公开(公告)号：US20140291842A1

公开(公告)日：2014-10-02

申请号：US13853784

申请日：2013-03-29

Applicant: STMICROELECTRONICS, INC.

Inventor： Bernie Chrisanto ANG ,  Bryan Christian BACQUIAN

IPC: H01L23/498 ,  H01L21/56

CPC classification number: H01L23/49816 ,  H01L21/568 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49811 ,  H01L24/73 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/1403 ,  H01L2224/14181 ,  H01L2224/16145 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/48091 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73207 ,  H01L2224/73253 ,  H01L2224/73257 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L2225/06506 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/014 ,  H01L2924/00012 ,  H01L2924/00014

Abstract: A method of assembling a multi-chip electronic device into a thin electronic package entails inverting a flip-chip die arrangement over a hollow substrate, stacking additional dies on the hollow substrate to form a multi-chip electronic device, and encapsulating the multi-chip electronic device. Containment of the encapsulant can be achieved by joining split substrate portions, or by reinforcing a hollow unitary substrate, using a removable adhesive film. Use of the removable adhesive film facilitates surrounding the multi-chip electronic device with the encapsulant. The adhesive film can also prevent encapsulant from creeping around the substrate to an underside of the substrate that supports solder ball pads for subsequent attachment to a ball grid array (BGA) or a land grid array (LGA).

Abstract translation: 将多芯片电子器件组装成薄电子封装的方法需要在中空衬底上反转倒装芯片布置，在中空衬底上堆叠另外的管芯以形成多芯片电子器件，并且封装多芯片 电子设备。 密封剂的封闭可以通过使用可移除的粘合剂膜连接分离的衬底部分或通过加强中空的整体衬底来实现。 使用可移除的粘合膜有助于用密封剂围绕多芯片电子器件。 粘合剂膜还可以防止密封剂在衬底周围爬行到支撑焊球垫的衬底的下侧，用于随后附接到球栅阵列（BGA）或焊盘栅阵列（LGA）。