公开(公告)号：US09964358B2

公开(公告)日：2018-05-08

申请号：US15141946

申请日：2016-04-29

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun Matsushita ,  Takashi Miyamoto ,  Konosuke Hayashi ,  Osamu Yamazaki

IPC: F26B3/30 ,  H01L21/67

CPC classification number: F26B3/30 ,  F26B5/08 ,  H01L21/67115

Abstract: The substrate processing unit 1 comprises the rotating table 31 configured to hold substrate W, the processing chamber 37 which accommodates the rotating table 31, a lamp 61 is provided above the processing chamber 37 and configured to heat the surface of substrate W, the lamp chamber 60 which accommodates that lamp 61, a transmission window 62 disposed below the lamp chamber 60, and a plurality of nozzle 64 which supply cooling fluid G to the transmission window 62. Then the substrate processing unit 1 can suppress generating of a water mark or pattern collapse, and can perform good substrate processing.

公开(公告)号：US10406566B2

公开(公告)日：2019-09-10

申请号：US15608554

申请日：2017-05-30

Applicant: SHIBAURA MECHATRONICS CORPORATION

Inventor： Jun Matsushita ,  Yuji Nagashima ,  Konosuke Hayashi ,  Kunihiro Miyazaki

IPC: B08B3/08 ,  H01L21/67 ,  B08B3/02

Abstract: A substrate processing device 10 has a water removing unit 110 and, when a solvent supply unit 58 supplies a volatile solvent to a surface of a substrate W, the water removing unit 110 supplies a water removing agent to the surface of the substrate W to promote replacement of the cleaning water on the surface of the substrate W with the volatile solvent.