公开(公告)号：US11508704B2

公开(公告)日：2022-11-22

申请号：US17121651

申请日：2020-12-14

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Ik Kyu You ,  Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.

公开(公告)号：US20210183828A1

公开(公告)日：2021-06-17

申请号：US17121651

申请日：2020-12-14

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Ik Kyu You ,  Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.

公开(公告)号：US11848398B2

公开(公告)日：2023-12-19

申请号：US17133657

申请日：2020-12-24

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu You

IPC: H01L33/00 ,  H01L25/075 ,  H01L33/62 ,  H01L21/66

CPC classification number: H01L33/005 ,  H01L22/12 ,  H01L25/0753 ,  H01L33/62 ,  H01L2933/0066

Abstract: A flat bonding method of light emitting devices including bonding light emitting devices on a circuit board using a reflow process, and re-bonding at least a portion of the light emitting devices bonded on the circuit board using a press plate while pressing the portion of the light emitting devices.

公开(公告)号：US11521887B2

公开(公告)日：2022-12-06

申请号：US17122995

申请日：2020-12-15

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu You ,  Jung Jae Lee

IPC: H01L21/683 ,  H01L25/075 ,  H01L33/62

Abstract: A method of transferring a plurality of micro LEDs formed on a substrate including transferring the micro LEDs onto a first carrier substrate having a first adhesive material layer, reducing an adhesiveness of the first adhesive material layer by curing the first adhesive material layer, transferring the micro LEDs from the first carrier substrate onto a second carrier substrate having a second adhesive material layer, bonding at least a portion of the micro LEDs on the second carrier substrate to pads of a circuit board using a metal bonding layer, and separating the second carrier substrate from the micro LEDs bonded onto the circuit board.

公开(公告)号：US12218293B2

公开(公告)日：2025-02-04

申请号：US17666202

申请日：2022-02-07

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Junhong Min ,  Ik Kyu You

IPC: H01L33/58 ,  H01L25/075

Abstract: A pixel module includes a circuit board, a plurality of unit pixels arranged on the circuit board, and a molding member covering the plurality of unit pixels. The molding member includes a light diffusion layer and a black molding layer covering the light diffusion layer.

公开(公告)号：US11901497B2

公开(公告)日：2024-02-13

申请号：US17131618

申请日：2020-12-22

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Ik Kyu You ,  Jung Jae Lee

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753

Abstract: A display panel including a circuit board including first pads, first light emitting devices disposed on the circuit board and including pads, at least one second light emitting device disposed on the circuit board and including pads, metal bonding layers disposed between the pads of the first light emitting devices and the first pads on the circuit board, and a conductive material layer electrically connecting the pads of the second light emitting device to the first pads on the circuit board, in which the conductive material layer includes a conductive portion and a non-conductive portion.

公开(公告)号：US11749652B2

公开(公告)日：2023-09-05

申请号：US17990735

申请日：2022-11-20

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Ik Kyu You ,  Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

CPC classification number: H01L25/0753 ,  H01L24/16 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/16505

Abstract: A display panel including a circuit board having first pads, light emitting devices disposed on the circuit board and having second pads and including at least one first light emitting device to emit light having a first peak wavelength and second light emitting devices to emit light having a second peak wavelength, and a metal bonding layer electrically connecting the first pads and the second pads, in which the metal bonding layer of the first light emitting device has a thickness different from that of the metal bonding layer of the second light emitting devices while including a same material, and an upper surface of the second light devices are disposed at an elevation between an upper surface and a bottom surface of the first light emitting device.