公开(公告)号：US12176378B2

公开(公告)日：2024-12-24

申请号：US16943373

申请日：2020-07-30

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Seom Geun Lee ,  Seong Kyu Jang

IPC: H01L27/15

Abstract: A display panel including a circuit board having pads thereon, and a plurality of pixel regions arranged on the circuit board, each of the pixel regions including a first LED stack disposed on the circuit board, a first bonding layer disposed between the first LED stack and the circuit board, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board.

公开(公告)号：US11508704B2

公开(公告)日：2022-11-22

申请号：US17121651

申请日：2020-12-14

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Ik Kyu You ,  Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.

公开(公告)号：US11482566B2

公开(公告)日：2022-10-25

申请号：US16940394

申请日：2020-07-28

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon Chae ,  Seom Geun Lee ,  Seong Kyu Jang

IPC: H01L27/15 ,  H01L25/075 ,  H01L33/22 ,  H01L33/42 ,  H01L33/60 ,  H01L33/62 ,  H01L33/00

Abstract: A light emitting device for a display including a first LED stack configured to generate light having a first peak wavelength, a second LED stack disposed under the first LED stack, and configured to generate light having a second peak wavelength, a third LED stack disposed under the second LED stack, and configured to generate light having a third peak wavelength, and a floating reflection layer disposed over the first LED stack, and configured to reflect light having the first peak wavelength, in which the first peak wavelength is longer than the second and third peak wavelengths.

公开(公告)号：US11424224B2

公开(公告)日：2022-08-23

申请号：US16855258

申请日：2020-04-22

Applicant: Seoul Viosys Co., Ltd

Inventor： Seong Kyu Jang ,  Seom Geun Lee ,  Chan Seob Shin ,  Ho Joon Lee

IPC: H01L25/075 ,  H01L33/58 ,  H01L33/00 ,  H01L33/62

Abstract: A display panel including a circuit board having pads, light emitting devices electrically connected to the pads and arranged on the circuit board, each light emitting device having a first surface facing the circuit board, and a buffer material layer disposed between the circuit board and the light emitting devices to fill a space between the circuit board and the light emitting devices, in which the buffer material layer is disposed under the first surfaces of the light emitting devices.

公开(公告)号：US20210183828A1

公开(公告)日：2021-06-17

申请号：US17121651

申请日：2020-12-14

Applicant: Seoul Viosys Co., Ltd.

Inventor： Jong Hyeon Chae ,  Ik Kyu You ,  Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu

IPC: H01L25/075 ,  H01L33/62 ,  H01L23/00

Abstract: A display panel including a circuit board having first pads, a plurality of light emitting devices disposed on the circuit board and having second pads, at least one of the light emitting devices including a repaired light emitting device, and a metal bonding layer bonding the first pads and the second pads, in which the metal bonding layer of the repaired light emitting device has at least one of a thickness and a composition different from that of the metal bonding layer of the remaining light emitting devices.

公开(公告)号：US20210043678A1

公开(公告)日：2021-02-11

申请号：US16943373

申请日：2020-07-30

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Jong Hyeon CHAE ,  Seom Geun Lee ,  Seong Kyu Jang

IPC: H01L27/15

Abstract: A display panel including a circuit board having pads thereon, and a plurality of pixel regions arranged on the circuit board, each of the pixel regions including a first LED stack disposed on the circuit board, a first bonding layer disposed between the first LED stack and the circuit board, a second LED stack disposed on the first LED stack, a third LED stack disposed on the second LED stack, first through-vias passing through the first LED stack and the first bonding layer, second through-vias passing through the second LED stack, and third through-vias passing through the third LED stack, in which the first through-vias pass through the first LED stack and the first bonding layer, and are connected to the pads of the circuit board.

公开(公告)号：US20180240793A1

公开(公告)日：2018-08-23

申请号：US15894810

申请日：2018-02-12

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun Lee ,  Yeo Jin Yoon ,  Jae Kwon Kim ,  So Ra Lee ,  Myoung Hak Yang

IPC: H01L27/02 ,  H01L25/16

CPC classification number: H01L27/0255 ,  H01L25/167 ,  H01L27/15 ,  H01L33/06 ,  H01L33/32 ,  H01L33/405 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Disclosed herein is a light emitting diode chip having ESD protection. An exemplary embodiment provides a flip-chip type light emitting diode chip, which includes a light emitting diode part aligned on a substrate, and a reverse-parallel diode part disposed on the substrate and connected to the light emitting diode part. Within the flip-chip type light emitting diode chip, the light emitting diode part is placed together with reverse-parallel diode part, thereby providing a light emitting diode chip exhibiting strong resistance to electrostatic discharge.

