号：US20240177975A1

公开(公告)日：2024-05-30

申请号：US18372954

申请日：2023-09-26

Applicant: SEMES CO., LTD.

Inventor： Yong Jun BAE ,  Seung Pyo LEE ,  Dong Jun PARK ,  Chang Eon PARK ,  Su Won KIM ,  Dho Young KIM

IPC: H01J37/32 ,  F28F3/12

CPC classification number: H01J37/32522 ,  F28F3/12 ,  H01J37/32091 ,  H01J37/3244 ,  H01J37/32513 ,  H01J2237/002

Abstract: A cooling plate and a plasma processing chamber are proposed. The cooling plate is configured to allow air to flow throughout the entire region of a window while reducing a region of covering the window. The cooling plate is configured to cool a window configured to seal a plasma processing space at an upper portion, and the cooling plate includes a body having a circular plate shape covering a part of a center region of the window, an inlet through which a gas is introduced into the body, and an outlet through which the gas is discharged from the body to the window. A flow path through which the gas flows and a slope formed from the flow path toward the window are formed between the inlet and the outlet.

公开(公告)号：US20250105052A1

公开(公告)日：2025-03-27

申请号：US18829452

申请日：2024-09-10

Applicant: SEMES CO., LTD.

Inventor： Yong Jun BAE ,  Shant ARAKELYAN ,  Jun Seok PARK ,  Asatur KHURSHUDYAN ,  Ja Myung GU

IPC: H01L21/687 ,  H01J37/32

Abstract: A substrate support unit including a Q-pad capable of minimizing fastening pressure variations that may be caused by heat and a substrate treating apparatus including the substrate support unit are provided. The substrate treating apparatus includes: a chamber housing; a substrate support unit supporting a substrate within the chamber housing; a showerhead unit providing a process gas into the chamber housing; and a plasma generation unit generating plasma for treating the substrate within the chamber housing using the process gas, wherein the substrate support unit includes a base plate, a dielectric layer, which is disposed on the base plate, and a thermal transfer pad, which is disposed between the base plate and the dielectric layer and bonds the base plate and the dielectric layer together, and the thermal transfer pad includes a plurality of corrugated patterns.

公开(公告)号：US20250105044A1

公开(公告)日：2025-03-27

申请号：US18650955

申请日：2024-04-30

Applicant: SEMES CO., LTD.

Inventor： Yong Jun BAE ,  ASATUR KHURSHUDYAN ,  Jun Seok PARK ,  SHANT ARAKEL YAN ,  Ja Myung GU

IPC: H01L21/683 ,  H01J37/32

Abstract: Proposed are an electrostatic chuck, a plasma processing method, and a plasma processing apparatus for preventing abrupt temperature changes in a substrate and maintain a constant temperature. The electrostatic chuck that supports a substrate in the plasma processing apparatus includes a puck on which a substrate for plasma processing is seated and having a heater, and a base plate located below the puck and having a cooling passage through which fluid for cooling flows. A temperature maintenance layer composed of a phase change material is provided inside the base plate.

公开(公告)号：US20250101590A1

公开(公告)日：2025-03-27

申请号：US18800442

申请日：2024-08-12

Applicant: SEMES CO., LTD.

Inventor： Jun Seok PARK ,  Yong Jun BAE ,  Ja Myung GU ,  Asatur KHURSHUDYAN ,  Shant ARAKELYAN

IPC: C23C16/458 ,  C23C16/455

Abstract: Provided is a substrate processing apparatus. The substrate processing apparatus of the present invention comprises a support unit provided in a processing space for processing a substrate and for supporting the substrate, wherein the support unit comprises a puck having a first thermal conductivity and having a concave groove formed thereon; and a block provided in the concave groove and having a second thermal conductivity different from the first thermal conductivity.