公开(公告)号：US20080138917A1

公开(公告)日：2008-06-12

申请号：US11978004

申请日：2007-10-26

Applicant: STEVEN VERHAVERBEKE ,  J KELLY TRUMAN ,  CHRISTOPHER T. LANE ,  SASSON R. SOMEKH

Inventor： STEVEN VERHAVERBEKE ,  J KELLY TRUMAN ,  CHRISTOPHER T. LANE ,  SASSON R. SOMEKH

IPC: H01L21/66

CPC classification number: H01L21/67207 ,  G03F7/16 ,  H01L21/67115 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67184 ,  H01L21/6719 ,  Y10S414/135 ,  Y10S414/141 ,  Y10S438/905

Abstract: A method of a single wafer wet/dry cleaning apparatus comprising: a transfer chamber having a wafer handler contained therein; a first single wafer wet cleaning chamber directly coupled to the transfer chamber; and a first single wafer ashing chamber directly coupled to the transfer chamber.

公开(公告)号：US20090111277A1

公开(公告)日：2009-04-30

申请号：US11927266

申请日：2007-10-29

Applicant: STEVEN VERHAVERBEKE

Inventor： STEVEN VERHAVERBEKE

IPC: H01L21/302

CPC classification number: H01L21/31133 ,  G03F7/423 ,  G03F7/426

Abstract: Methods for stripping a photoresist from a substrate and for fabricating wafer bumps are provided herein. In some embodiments, a method of stripping a photoresist from a substrate includes providing a substrate having a patterned photoresist deposited thereon; and stripping the photoresist from the substrate using a stripping solution comprising ozone in a solvent, wherein the solvent comprises acetic anhydride. In some embodiments, a method of stripping a photoresist from a wafer in a wafer bump formation process includes forming a plurality of wafer bumps on a wafer through a patterned photoresist layer; and stripping the photoresist layer using a stripping solution comprising ozone in a solvent, wherein the solvent comprises acetic anhydride.

Abstract translation: 本文提供了从基板剥离光致抗蚀剂和制造晶片凸块的方法。 在一些实施例中，从衬底剥离光致抗蚀剂的方法包括提供其上沉积有图案化光致抗蚀剂的衬底; 以及使用在溶剂中包含臭氧的剥离溶液从基底剥离光致抗蚀剂，其中所述溶剂包括乙酸酐。 在一些实施例中，在晶片凸块形成工艺中从晶片剥离光致抗蚀剂的方法包括通过图案化的光致抗蚀剂层在晶片上形成多个晶片凸块; 以及使用在溶剂中包含臭氧的剥离溶液剥离光致抗蚀剂层，其中溶剂包括乙酸酐。

公开(公告)号：US20100098873A1

公开(公告)日：2010-04-22

申请号：US12255833

申请日：2008-10-22

Applicant: STEVEN VERHAVERBEKE ,  Omkaram Nalamasu ,  Majeed Foad ,  Mahalingam Venkatesan ,  Nety M. Krishna

Inventor： STEVEN VERHAVERBEKE ,  Omkaram Nalamasu ,  Majeed Foad ,  Mahalingam Venkatesan ,  Nety M. Krishna

IPC: C23C14/48

CPC classification number: G11B5/84 ,  C23C14/185 ,  C23C14/48 ,  C23C14/5826 ,  C23C14/5833 ,  G11B5/855 ,  H01J2237/3365

Abstract: A method for patterning a magnetic thin film on a substrate includes: providing a pattern about the magnetic thin film, with selective regions of the pattern permitting penetration of energized ions of one or more elements. Energized ions are generated with sufficient energy to penetrate selective regions and a portion of the magnetic thin film adjacent the selective regions. The substrate is placed to receive the energized ions. The portions of the magnetic thin film are rendered to exhibit a magnetic property different than selective other portions. A method for patterning a magnetic media with a magnetic thin film on both sides of the media is also disclosed.

Abstract translation: 用于在衬底上图案化磁性薄膜的方法包括：提供围绕磁性薄膜的图案，该图案的选择区域允许一个或多个元件的激发离子的穿透。 通过足够的能量产生通电的离子以穿透选择区域和一部分与选择区域相邻的磁性薄膜。 放置基板以接收通电离子。 使磁性薄膜的部分呈现与选择性其他部分不同的磁性。 还公开了在介质两侧用磁性薄膜图案化磁性介质的方法。

公开(公告)号：US20090111259A1

公开(公告)日：2009-04-30

申请号：US12037248

申请日：2008-02-26

Applicant: STEVEN VERHAVERBEKE

Inventor： STEVEN VERHAVERBEKE

IPC: H01L21/44

CPC classification number: H01L24/11 ,  H01L2224/05001 ,  H01L2224/05022 ,  H01L2224/05124 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05572 ,  H01L2224/05644 ,  H01L2224/05664 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/04941 ,  H01L2924/14 ,  H01L2924/00014

Abstract: Methods for forming connective elements on integrated circuits for packaging applications are provided herein. In some embodiments, a method of forming connective elements on an integrated circuit for flipchip packaging may include providing a resist layer on the integrated circuit; forming a plurality of holes through the resist layer; filling the plurality of holes with conductive material; and stripping at least a portion of the resist layer using a stripping solution containing acetic anhydride and ozone to expose the connective elements.

Abstract translation: 本文提供了用于在包装应用的集成电路上形成连接元件的方法。 在一些实施例中，在用于倒装芯片封装的集成电路上形成连接元件的方法可以包括在集成电路上提供抗蚀剂层; 通过所述抗蚀剂层形成多个孔; 用导电材料填充多个孔; 以及使用含有乙酸酐和臭氧的剥离溶液剥离至少一部分抗蚀剂层以暴露连接元件。

公开(公告)号：US20090020144A1

公开(公告)日：2009-01-22

申请号：US12233504

申请日：2008-09-18

Applicant: STEVEN VERHAVERBEKE ,  J. Kelly Truman ,  Alexander Ko ,  Rick R. Endo

Inventor： STEVEN VERHAVERBEKE ,  J. Kelly Truman ,  Alexander Ko ,  Rick R. Endo

IPC: B08B13/00

CPC classification number: H01L21/67051 ,  B08B3/02 ,  B08B3/12 ,  B08B2203/0288 ,  Y10S134/902

Abstract: An apparatus for wet processing individual substrates comprising; a means for holding the substrate; a means for providing acoustic energy to a non-device side of the substrate; and a means for flowing a fluid onto a device side of the substrate.

Abstract translation: 一种用于湿处理单个基底的装置，包括： 用于保持基板的装置; 用于向基板的非器件侧提供声能的装置; 以及用于将流体流动到衬底的器件侧的装置。