公开(公告)号：US20150243706A1

公开(公告)日：2015-08-27

申请号：US14631062

申请日：2015-02-25

Applicant: Seoul Viosys Co., Ltd.

Inventor： Se Hee Oh ,  Seom Geun Lee ,  Yeo Jin Yoon ,  Hyun Haeng Lee ,  Mae Yi Kim

IPC: H01L27/15 ,  H01L33/14 ,  H01L33/44 ,  H01L33/10 ,  H01L33/62 ,  H01L33/42

CPC classification number: H01L27/15 ,  H01L33/20 ,  H01L33/38 ,  H01L33/62 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: An exemplary light emitting diode includes a substrate; a first light emitting cell and a second light emitting cell disposed over the substrate and separated from each other; and an interconnection electrically connecting the first light emitting cell to the second light emitting cell. Each of the first and second light emitting cells includes a first conductive-type semiconductor layer, a second conductive-type semiconductor layer disposed over the first conductive-type semiconductor layer, and an active layer disposed between the first conductive-type semiconductor layer and the second conductive-type semiconductor layer. At least one of the first light emitting cell and the second light emitting cell includes a side surface inclined with respect to the substrate. The side surface includes a first inclined portion forming an acute angle with respect to the substrate, a second inclined portion forming an obtuse angle with respect to the substrate, and an inclination discontinuity section.

Abstract translation: 示例性的发光二极管包括基板; 第一发光单元和设置在基板上并彼此分离的第二发光单元; 以及将第一发光单元电连接到第二发光单元的互连。 第一和第二发光单元中的每一个包括第一导电型半导体层，设置在第一导电型半导体层上的第二导电型半导体层以及设置在第一导电型半导体层和第二导电类型半导体层之间的有源层 第二导电型半导体层。 第一发光单元和第二发光单元中的至少一个包括相对于基板倾斜的侧表面。 侧面包括相对于基板形成锐角的第一倾斜部分，相对于基板形成钝角的第二倾斜部分和倾斜不连续部分。

公开(公告)号：US12002912B2

公开(公告)日：2024-06-04

申请号：US17381744

申请日：2021-07-21

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun Lee ,  Seong Kyu Jang ,  Yong Woo Ryu

IPC: H01L33/62 ,  H01L25/075 ,  H01L27/15

CPC classification number: H01L33/62 ,  H01L25/0756 ,  H01L27/156

Abstract: A stacked light emitting device includes a first LED stack, a second LED stack disposed under the first LED stack, a third LED stack disposed under the second LED stack, a third-1 connector and a third-2 connector disposed between the second LED stack and the third LED stack, and a plurality of pads disposed over the first LED stack, and electrically connected to the first, second, and third LED stacks. Each of the first, second, and third LED stacks has a light generation region and a peripheral region disposed around the light generation region.

公开(公告)号：US11296258B2

公开(公告)日：2022-04-05

申请号：US16705770

申请日：2019-12-06

Applicant: SEOUL VIOSYS CO., LTD.

Inventor： Seom Geun Lee ,  Chan Seob Shin ,  Myeong Hak Yang ,  Jin Woong Lee

IPC: H01L33/40 ,  H01L25/075 ,  H01L33/62

Abstract: A light emitting diode includes a first conductivity type semiconductor layer and a mesa disposed on the first conductivity type semiconductor layer wherein the mesa is a semiconductor stack including an active layer and a second conductivity type semiconductor layer; a ZnO layer disposed on the second conductivity type semiconductor layer; a lower insulation layer covering the ZnO layer and the mesa, and including an opening exposing the ZnO layer; a first pad metal layer disposed on the lower insulation layer, and electrically connected to the first conductivity type semiconductor layer; a second pad metal layer electrically connected to the ZnO layer through the opening of the lower insulation layer, and an upper insulation layer covering the first pad metal layer and the second pad metal layer.