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公开(公告)号：US10775171B2
公开(公告)日：2020-09-15
申请号：US15956446
申请日：2018-04-18
Applicant: STMicroelectronics S.r.l.
Inventor： Gabriele Gattere , Luca Guerinoni , Luca Giuseppe Falorni , Damiano Milani , Francesco Braghin , Ferruccio Resta , Mohammad Izadi
IPC: G01C19/5712 , G01C19/574 , G01C19/5755
Abstract: A MEMS gyroscope is equipped with: at least a first mobile mass suspended from the top of a substrate by means of elastic suspension elements coupled to anchor points rigidly fixed to the substrate, in such a manner as to be actuated in an actuating movement along a first axis of a horizontal plane and to carry out a measurement movement along a vertical axis, transverse to the horizontal plane, in response to a first angular velocity acting about a second axis of the horizontal plane, transverse to the first axis. The elastic suspension elements are configured in such a manner as to internally compensate unwanted displacements out of the horizontal plane along the vertical axis originating from the actuating movement, such that the mobile mass remains in the horizontal plane during the actuating movement.
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Patent Agency Ranking
公开(公告)号：US10724909B2
公开(公告)日：2020-07-28
申请号：US15894770
申请日：2018-02-12
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Andrea Picco , Anna Angela Pomarico , Giuditta Roselli , Francesco Braghin
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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公开(公告)号：US20180372564A1
公开(公告)日：2018-12-27
申请号：US16019092
申请日：2018-06-26
Applicant: STMicroelectronics S.r.l.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Francesco Braghin
IPC: G01L1/18
Abstract: A microelectromechanical transducer includes a semiconductor body having first and second surfaces opposite to one another. A plurality of trenches extend in the semiconductor body from the first surface towards the second surface, including a first pair of trenches having a respective main direction of extension along a first axis, and a second pair of trenches having a respective main direction of extension along a second axis orthogonal to the first axis. A first piezoresistive sensor and a second piezoresistive sensor extend at the first surface of the semiconductor body respectively arranged between the first and second pair of trenches. The first piezoresistive sensor, the second piezoresistive sensor and the plurality of trenches form an active region. A first structural body is mechanically coupled to the first surface of the semiconductor body to form a first sealed cavity which encloses the active region.
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公开(公告)号：US11137299B2
公开(公告)日：2021-10-05
申请号：US16019092
申请日：2018-06-26
Applicant: STMicroelectronics S.r.l.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Francesco Braghin
Abstract: A microelectromechanical transducer includes a semiconductor body having first and second surfaces opposite to one another. A plurality of trenches extend in the semiconductor body from the first surface towards the second surface, including a first pair of trenches having a respective main direction of extension along a first axis, and a second pair of trenches having a respective main direction of extension along a second axis orthogonal to the first axis. A first piezoresistive sensor and a second piezoresistive sensor extend at the first surface of the semiconductor body respectively arranged between the first and second pair of trenches. The first piezoresistive sensor, the second piezoresistive sensor and the plurality of trenches form an active region. A first structural body is mechanically coupled to the first surface of the semiconductor body to form a first sealed cavity which encloses the active region.
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公开(公告)号：US11009412B2
公开(公告)日：2021-05-18
申请号：US16904123
申请日：2020-06-17
Applicant: STMICROELECTRONICS S.R.L.
Inventor： Mohammad Abbasi Gavarti , Daniele Caltabiano , Andrea Picco , Anna Angela Pomarico , Giuditta Roselli , Francesco Braghin
Abstract: A microelectromechanical force/pressure sensor has: a sensor die, of semiconductor material, having a front surface and a bottom surface, extending in a horizontal plane, and made of a compact bulk region having a thickness along a vertical direction, transverse to the horizontal plane; piezoresistive elements, integrated in the bulk region of the sensor die, at the front surface thereof; and a cap die, coupled above the sensor die, covering the piezoresistive elements, having a respective front surface and bottom surface, opposite to each other along the vertical direction, the bottom surface facing the front surface of the sensor die. A conversion layer is arranged between the front surface of the sensor die and the bottom surface of the cap die, patterned to define a groove traversing its entire thickness along the vertical direction; the piezoresistive elements are arranged vertically in correspondence to the groove and the conversion layer is designed to convert a load applied to the front surface of the cap die and/or bottom surface of the sensor die along the vertical direction into a planar stress distribution at the groove, acting in the horizontal plane.
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公开(公告)号：US20180306580A1
公开(公告)日：2018-10-25
申请号：US15956446
申请日：2018-04-18
Applicant: STMicroelectronics S.r.l.
Inventor： Gabriele Gattere , Luca Guerinoni , Luca Giuseppe Falorni , Damiano Milani , Francesco Braghin , Ferruccio Resta , Mohammad Izadi
IPC: G01C19/5712
CPC classification number: G01C19/5712 , B81B2201/0242 , G01C19/574 , G01C19/5755
Abstract: A MEMS gyroscope is equipped with: at least a first mobile mass suspended from the top of a substrate by means of elastic suspension elements coupled to anchor points rigidly fixed to the substrate, in such a manner as to be actuated in an actuating movement along a first axis of a horizontal plane and to carry out a measurement movement along a vertical axis, transverse to the horizontal plane, in response to a first angular velocity acting about a second axis of the horizontal plane, transverse to the first axis. The elastic suspension elements are configured in such a manner as to internally compensate unwanted displacements out of the horizontal plane along the vertical axis originating from the actuating movement, such that the mobile mass remains in the horizontal plane during the actuating movement.
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